ENLARGED WAVEGUIDE FOR PHOTONIC INTEGRATED CIRCUIT WITHOUT IMPACTING INTERCONNECT LAYERS

    公开(公告)号:US20220128762A1

    公开(公告)日:2022-04-28

    申请号:US17082291

    申请日:2020-10-28

    Abstract: Structures and methods implement an enlarged waveguide. The structure may include a semiconductor-on-insulator (SOI) substrate including a semiconductor-on-insulator (SOI) layer over a buried insulator layer over a semiconductor substrate. An inter-level dielectric (ILD) layer is over the SOI substrate. A first waveguide has a lower surface extending at least partially into the buried insulator layer, which allows vertical enlargement of the waveguide, without increasing the thickness of the ILD layer or increasing the length of interconnects to other devices. The enlarged waveguide may include nitride, and can be implemented with other conventional silicon and nitride waveguides.

    STRUCTURE AND METHOD FOR RANDOM CODE GENERATION

    公开(公告)号:US20210141610A1

    公开(公告)日:2021-05-13

    申请号:US16677717

    申请日:2019-11-08

    Abstract: Disclosed is a structure for implementing a Physically Unclonable Function (PUF)-based random number generator and a method for forming the structure. The structure includes same-type, same-design devices in a semiconductor layer. While values of a performance parameter exhibited by some devices (i.e., first devices) are within a range established based on the design, values of the same performance parameter exhibited by other devices (i.e., second devices) is outside that range. A random distribution of the first and second devices is achieved by including randomly patterned dopant implant regions in the semiconductor layer. Each first device is separated from the dopant implant regions such that its performance parameter value is within the range and each second device has a junction with dopant implant region(s) such that its performance parameter value is outside the range or vice versa. A random number generator can be operably connected to the devices to generate a PUF-based random number.

    Enlarged waveguide for photonic integrated circuit without impacting interconnect layers

    公开(公告)号:US11409037B2

    公开(公告)日:2022-08-09

    申请号:US17082291

    申请日:2020-10-28

    Abstract: Structures and methods implement an enlarged waveguide. The structure may include a semiconductor-on-insulator (SOI) substrate including a semiconductor-on-insulator (SOI) layer over a buried insulator layer over a semiconductor substrate. An inter-level dielectric (ILD) layer is over the SOI substrate. A first waveguide has a lower surface extending at least partially into the buried insulator layer, which allows vertical enlargement of the waveguide, without increasing the thickness of the ILD layer or increasing the length of interconnects to other devices. The enlarged waveguide may include nitride, and can be implemented with other conventional silicon and nitride waveguides.

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