公开(公告)号：US20220075443A1

公开(公告)日：2022-03-10

申请号：US17420812

申请日：2018-12-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Robert Lee Crane ,  Andrew L. Wiltzius ,  Jonathan D. Bassett

IPC: G06F1/3296 ,  G06F1/20

Abstract: A method of regulating power consumption per core within a multi-core package may include estimating power draw for each core within the multi-core processing system. Estimating the power draw for each core within the multi-core processing system may include dividing a total power draw of the multi-core processing system by a number of active cores operating within the multi-core processing system multiplied by a percent utilization of the multi-core processing system. The method may include determining a thermal margin for the multi-core processing system, and instigating a lower power limit for the multi-core processing system in response to a determination that the thermal margin reduces to a predetermined level.

公开(公告)号：US20230259184A1

公开(公告)日：2023-08-17

申请号：US17673916

申请日：2022-02-17

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Andrew L. Wiltzius ,  Sheng-Lung Liao ,  Robert Lee Crane ,  Jonathan D. Bassett

IPC: G06F1/20 ,  G06F13/42 ,  G06T1/20

CPC classification number: G06F1/206 ,  G06F13/4221 ,  G06F13/4208 ,  G06T1/20 ,  G06F2213/0026

Abstract: In example implementations, an apparatus is provided. The apparatus includes an interface, a graphics card connected to the interface, and a controller communicatively coupled to the interface. The graphics card includes an air moving device. The controller is to send a logic control to the graphics card to activate the air moving device in response to a performance parameter.

公开(公告)号：US20230076001A1

公开(公告)日：2023-03-09

申请号：US17794561

申请日：2020-02-26

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Andrew L. Wiltzius ,  Robert Lee Crane

IPC: H05K7/20 ,  H05K1/02

Abstract: An example heat transfer apparatus includes a first heatsink, having a first thermal resistance, to remove heat from a first component, a second heatsink, having a second thermal resistance different from the first thermal resistance, to remove heat from a second component, and a mounting structure supporting the first heatsink to couple the first heatsink to the first component. The second heatsink is supported by the first heatsink to couple the second heatsink to the second component.

公开(公告)号：US20230064539A1

公开(公告)日：2023-03-02

申请号：US17794437

申请日：2020-02-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Andrew L. Wiltzius ,  Robert Lee Crane ,  Shane Ward

IPC: H05K7/20

Abstract: A voltage regulator assembly can include a voltage regulator to provide power to a processor. The voltage regulator can occupy a volumetric space and includes a voltage regulator component grouping within the volumetric space. The voltage regulator assembly can include a heat dissipater with a heat absorption end portion thermally coupled to the voltage regulator. The heat dissipater can be routed along the voltage regulator and into an enlarged spacing between the voltage regulator component groupings. The heat absorption end portion of the heat dissipater can be positioned within the volumetric space of the voltage regulator. The heat dissipater can include a heat rejection end portion that is routed outside of the volumetric space of the voltage regulator.

公开(公告)号：US10208980B2

公开(公告)日：2019-02-19

申请号：US15544661

申请日：2015-04-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Robert Lee Crane ,  Tom J. Searby ,  Andrew L. Wiltzius ,  Mark J. Wierbilis

IPC: G06F1/20 ,  F24F13/02

Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.

公开(公告)号：US20230171916A1

公开(公告)日：2023-06-01

申请号：US17922430

申请日：2020-04-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Andrew L. Wiltzius ,  Robert Lee Crane

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20145 ,  G06F1/20

Abstract: In an example implementation according to aspects of the present disclosure, an electronic assembly comprises a chassis including a wall and a component section. The electronic assembly comprises a printed circuit board (PCB) having an inset that forms a gap between the PCB and the wall of the chassis to enable fluid to flow along the wall of the chassis from a first region of the electronic assembly located adjacent to a first side of the PCB to a second region of the electronic assembly located adjacent to a second side of the PCB. The electronic assembly also includes a fluid mover to move fluid, via the inset, from the first region of the electronic assembly to the component section located in the second region of the electronic assembly.

公开(公告)号：US20170363316A1

公开(公告)日：2017-12-21

申请号：US15544661

申请日：2015-04-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Robert Lee Crane ,  Tom J. Searby ,  Andrew L. Wiltzius ,  Mark J. Wierbilis

IPC: F24F13/02 ,  G06F1/20

CPC classification number: F24F13/02 ,  F05D2250/15 ,  G06F1/20

Abstract: An air duct is described herein. The air duct includes a duct housing having a first end and a second end and at least one vent disposed between the first end and the second end. The air duct also includes a plurality of dividers disposed between the first end and the second end and a plurality of channels. The plurality of channels are disposed between the first end and the second end and are derived from the plurality of dividers. The plurality of channels are to cool a first component and a second component of a computing device, wherein the duct housing is to encompass the first component and the second component. The duct housing is positioned with the first component located upstream of an air flow and the second component disposed downstream of the air flow.