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    Insulator module having structure enclosing atomspheric pressure gas
    2.
    发明授权
    Insulator module having structure enclosing atomspheric pressure gas 有权

    公开(公告)号：US09606587B2

    公开(公告)日：2017-03-28

    申请号：US13662030

    申请日：2012-10-26

    Applicant: Google Inc.

    Inventor： William Hamburgen

    IPC: G06F1/20

    CPC classification number: G06F1/20 ,  G06F1/203

    Abstract: A device including a heat-absorbing component, and one or more heat-generating components. At least one heat-generating component is located in proximity to an inner surface of the heat-absorbing component, and a gap exists between the at least one heat-generating component and the inner surface of the heat-absorbing component. The device further including an insulator, located in the gap, including an insulator structure enclosing atmospheric pressure gas, where the atmospheric pressure gas has a thermal conductivity lower than air.

    Cooling diversity in data centers
    5.
    发明授权
    Cooling diversity in data centers 有权
    数据中心的冷却多样性

    公开(公告)号：US09125327B1

    公开(公告)日：2015-09-01

    申请号：US13854265

    申请日：2013-04-01

    Applicant: Google Inc.

    Inventor： Andrew B. Carlson ,  Jimmy Clidaras ,  William Hamburgen

    IPC: H05K7/20

    CPC classification number: H05K7/2079 ,  H05K7/20827

    Abstract: A data center cooling system is disclosed. The system includes a plurality of computer racks arranged in a plurality of substantially parallel rows, cooling units associated with the computer racks and arranged in substantially parallel rows to cool air warmed by the cooling racks, and cooling fluid supply and return conduits that are divided by isolation valves into a plurality of cooling sub-loops, wherein adjacent cooling units in a common row are supplied from different sub-loops, and individual sub-loops serve cooling units in multiple rows, so as to provide water-side diversity across the cooling system.

    Abstract translation: 公开了一种数据中心冷却系统。 该系统包括布置在多个基本上平行的行中的多个计算机机架，与计算机机架相关联的冷却单元并且被布置成基本平行的行以冷却由冷却架加热的空气，以及冷却流体供应和返回管道，其被除以 隔离阀分成多个冷却子回路，其中公共行中相邻的冷却单元从不同的子回路供应，并且各个子回路以多行的形式提供冷却单元，以便在冷却时提供水侧分集 系统。

    Modular data center cooling
    6.
    发明授权
    Modular data center cooling 有权
    模块化数据中心冷却

    公开(公告)号：US08988879B2

    公开(公告)日：2015-03-24

    申请号：US13685483

    申请日：2012-11-26

    Applicant: Google Inc.

    Inventor： William Hamburgen ,  Jimmy Clidaras ,  Winnie Leung ,  David W. Stiver ,  Jonathan D. Beck ,  Andrew B. Carlson ,  Steven T. Y. Chow ,  Gregory P. Imwalle ,  Amir M. Michael

    IPC: G06F1/20 ,  H05K7/20

    CPC classification number: G06F1/20 ,  H05K7/2079 ,  Y10T29/49826

    Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.

    Abstract translation: 数据中心冷却装置包括便携式外壳，其具有用于移动设备的提升和传送结构，壳体中的相对侧，至少一个相对侧限定一个或多个空气通道开口，其布置成从机架安装的电子设备捕获温暖的空气， 端部在壳体中，相对的端部中的至少一个限定一个或多个空气通道开口，其定位成允许捕获的空气横向通过壳体和/或从壳体中流出，以及与壳体相关联的一个或多个冷却盘管，以接收和冷却所捕获的 并提供冷却的空气循环进入数据中心工作区。

    INSULATOR MODULE HAVING STRUCTURE ENCLOSING ATOMSPHERIC PRESSURE GAS
    7.
    发明申请
    INSULATOR MODULE HAVING STRUCTURE ENCLOSING ATOMSPHERIC PRESSURE GAS 有权
    具有包含大气压力气体的结构的绝缘子模块

    公开(公告)号：US20140118927A1

    公开(公告)日：2014-05-01

    申请号：US13662030

    申请日：2012-10-26

    Applicant: Google Inc.

    Inventor： William Hamburgen

    IPC: G06F1/20

    CPC classification number: G06F1/20 ,  G06F1/203

    Abstract: A device including a heat-absorbing component, and one or more heat-generating components. At least one heat-generating component is located in proximity to an inner surface of the heat-absorbing component, and a gap exists between the at least one heat-generating component and the inner surface of the heat-absorbing component. The device further including an insulator, located in the gap, including an insulator structure enclosing atmospheric pressure gas, where the atmospheric pressure gas has a thermal conductivity lower than air.

    Abstract translation: 一种包括吸热组件和一个或多个发热部件的装置。 至少一个发热部件位于吸热部件的内表面附近，并且在至少一个发热部件和吸热部件的内表面之间存在间隙。 该装置还包括位于间隙中的绝缘体，包括封闭大气压力气体的绝缘体结构，其中大气压力气体的导热率低于空气。

    Controlled flattening of sheet materials
    9.
    发明授权
    Controlled flattening of sheet materials 有权
    板材受控扁平化

    公开(公告)号：US08959967B1

    公开(公告)日：2015-02-24

    申请号：US13841483

    申请日：2013-03-15

    Applicant: Google Inc.

    Inventor： William Hamburgen ,  Michael John Bliss

    IPC: B21D37/10 ,  B21D1/00

    CPC classification number: B21D1/00 ,  C21D7/00 ,  C21D7/06 ,  C21D10/005 ,  C21D11/00 ,  C21D2221/00

    Abstract: Controlling a flatness of a first surface of a sheet material can include: (a) determining a first surface contour of the first surface of the sheet; (b) applying compressive stresses to one or more portions of the first surface of the sheet after the determination of the first surface contour of the sheet; (c) annealing compressive stresses in one or more portions of the first surface of the sheet after the determination of the first surface contour of the sheet; (d) determining a second surface contour of the first surface of the sheet after the compressive stresses have been applied to, and annealed from, the sheet; (e) comparing the second surface contour to a threshold flatness; and (f) performing (b)-(e) one or more times until the determined second surface contour is less than the threshold flatness.

    Abstract translation: 控制片材的第一表面的平坦度可以包括：（a）确定片材的第一表面的第一表面轮廓; （b）在确定片材的第一表面轮廓之后，对片材的第一表面的一个或多个部分施加压缩应力; （c）在确定片材的第一表面轮廓之后在片材的第一表面的一个或多个部分退火压缩应力; （d）在压缩应力施加到片材上并从板材退火之后确定片材的第一表面的第二表面轮廓; （e）将所述第二表面轮廓与阈值平坦度进行比较; 和（f）执行（b） - （e）一次或多次，直到确定的第二表面轮廓小于阈值平坦度。

    CHOPPED-FIBERS WITH AXIAL PROPERTY GRADIENT FOR MOLDED PARTS
    10.
    发明申请
    CHOPPED-FIBERS WITH AXIAL PROPERTY GRADIENT FOR MOLDED PARTS 有权
    具有用于模制部件的轴向属性梯级的切割纤维

    公开(公告)号：US20140268535A1

    公开(公告)日：2014-09-18

    申请号：US13841444

    申请日：2013-03-15

    Applicant: Google Inc.

    Inventor： William Hamburgen ,  Felix Jose Alvarez Rivera

    IPC: C08K3/40 ,  G06F1/16 ,  C08K3/04

    CPC classification number: C03B37/075 ,  C03B37/025 ,  C03B37/0253 ,  C03B37/16 ,  C03B2203/06 ,  C03B2205/40 ,  C03B2205/56 ,  C03C13/00 ,  C08K3/04 ,  C08K3/40 ,  C08K7/06 ,  C08K7/14 ,  G06F1/1628 ,  G06F1/1633 ,  G06F1/1656 ,  G06F1/181 ,  G06F1/182

    Abstract: A portable computing device includes a processor, a memory, and a portable computing device case that encloses one or more integrated circuits, including at least the processor and the memory. The case includes a molded fiber-reinforced polymer (FRP) material that includes a polymer material and elongated fibers that adhere to the polymer material and that have a property that varies over a length of the fibers along an elongation axis of the fibers, wherein an adhesion strength between the fibers and the polymer is determined at least in part by a property of the fibers that varies over a length of the fibers along the elongation axis.

    Abstract translation: 便携式计算设备包括处理器，存储器和包含至少包括处理器和存储器的一个或多个集成电路的便携式计算设备外壳。 壳体包括模制纤维增强聚合物（FRP）材料，其包括聚合物材料和细长纤维，其附着到聚合物材料上，并且具有沿着纤维的伸长轴在纤维长度上变化的性质，其中 纤维和聚合物之间的粘合强度至少部分地由沿着伸长轴的纤维长度变化的纤维的性质决定。

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