HEAT SINK WITH A LOAD SPREADING BAR
    2.
    发明申请

    公开(公告)号:US20170273169A1

    公开(公告)日:2017-09-21

    申请号:US15500056

    申请日:2014-09-24

    CPC classification number: H05K1/0203 G06F1/20 G06F1/206 H05K7/20509

    Abstract: Example implementations relate to a heat sink. For example, an implementation includes a heat sink including a main region to interface with an electronic device mounted to a printed circuit board. The heat sink also includes a load spreading bar coupled to the main region. The load spreading bar includes a first attachment region including a first attachment feature and a second attachment feature. The first attachment feature is to interface with an upper side of the printed circuit board and the second attachment feature is to interface with a lower side of the printed circuit board. The load spreading bar also includes a second attachment region to interface with the printed circuit board.

    RETENTION ASSEMBLY
    5.
    发明申请

    公开(公告)号:US20170108891A1

    公开(公告)日:2017-04-20

    申请号:US15317116

    申请日:2014-07-30

    CPC classification number: G06F1/16 G06F1/185 H01R12/721

    Abstract: Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.

Patent Agency Ranking