NOVEL EPITAXIAL SEMICONDUCTOR MATERIAL REGIONS FOR TRANSISTOR DEVICES AND METHODS OF FORMING SAME

    公开(公告)号:US20210118993A1

    公开(公告)日:2021-04-22

    申请号:US16655429

    申请日:2019-10-17

    Abstract: One illustrative transistor device disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. In one embodiment, each of the first and second overall epitaxial cavities includes a substantially vertically oriented upper epitaxial cavity and a lower epitaxial cavity, wherein the substantially vertically oriented upper epitaxial cavity extends from an upper surface of the semiconductor substrate to the lower epitaxial cavity. A lateral width of the lower epitaxial cavity is greater than a lateral width of the upper epitaxial cavity. The device also includes epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities.

    Gate-all-around field effect transistors with robust inner spacers and methods

    公开(公告)号:US10903317B1

    公开(公告)日:2021-01-26

    申请号:US16534317

    申请日:2019-08-07

    Abstract: A gate-all-around field effect transistor (GAAFET) and method. The GAAFET includes nanosheets, a gate around center portions of the nanosheets, and inner spacers aligned below end portions. The nanosheet end portions are tapered from the source/drain regions to the gate and the inner spacers are tapered from the gate to the source/drain regions. Each inner spacer includes: a first spacer layer, which has a uniform thickness and extends laterally from the gate to an adjacent source/drain region; a second spacer layer, which fills the space between a planar top surface of the first spacer layer and a tapered end portion of the nanosheet above; and, for all but the lowermost inner spacers, a third spacer layer, which is the same material as the second spacer layer and which fills the space between a planar bottom surface of the first spacer layer and a tapered end portion of the nanosheet below.

    Epitaxial semiconductor material regions for transistor devices and methods of forming same

    公开(公告)号:US11362177B2

    公开(公告)日:2022-06-14

    申请号:US16774157

    申请日:2020-01-28

    Abstract: One illustrative transistor of a first dopant type disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. The device also includes a counter-doped epitaxial semiconductor material positioned proximate a bottom of each of the first and second overall epitaxial cavities, wherein the counter-doped epitaxial semiconductor material is doped with a second dopant type that is opposite to the first dopant type, and a same-doped epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities above the counter-doped epitaxial semiconductor material, wherein the same-doped epitaxial semiconductor material is doped with a dopant of the first dopant type.

    Epitaxial semiconductor material regions for transistor devices and methods of forming same

    公开(公告)号:US11205699B2

    公开(公告)日:2021-12-21

    申请号:US16655429

    申请日:2019-10-17

    Abstract: One illustrative transistor device disclosed herein includes a gate structure positioned above a semiconductor substrate and first and second overall epitaxial cavities formed in the semiconductor substrate on opposite sides of the gate structure. In one embodiment, each of the first and second overall epitaxial cavities includes a substantially vertically oriented upper epitaxial cavity and a lower epitaxial cavity, wherein the substantially vertically oriented upper epitaxial cavity extends from an upper surface of the semiconductor substrate to the lower epitaxial cavity. A lateral width of the lower epitaxial cavity is greater than a lateral width of the upper epitaxial cavity. The device also includes epitaxial semiconductor material positioned in each of the first and second overall epitaxial cavities.

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