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公开(公告)号：US20240361529A1
公开(公告)日：2024-10-31
申请号：US18139128
申请日：2023-04-25
Applicant: GlobalFoundries U.S. Inc.
Inventor： Keith Donegan , Thomas Houghton , Yusheng Bian , Karen Nummy , Kevin Dezfulian , Takako Hirokawa
CPC classification number: G02B6/305 , G02B6/42 , G02B6/4206
Abstract: Structures including a cavity adjacent to an edge coupler and methods of forming such structures. The structure comprises a semiconductor substrate including a cavity with a sidewall, a dielectric layer on the semiconductor substrate, and an edge coupler on the dielectric layer. The structure further comprises a fill region including a plurality of fill features adjacent to the edge coupler. The fill region includes a reference marker at least partially surrounded by the plurality of fill features, and the reference marker has a perimeter that surrounds a surface area of the dielectric layer, and the surface area overlaps with a portion of the sidewall of the cavity.
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公开(公告)号：US11880065B2
公开(公告)日：2024-01-23
申请号：US17588470
申请日：2022-01-31
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian , Steven M. Shank , Takako Hirokawa
CPC classification number: G02B6/12007 , G02B6/13 , G02B6/29338
Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes an edge coupler having a longitudinal axis, a first ring resonator, and a second ring resonator. The first ring resonator has a first center point that is spaced from the longitudinal axis of the edge coupler by a first perpendicular distance. The second ring resonator has a second center point that is spaced from the longitudinal axis of the edge coupler by a second perpendicular distance.
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公开(公告)号：US11650382B1
公开(公告)日：2023-05-16
申请号：US17510934
申请日：2021-10-26
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Ryan Sporer , Yusheng Bian , Takako Hirokawa
CPC classification number: G02B6/4251 , G02B6/305
Abstract: Structures including an optical component, such as an edge coupler, and methods of fabricating a structure that includes an optical component, such as an edge coupler. The structure includes a substrate having a sealed cavity, an optical component, and a dielectric layer between the optical component and the sealed cavity. The optical component is positioned vertically over the substrate and the dielectric layer, and the optical component overlaps with the sealed cavity in the substrate.
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公开(公告)号：US20230128786A1
公开(公告)日：2023-04-27
申请号：US17510934
申请日：2021-10-26
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Ryan Sporer , Yusheng Bian , Takako Hirokawa
Abstract: Structures including an optical component, such as an edge coupler, and methods of fabricating a structure that includes an optical component, such as an edge coupler. The structure includes a substrate having a sealed cavity, an optical component, and a dielectric layer between the optical component and the sealed cavity. The optical component is positioned vertically over the substrate and the dielectric layer, and the optical component overlaps with the sealed cavity in the substrate.
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公开(公告)号：US20250035840A1
公开(公告)日：2025-01-30
申请号：US18225709
申请日：2023-07-25
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian , Kenneth Giewont , Takako Hirokawa
Abstract: Structures for a photonics chip that include a photonic component and methods of forming such structures. The structure may comprise a photodetector on a substrate and a waveguide core. The photodetector includes a light-absorbing layer having a longitudinal axis, a first sidewall, and a second sidewall adjoined to the first sidewall at an interior angle. The first sidewall is slanted relative to the longitudinal axis, and the second sidewall is oriented transverse to the longitudinal axis. The waveguide core includes a tapered section adjacent to the first sidewall and the second sidewall of the light-absorbing layer.
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Patent Agency Ranking
公开(公告)号：US20240427094A1
公开(公告)日：2024-12-26
申请号：US18212754
申请日：2023-06-22
Applicant: GlobalFoundries U.S. Inc.
Inventor： Keith Donegan , Takako Hirokawa , Yusheng Bian , Thomas Houghton , Kevin Dezfulian , Carrie Yurkon
Abstract: Structures including a calibration marker adjacent to a photonic structure and methods of forming such structures. The structure comprises a semiconductor substrate, a photonic structure, and a back-end-of-line stack over the semiconductor substrate. The back-end-of-line stack includes a plurality of fill features, an exclusion area surrounded by the plurality of fill features, and a calibration marker in the exclusion area. The calibration marker is disposed adjacent to the photonic structure, and the calibration marker includes a feature having a predetermined dimension.
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公开(公告)号：US20240369760A1
公开(公告)日：2024-11-07
申请号：US18141753
申请日：2023-05-01
Applicant: GlobalFoundries U.S. Inc.
Inventor： Arpan Dasgupta , Zahidur Chowdhury , Takako Hirokawa , Vaishnavi Karra , Norman Robson
Abstract: Structures including a light source and an edge coupler, and methods of forming and using such structures. The structure comprises a semiconductor substrate and a back-end-of-line stack on the semiconductor substrate. The back-end-of-line stack includes a first dielectric layer, a first plurality of metal features in the first dielectric layer, a second dielectric layer on the first dielectric layer, and a second plurality of metal features in the second dielectric layer. The second plurality of metal features have a non-overlapping relationship with the first plurality of metal features. The structure further comprises an edge coupler adjacent to the first plurality of metal features and the second plurality of metal features.
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公开(公告)号：US20240419047A1
公开(公告)日：2024-12-19
申请号：US18210151
申请日：2023-06-15
Applicant: GlobalFoundries U.S. Inc.
Inventor： Michal Rakowski , Sujith Chandran , Takako Hirokawa , Pilar Gonzalez
Abstract: Structures for a broadband optical switch and methods of forming such structures. The structure comprises a Mach-Zehnder interferometer including first and second arms. The first arm comprises a first waveguide core, and the second arm comprises a second waveguide core. The structure further comprises a ring resonator comprising a third waveguide core that has a first thickness. A portion of the third waveguide core is adjacent to a portion of the first waveguide core over a light coupling region. A slab layer connects the portion of the first waveguide core to the portion of the third waveguide core. The slab layer has a second thickness that is less than the first thickness of the first waveguide core.
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公开(公告)号：US20240377582A1
公开(公告)日：2024-11-14
申请号：US18196727
申请日：2023-05-12
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian , Takako Hirokawa
Abstract: Structures including an edge coupler and methods of forming such structures. The structure comprises an edge coupler including a first portion and a second portion between the first portion and a semiconductor substrate, a first coupling-assistance feature adjacent to the first portion of the edge coupler, and a second coupling-assistance feature adjacent to the first portion of the edge coupler. The first portion of the edge coupler is positioned in a lateral direction between the first coupling-assistance feature and the second coupling-assistance feature.
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公开(公告)号：US20230244030A1
公开(公告)日：2023-08-03
申请号：US17588470
申请日：2022-01-31
Applicant: GlobalFoundries U.S. Inc.
Inventor： Yusheng Bian , Steven M. Shank , Takako Hirokawa
CPC classification number: G02B6/12007 , G02B6/13 , G02B6/29338
Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The structure includes an edge coupler having a longitudinal axis, a first ring resonator, and a second ring resonator. The first ring resonator has a first center point that is spaced from the longitudinal axis of the edge coupler by a first perpendicular distance. The second ring resonator has a second center point that is spaced from the longitudinal axis of the edge coupler by a second perpendicular distance.
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