摘要:
This invention relates to thermostable thermoplastic moulding compounds consisting of a thermoplastic aromatic polycarbonate resin, a graft polymer and optionally a thermoplastic vinyl polymer wherein the graft or vinyl polymer is emulsion polymerized with an emulsifier which is the reaction product of 2 mols of certain carboxylic anhydrides and 1 mole of certain diols.
摘要:
Thermoplastic materials containing A) 5 to 80 parts by weight of a thermoplastic co- or terpolymer made from the monomers styrene, &agr;-methylstyrene, methyl methacrylate, acrylonitrile with an average molecular weight ({overscore (M)}w) of 70,000 to 119,000, B) 1 to 30 parts by weight of a thermoplastic copolymer made from 60 to 95% by weight of styrene and/or &agr;-methylstyrene and 40 to 5% by weight of acrylonitrile with an average molecular weight ({overscore (M)}w) of 25,000 to 49,500, C) 0.1 to 10 parts by weight of a thermoplastic co- or terpolymer made from the monomers styrene, &agr;-methylstyrene, methyl methacrylate, acrylonitrile with an average molecular weight ({overscore (M)}w) of 1,500 to 6,000 and D) 0.5 to 50 parts by weight of a particulate rafted rubber with a glass transition temperature ≦10° C. and an average particle diameter (d50) of 0.05 to 0.50 &mgr;m, which contains 15 to 80 parts by weight of a chemically bonded polymer made from styrene, methyl methacrylate, acrylonitrile or mixtures thereof, per 100 parts by weight of rubber and optionally E) 10 to 300 parts by weight of an aromatic polycarbonate and/or poly-alkylene terephthalate per 100 parts by weight of A+B+C+D, or F) 1 to 40 parts by weight of a thermoplastic polyurethane.
摘要翻译:含有A)的热塑性材料5至80重量份由单体苯乙烯,α-甲基苯乙烯,甲基丙烯酸甲酯,平均分子量({超芯(M)} w)的单体制得的热塑性共聚物或三元共聚物为70,000至119,000, B)1至30重量份由60至95重量%的苯乙烯和/或α-甲基苯乙烯和40至5重量%的平均分子量({超芯(M)} w的丙烯腈制成的热塑性共聚物 )为25,000至49,500,C)0.1至10重量份由单体苯乙烯,α-甲基苯乙烯,甲基丙烯酸甲酯,丙烯腈制成的热塑性共聚物或三元共聚物,其平均分子量({overscore(M)} w)为 1,500至6000和D)0.5至50重量份玻璃化转变温度<= 10℃,平均粒径(d50)为0.05至0.50微米的颗粒状筏式橡胶,其含有15至80重量份的 由苯乙烯,甲基丙烯酸甲酯,a。制成的化学键合聚合物 丙烯腈或其混合物,每100重量份橡胶和任选的E)10至300重量份的芳族聚碳酸酯和/或聚对苯二甲酸亚烷基酯/ 100重量份的A + B + C + D,或F)1至 40重量份的热塑性聚氨酯。
摘要:
The invention relates to high-impact polyether sulfone molding compositions containing aromatic polyether sulfones, diene graft polymers and, optionally, other thermoplastic resins, at most half the aromatic polyether sulfone being replaceable by other thermoplastic resins.
摘要:
The thermoplastic moulding compounds according to the invention obtained from aromatic polyester carbonates and special graft polymers have a very high weld-line strength as well as a high notched impact strength at room temperature and especially at low temperatures and may be used for the production of moulded articles.
摘要:
1. Thermoplastic molding compounds containingA. 5 to 95 parts by weight of an aromatic polycarbonate,B. 1 to 50 parts by weight of a vinyl copolymer andC. 5 to 95 parts by weight of one or more graft polymers obtained by graft polymerization,characterized in that 10 to 100% of component A is replaced by a mixture of two polycarbonates A.1 and A.2 of identical structure,1) the relative solution viscosity of A.1 being 1.18 to 1.24,2) the relative solution viscosity of A.2 being 1.24 to 1.34 and3) the difference between the relative solution viscosities of A.1 and A.2 being greater than or equal to 0.06
摘要:
The invention relates to polycarbonate molding compounds consisting of halogen-free polycarbonates, graft polymers, phosphorus compounds, tetrafluoroethylene polymers and, optionally, copolymers and/or, optionally, other additives known per se and a process for their production.
摘要:
The invention relates to new graft polymers based on elastomers as the graft base and grafted-on vinyl monomers, their preparation and blend thereof with polyamides.
摘要:
Readily processable moulding materials with improved impact strength of polyamides and graft products which have a particular chemical and physical structure.
摘要:
Moulding compounds of fully aromatic polyesters, vinyl copolymers and grafted silicone rubber of a specified composition may be worked up into moulded products with excellent low temperature toughness and surface quality and very high resistance to stress cracking.
摘要:
A thermoplastic molding composition is disclosed comprising(i) a thermoplastic resin(ii) a low molecular weight additive, and(iii) a specially prepared carrier material magnesium-aluminum-silicate.The carrier material which is characterized by its particle size and low bulk density was found to be effective in minimizing the thermal processing-related evaporation of the low molecular additive.