公开(公告)号：US20130075146A1

公开(公告)日：2013-03-28

申请号：US13624448

申请日：2012-09-21

Applicant: Hoya Corporation

Inventor： Takashi FUSHIE ,  Hajime KIKUCHI

IPC: H05K3/40 ,  H05K3/00 ,  H05K1/11 ,  B32B3/24

CPC classification number: H05K1/115 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0023 ,  H05K3/0029 ,  H05K3/381 ,  H05K3/423 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/2072 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T428/24273

Abstract: There is provided that a substrate comprising a glass substrate 2 constituted by a glass including a silicon oxide. The glass substrate has a through-hole 3 communicating with a front surface and a rear surface of the glass substrate, and filled with a metal material. The substrate is realized by forming an anchor part by selectively etching a silicon oxide on a sidewall surrounding an inside of said through-hole 3 before filling the metal material and by filling the inside of said through-hole 3 with the metal material after forming the anchor part.

Abstract translation: 提供了包括由包含氧化硅的玻璃构成的玻璃基板2的基板。 玻璃基板具有与玻璃基板的前表面和后表面连通并且填充有金属材料的通孔3。 通过在填充金属材料之前通过选择性地蚀刻围绕所述通孔3的内侧的侧壁上的氧化硅并且在形成所述金属材料之后用所述金属材料填充所述通孔3的内部来形成所述基板 主体部分。

公开(公告)号：US20140301050A1

公开(公告)日：2014-10-09

申请号：US14209419

申请日：2014-03-13

Applicant: HOYA CORPORATION

Inventor： Takashi FUSHIE ,  Kunihiko UENO ,  Hajime KIKUCHI

IPC: H05K1/03 ,  H01L21/48 ,  H05K1/11 ,  H01L23/15

CPC classification number: H01L23/15 ,  G03F7/00 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49833 ,  H01L2924/0002 ,  Y10T428/24942 ,  H01L2924/00

Abstract: A substrate assembly including a photosensitive etching glass substrate; and a first substrate and a second substrate for interposing both main surfaces of the photosensitive etching glass substrate between them. One of the main surfaces of the photosensitive etching glass substrate is thermally bonded to the first substrate, and the other main surface of the photosensitive etching glass substrate is bonded to the second substrate. When a thermal expansion coefficient of the photosensitive etching glass substrate is defined as C0, and a thermal expansion coefficient of the first substrate is defined as C1, and a thermal expansion coefficient of the second substrate is defined as C2, C1/C2 satisfies a relation of 0.7 or more and 1.3 or less, and at least one of a relation of C0/C1 satisfying less than 0.7 or larger than 1.3, and a relation of C0/C2 satisfying less than 0.7 or larger than 1.3 is satisfied.

Abstract translation: 一种基板组件，包括光敏蚀刻玻璃基板; 以及用于将感光蚀刻玻璃基板的两个主表面插入它们之间的第一基板和第二基板。 感光蚀刻用玻璃基板的主表面之一与第一基板热粘接，感光蚀刻用玻璃基板的另一主面与第二基板接合。 当感光蚀刻玻璃基板的热膨胀系数定义为C0，将第一基板的热膨胀系数定义为C1，将第二基板的热膨胀系数定义为C2时，C1 / C2满足关系 为0.7以上且1.3以下，并且满足小于0.7或大于1.3的C 0 / C的关系和满足小于0.7或大于1.3的C 0 / C 2的关系中的至少一个。