公开(公告)号：US09596787B1

公开(公告)日：2017-03-14

申请号：US14534566

申请日：2014-11-06

Applicant: Google Inc.

Inventor： Madhu Krishnan Iyengar ,  Christopher G. Malone ,  Gregory P. Imwalle

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20127 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20772 ,  H05K7/20809

Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and a plurality of electronic heat-generating devices at least partially immersed in the liquid phase of the non-conductive coolant to transfer a heat load to the non-conductive coolant.

Abstract translation: 数据中心冷却系统包括限定第一体积的外容器; 内部容器，其限定第二容积并且位于所述第一容积内，所述内部容器包括空气出口，所述空气出口包括所述第一和第二容积之间的气流路径; 液体密封件，用于流体地隔离非导电冷却剂的液相，其填充所述第一和第二体积的至少一部分与周围环境; 以及至少部分地浸没在非导电冷却剂的液相中以将热负荷传递到非导电冷却剂的多个电子发热装置。

公开(公告)号：US20170243806A1

公开(公告)日：2017-08-24

申请号：US15048140

申请日：2016-02-19

Applicant: Google Inc.

Inventor： Madhu Krishnan Iyengar ,  Teck-Gyu Kang ,  Christopher Gregory Malone ,  Norman Paul Jouppi

IPC: H01L23/473 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L23/04 ,  H01L23/367

CPC classification number: H01L23/473 ,  H01L23/04 ,  H01L23/3675 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/44 ,  H01L23/498 ,  H01L25/0652 ,  H01L25/18

Abstract: A semiconductor package includes a substrate, an integrated circuit disposed on the substrate, a memory support disposed on the integrated circuit, stacked memory disposed on the memory support and in communication with the integrated circuit, and a lid connected to the substrate. The integrated circuit has a low power region and a high power region. The memory support is disposed on the low power region of the integrated circuit and is configured to allow a flow of fluid therethrough to conduct heat away from the low power region of the integrated circuit. The lid defines a first port, a second port, and a lid volume fluidly connecting the first port and the second port. The lid volume is configured to house the integrated circuit, the memory support, and the stacked memory, while directing the flow of fluid to flow over the integrated circuit, the memory support, and the stacked memory.

公开(公告)号：US10130013B1

公开(公告)日：2018-11-13

申请号：US15360463

申请日：2016-11-23

Applicant: Google Inc.

Inventor： Madhu Krishnan Iyengar ,  Christopher G. Malone ,  Gregory P. Imwalle

IPC: H05K7/20

Abstract: A data center cooling system includes an outer container that defines a first volume; an inner container that defines a second volume and is positioned within the first volume, the inner container including an air outlet that includes an airflow path between the first and second volumes; a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment; and a plurality of electronic heat-generating devices at least partially immersed in the liquid phase of the non-conductive coolant to transfer a heat load to the non-conductive coolant.

公开(公告)号：US10032695B2

公开(公告)日：2018-07-24

申请号：US15048140

申请日：2016-02-19

Applicant: Google Inc.

Inventor： Madhu Krishnan Iyengar ,  Teck-Gyu Kang ,  Christopher Gregory Malone ,  Norman Paul Jouppi

IPC: H01L23/473 ,  H01L23/04 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498 ,  H01L25/18 ,  H01L23/44 ,  H01L25/065

Abstract: A semiconductor package includes a substrate, an integrated circuit disposed on the substrate, a memory support disposed on the integrated circuit, stacked memory disposed on the memory support and in communication with the integrated circuit, and a lid connected to the substrate. The integrated circuit has a low power region and a high power region. The memory support is disposed on the low power region of the integrated circuit and is configured to allow a flow of fluid therethrough to conduct heat away from the low power region of the integrated circuit. The lid defines a first port, a second port, and a lid volume fluidly connecting the first port and the second port. The lid volume is configured to house the integrated circuit, the memory support, and the stacked memory, while directing the flow of fluid to flow over the integrated circuit, the memory support, and the stacked memory.

公开(公告)号：US20160330873A1

公开(公告)日：2016-11-10

申请号：US14703566

申请日：2015-05-04

Applicant: Google Inc.

Inventor： Soheil Farshchian ,  Madhu Krishnan Iyengar

IPC: H05K7/20

CPC classification number: H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20336 ,  H05K7/20545 ,  H05K7/20663 ,  H05K7/20672 ,  H05K7/20681 ,  H05K7/20809

Abstract: A server rack thermosiphon system includes a plurality of evaporators, each evaporator including a thermal interface for one or more heat-generating server rack devices; at least one condenser mounted to an external structure of a server rack, the condenser including a fluid-cooled heat transfer module; a liquid conduit that fluidly couples each of the evaporators to the condenser to deliver a liquid phase of a working fluid from the condenser to the evaporators; and a vapor conduit that fluidly couples each of the evaporators to the condenser to deliver a mixed phase of the working fluid from the evaporators to the condenser.

Abstract translation: 服务器机架热虹吸系统包括多个蒸发器，每个蒸发器包括用于一个或多个发热服务器机架装置的热接口; 至少一个安装到服务器机架的外部结构的冷凝器，所述冷凝器包括流体冷却的传热模块; 将每个蒸发器流体耦合到冷凝器以将工作流体的液相从冷凝器输送到蒸发器的液体管道; 以及将每个蒸发器流体耦合到冷凝器以将工作流体的混合相从蒸发器输送到冷凝器的蒸汽导管。