公开(公告)号：US20220388239A1

公开(公告)日：2022-12-08

申请号：US17891453

申请日：2022-08-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling CHAFFINS ,  Cassady Sparks ROOP ,  Kevin P. DEKAM ,  Vladek KASPERCHIK ,  Ali EMAMJOMEH ,  Johnathon HOLROYD ,  Stephen G. RUDISILL ,  Alexey S. KABALNOV

IPC: B29C64/153 ,  B29C64/336 ,  C08L67/04 ,  B29C70/88 ,  C08K3/22 ,  C09D11/40 ,  C08K3/08 ,  C09D11/52 ,  C09D11/322 ,  B29C64/205 ,  B33Y30/00 ,  B33Y50/00 ,  B33Y40/00 ,  B33Y80/00 ,  B29C64/255 ,  B29C64/227 ,  B29C64/307 ,  B29C64/176 ,  B29C64/182 ,  B29C64/25 ,  B33Y40/20 ,  B29C64/10 ,  B29C64/20 ,  B29C64/245 ,  B29C64/00 ,  B33Y99/00 ,  B29C64/30 ,  B33Y40/10 ,  B29C64/40

Abstract: The present disclosure is drawn to 3-dimensional printed parts that can include a conductive composite portion and an insulating portion. The conductive composite portion can include a matrix of fused thermoplastic polymer particles interlocked with a matrix of sintered elemental transition metal particles. The insulating portion can include a matrix of fused thermoplastic polymer particles that are continuous with the matrix of fused thermoplastic polymer particles in the conductive composite portion. The insulating portion can be substantially free of sintered elemental transition metal particles and can include transition metal oxide bronze particles.

公开(公告)号：US20240149542A1

公开(公告)日：2024-05-09

申请号：US18413468

申请日：2024-01-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling CHAFFINS ,  Thomas A. SAKSA ,  Kevin P. DEKAM ,  Terry MCMAHON ,  Donald W. SCHULTE ,  Jami Ryan BARONE ,  Douglas PEDERSON

IPC: B29C70/88 ,  B22F10/14 ,  B22F10/36 ,  B29C64/153 ,  B29C64/165 ,  B29C64/393

CPC classification number: B29C70/882 ,  B22F10/14 ,  B22F10/36 ,  B29C64/153 ,  B29C64/165 ,  B29C64/393 ,  B33Y30/00

Abstract: In an example, an apparatus includes processing circuitry comprising a model assessment module to identify an indication of a conductive element within object model data representing an object to be printed and a print instruction module to generate print instructions to generate the object. The print instructions may include an instruction to print conductive agent to form the conductive element and an instruction to print a fusing agent comprising an instruction to reduce an amount of fusing agent to be printed in a region of the conductive element compared to at least one other region of the object.

公开(公告)号：US20210170678A1

公开(公告)日：2021-06-10

申请号：US16089130

申请日：2017-04-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling CHAFFINS ,  Thomas A SAKSA ,  Kevin P. DEKAM ,  Terry MCMAHON ,  Donald W SCHULTE ,  Jami Ryan BARONE ,  Douglas PEDERSON

IPC: B29C64/153 ,  B29C64/165 ,  B29C64/393

Abstract: In an example, an apparatus includes processing circuitry comprising a model assessment module to identify an indication of a conductive element within object model data representing an object to be printed and a print instruction module to generate print instructions to generate the object. The print instructions may include an instruction to print conductive agent to form the conductive element and an instruction to print a fusing agent comprising an instruction to reduce an amount of fusing agent to be printed in a region of the conductive element compared to at least one other region of the object.

公开(公告)号：US20230373157A1

公开(公告)日：2023-11-23

申请号：US18228526

申请日：2023-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Yan ZHAO ,  Kristopher J. ERICKSON ,  Aja HARTMAN ,  Lihua ZHAO ,  Sterling CHAFFINS ,  Kevin P. DEKAM

IPC: B29C64/165 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10 ,  B33Y70/00 ,  B29K77/00 ,  B29K105/16 ,  B29K505/14 ,  B29K105/00 ,  B29C64/20 ,  B29C64/393 ,  B33Y30/00 ,  B33Y50/02 ,  B29K507/04

CPC classification number: B29C64/165 ,  B33Y10/00 ,  B29C64/112 ,  B33Y70/10 ,  B33Y70/00 ,  B29K2077/00 ,  B29K2105/162 ,  B29K2505/14 ,  B29K2995/0005 ,  B29K2105/0023 ,  B29C64/20 ,  B29C64/393 ,  B29K2105/005 ,  B33Y30/00 ,  B33Y50/02 ,  B29K2105/0032 ,  B29K2507/04

Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.

公开(公告)号：US20210339466A1

公开(公告)日：2021-11-04

申请号：US17376742

申请日：2021-07-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling CHAFFINS ,  Kevin P. DEKAM ,  Cassady Sparks ROOP

IPC: B29C64/153 ,  G01B1/00 ,  G01B7/16 ,  B29C64/307 ,  B29C64/295 ,  G01L1/22

Abstract: A strain sensor can include a resistor, a first electrical contact at a first end of the resistor, and a second electrical contact at a second end of the resistor. The resistor can be formed of a matrix of sintered elemental transition metal particles interlocked with a matrix of fused thermoplastic polymer particles.

公开(公告)号：US20210189164A1

公开(公告)日：2021-06-24

申请号：US16074279

申请日：2016-10-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Sterling CHAFFINS ,  Kevin P. DEKAM

IPC: C09D11/52 ,  C09D11/54 ,  C09D11/40 ,  C09D11/38 ,  C09D11/322 ,  C09D11/037 ,  C09D11/10 ,  B29C64/165 ,  B33Y10/00 ,  B33Y70/10

Abstract: The present disclosure is drawn to fluid sets, material sets, and 3-dimensional printing systems. A fluid set can include a pretreat composition that includes a salt of an alkali metal with bromide or iodide. The fluid set can also include a conductive fusing agent composition including a transition metal for fusing thermoplastic powder when exposed to electromagnetic radiation.

公开(公告)号：US20170183522A1

公开(公告)日：2017-06-29

申请号：US15308708

申请日：2014-06-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Sterling CHAFFINS, JR. ,  Kevin P. DEKAM ,  Jayprakash C. BHATT ,  Larrie DEARDURFF ,  Cory J. RUUD ,  Matthew THORNBERRY

IPC: C09D11/322 ,  B41J2/01 ,  C09D11/38

CPC classification number: C09D11/322 ,  B41J2/01 ,  C09D11/38

Abstract: The present disclosure is drawn to a pigment-based inkjet ink and methods. The inkjet ink includes water; from 2 wt % to 9 wt % pigment solids; from 0.05 wt % to 2 wt % of an acetylenic diol non-ionic surfactant; from 0.05 wt % to 2 wt % of a second surfactant. The second surfactant can be a polysorbate having at least 50% lipophilic oleic acid groups and having an HLB value of less than 15, or a C12-C18 polyoxyethylene glycol ether having an ethylene oxide number less than 20, or a perfluoropolyether including a polyethylene glycol primary alcohol or diol. The inkjet ink also includes from 5 wt % to 50 wt % of an organic solvent system comprising triethylene glycol and a cyclic amide.