公开(公告)号：US20170215296A1

公开(公告)日：2017-07-27

申请号：US15328572

申请日：2014-07-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Pinche TSAI ,  Kevin D CONN ,  Mujeeb Ur REHMAN ,  Chanh V HUA

IPC: H05K7/14 ,  G06F13/40 ,  H01R12/71 ,  G06F13/42

CPC classification number: H05K7/1487 ,  G06F1/183 ,  G06F13/4068 ,  G06F13/409 ,  G06F13/4282 ,  G06F2213/0024 ,  G06F2213/0026 ,  H01R12/716 ,  H05K7/1488

Abstract: A multi-bay apparatus can include a connector located in a multi-bay of a printed circuit assembly (PCA) of the apparatus, the connector is shaped to support a plurality of electronic input components at separate periods of time. The connector can connect an electronic input component among the plurality of electronic input components supported by the connector.

公开(公告)号：US20180276171A1

公开(公告)日：2018-09-27

申请号：US15468022

申请日：2017-03-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John NORTON ,  Bryan BOLICH ,  Sarah SILVERTHORN ,  James Lee ARMES ,  Matthew NEUMANN ,  Pinche TSAI ,  Kevin M. CASH

IPC: G06F13/40 ,  G06F12/02

CPC classification number: G06F13/4081 ,  G06F1/185 ,  G06F1/20 ,  G06F3/0604 ,  G06F3/0626 ,  G06F3/0662 ,  G06F3/067 ,  G06F3/0688 ,  G06F12/0246 ,  G06F2212/7208 ,  G11B33/124 ,  G11B33/128 ,  G11B33/1426

Abstract: Examples herein relate to non-volatile memory (NVM) drives. In one example, an NVM drive comprises a housing to support one or more printed circuit assemblies (PCA's), the housing comprising a front portion, a rear portion and a heat sink, a PCA disposed within the housing, the PCA comprising a connector, one or more NVM chips and a controller attached to the one or more NVM chips. The PCA is centered in the housing, the NVM drive is hot-plugged into a fabric attached memory pool or local to a server by the rear portion of the housing, and the NVM drive hot-plugged in the fabric attached memory pool is accessible by the front portion of the housing.

公开(公告)号：US20170325363A1

公开(公告)日：2017-11-09

申请号：US15118888

申请日：2014-02-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Pinche TSAI ,  Kevin D CONN

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20836 ,  G06F1/185 ,  G06F1/187 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20 ,  H05K7/20145 ,  H05K7/20727 ,  H05K7/20772

Abstract: A blank cartridge includes an impedance portion to control a flow of cooling media through the blank cartridge to a plurality of computing components, and an actuator to change an impedance level of the impedance portion. The actuator receives a control signal to change the impedance level of the impedance portion based on a location of the plurality of computing components relative to the blank cartridge.

公开(公告)号：US20170108891A1

公开(公告)日：2017-04-20

申请号：US15317116

申请日：2014-07-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Chanh V HUA ,  Michael STERNS ,  Kevin D CONN ,  Pinche TSAI

IPC: G06F1/16 ,  H01R12/72

CPC classification number: G06F1/16 ,  G06F1/185 ,  H01R12/721

Abstract: Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.