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公开(公告)号:US10178800B2
公开(公告)日:2019-01-08
申请号:US15474486
申请日:2017-03-30
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: Saravana Mahalingam , Abhay Naik , Yathiraj Kasal , Rakesh Hota , Rajendra Prasad Vrukshavai , Mathews Leslie Kuriakose , Ravi Anekal Radhakrishnan
Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.
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公开(公告)号:US20180288900A1
公开(公告)日:2018-10-04
申请号:US15474486
申请日:2017-03-30
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: Saravana Mahalingam , Abhay Naik , Yathiraj Kasal , Rakesh Hota , Rajendra Prasad Vrukshavai , Mathews Leslie Kuriakose , Ravi Anekal Radhakrishnan
CPC classification number: H05K7/20263 , H05K7/1427 , H05K7/20272
Abstract: A support structure for an electronic component a chassis and a standoff that is attached to the chassis. The standoff is configured to support the electronic component and separate the electronic component at a distance away from the chassis. The standoff is configured to receive heat generated by the electronic component. The standoff includes a fluid passageway. The fluid passageway is configured to allow a cooling fluid to flow therethrough for convective heat transfer from the standoff to the cooling fluid.
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公开(公告)号:US20220121172A1
公开(公告)日:2022-04-21
申请号:US17121088
申请日:2020-12-14
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: Sujaya Rao , Donald Godfrey , Raghavendra Muniraju , Satyanarayan Kar , Rakesh Hota , Keerthi Jayarajan , Vinayakumar Kasimsetty
IPC: G05B19/4099
Abstract: A method for additive manufacturing process parameter monitoring of additively manufactured articles and associated raw materials, the method comprising the steps of: at an additive manufacturing raw material supplier located at a first location, packaging a raw additive manufacturing material, which may be a metal powder, and placing a sensor device inside the packaging, wherein the sensor device, which is powered by ambient energy, monitors one or more material parameters, as the packaging moves through a supply chain, and wherein sensed parameters from the sensor device are recorded periodically until the raw material is loaded to an additive manufacturing tool at a second location, different from the first location; prior to utilizing the sensor device, registering an identity for the sensor with blockchain rules to establish a trust on data originating from the sensor device; at an additive manufacturing article supplier located at the second location, using an additive manufacturing tool, manufacturing an article in accordance with a design file provided to the additive manufacturing supplier from an additive manufacturing designer located at a location different from the first and second locations; at the additive manufacturing supplier, utilizing the sensor device to monitor one or more process parameters associated with manufacturing the article, wherein the sensor device is: (1) connected to wireless network, (2) powered by ambient energy, and (3) sized and configured for monitoring the process parameters in situ at the additive manufacturing tool; at the additive manufacturing supplier, sending data regarding the one or more process parameters from the sensor device to a network node associated with the additive manufacturing tool; at the additive manufacturing supplier, generating a cryptographic distributed ledger comprising the data regarding the one or more process parameters, wherein the ledger is generated in the manner of a blockchain; and from the additive manufacturing supplier, the distributed ledger that is also accessible to the additive manufacturing designer using a private network, wherein the analyses of the data regarding the one or more process parameters are performed automatically by the blockchain rules, where in rules defined by additive manufacturing designer, for any anomalies during the manufacture of the article.
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公开(公告)号:US20220004164A1
公开(公告)日:2022-01-06
申请号:US17077008
申请日:2020-10-22
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: Satyanarayan Kar , Donald Godfrey , Sujaya Rao , Rakesh Hota , Vinayakumar Kasimsetty
IPC: G05B19/4099 , G06F21/60 , B33Y50/02 , B33Y80/00
Abstract: A method for secure transfer of an additive manufacturing design file and for process monitoring of additively manufactured articles that are manufactured in accordance with such design file includes the steps of: at an article designer located at a first location, generating the additive manufacturing design file; from the first location, sending the additive manufacturing design file to an additive manufacturing AM vendor located at a second location different from the first location; at the second location, using an additive manufacturing tool, manufacturing the article in accordance with the design file; and at the second location, and using a plurality of process monitoring devices, generating a plurality of process parameters associated with the manufacture of the article; at the second location, generating a cryptographic, distributed ledger comprising the plurality of process parameters. The ledger is generated in the manner of a block-chain.
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