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    STRAIN DETECTION DEVICE
    1.
    发明申请
    STRAIN DETECTION DEVICE 有权

    公开(公告)号：US20250115083A1

    公开(公告)日：2025-04-10

    申请号：US18729203

    申请日：2022-02-22

    Applicant: HITACHI ASTEMO, LTD.

    Inventor： Kenji YOSHIHARA ,  Hiroyuki ABE ,  Fumio YUKI ,  Takeo HOSOKAWA

    IPC: B60C23/06

    Abstract: The present disclosure provides a strain detection device capable of downsizing and improvement in strain detection accuracy as compared with the conventional functional components without hindering deformation of a tire. An aspect of the present disclosure includes a housing 110 bonded to an inner peripheral surface Ti of a tire T via an elastic adhesive EA, and a recess portion 111c provided on an end surface 111e of the housing 110 facing the inner peripheral surface Ti of the tire T. The strain detection device 100 includes the strain detection element 120 that is disposed at the center part of the recess portion 111c and detects strain of the tire T via the elastic adhesive EA, and the elastic member 130 that is disposed in the inner peripheral edge part of the recess portion 111c and protrudes toward the inner peripheral surface Ti of the tire T relative to the end surface 111e of the housing 110. The elastic adhesive EA is filled in a space between the bottom surface 111b of the recess portion 111c and the inner peripheral surface Ti of the tire T inside the elastic member 130.

    Sensor for Tires
    2.
    发明公开
    Sensor for Tires 审中-公开

    公开(公告)号：US20240118174A1

    公开(公告)日：2024-04-11

    申请号：US18271984

    申请日：2021-09-17

    Applicant: Hitachi Astemo, Ltd.

    Inventor： Hiroyuki ABE ,  Tsukasa TAKAHASHI ,  Kenji YOSHIHARA ,  Takeo HOSOKAWA

    IPC: G01M17/02 ,  G01K1/14

    CPC classification number: G01M17/02 ,  G01K1/14

    Abstract: The present disclosure provides a sensor for tires capable of measuring a physical quantity including a temperature of a tire. An aspect of the present disclosure is a sensor for tires including: a base portion 5 fixed to an inside of a tire T and in contact with the tire T, and a sensor chip 7 including a tire temperature detection unit that detects the temperature of the tire T through the base portion 5.

    AIRFLOW AMOUNT MEASURING DEVICE
    3.
    发明申请
    AIRFLOW AMOUNT MEASURING DEVICE 有权

    公开(公告)号：US20230079532A1

    公开(公告)日：2023-03-16

    申请号：US17801620

    申请日：2020-12-25

    Applicant: Hitachi Astemo, Ltd.

    Inventor： Binti Haridan FATIN FARHANAH ,  Hiroyuki ABE ,  Takayuki YOGO ,  Nozomi YATSUMONJI ,  Mizuki IJUIN

    IPC: G01F1/692

    Abstract: To provide an airflow amount measuring device capable of accurately measuring a flow amount of air without occurrence of warpage in a thin film portion when an airflow measuring element is mounted on a lead frame to form a resin-sealed package in which the airflow amount measuring element and the lead frame are sealed. A chip package includes a lead frame, an element mounted on the lead frame and having a detection portion, and a structure for sealing the lead frame and the element such that at least the detection portion is exposed. Then, the curvature radius ρ of the exposed portion of the element exposed from the sealing resin member is 2.13 or less.

    Flow Rate Measurement Device
    5.
    发明申请
    Flow Rate Measurement Device 有权

    公开(公告)号：US20220390264A1

    公开(公告)日：2022-12-08

    申请号：US17776859

    申请日：2020-10-20

    Applicant: Hitachi Astemo, Ltd.

    Inventor： Takayuki YOGO ,  Binti Haridan FATIN FARHANAH ,  Akira UENODAN ,  Hiroyuki ABE ,  Mizuki IJUIN

    IPC: G01F15/16

    Abstract: The objective of the present invention is to obtain a flow rate measurement device capable of reducing variations in the flow rate detection accuracy by suppressing the inclination of a chip package relative to a circuit board. A flow rate measurement device 20 of the present invention includes a chip package 310 having a flow rate sensor 311 and a passage wall 314 formed therein, and a circuit board 300 on which the chip package 310 is mounted, in which the chip package 310 is mounted such that the flow rate sensor 311 faces a portion of the circuit board 300 and a portion of the passage wall 314 as a resin portion of the chip package 310 contacts the circuit board 300.

    Physical Quantity Detection Device
    6.
    发明申请
    Physical Quantity Detection Device 有权

    公开(公告)号：US20220099469A1

    公开(公告)日：2022-03-31

    申请号：US17416585

    申请日：2020-01-21

    Applicant: Hitachi Astemo, Ltd.

    Inventor： Nozomi YATSUMONJI ,  Akira UENODAN ,  Takahiro MIKI ,  Hiroyuki ABE

    IPC: G01F1/684 ,  G01F15/14

    Abstract: Provided is a physical quantity detection device capable of electrically connecting with a neutralization region arranged at a place through which a measurement target gas passes in a simple process. A physical quantity detection device 300 of the invention includes a housing 301 having a terminal 303 and a passage portion 100 through which a measurement target gas passes, and a support body 600 that supports a flow rate detection element 601. A neutralization region 500 is formed on the bottom surface of the passage portion of the housing, and the support body is supported by the housing such that the detection unit of the flow rate detection element faces the neutralization region.

    Chip Package Positioning and Fixing Structure
    8.
    发明申请
    Chip Package Positioning and Fixing Structure 有权

    公开(公告)号：US20210398886A1

    公开(公告)日：2021-12-23

    申请号：US17288618

    申请日：2019-09-20

    Applicant: Hitachi Astemo, Ltd.

    Inventor： Binti Haridan FATIN FARHANAH ,  Takayuki YOGO ,  Hiroyuki ABE

    IPC: H01L23/495 ,  H01L23/31 ,  H01L23/04 ,  H05K3/34 ,  H05K1/18 ,  G01F5/00

    Abstract: To obtain a chip package positioning structure capable of adjusting a tilt and a position of a chip package with respect to the circuit board and reducing mounting variations. The chip package positioning and fixing structure that positions and fixes, to a circuit board 4, a chip package 5 in which a flow rate detection element 53 is sealed with a resin so that a detection portion is at least exposed, in which the chip package includes a solder fixation portion 52 that fixes the chip package to the circuit board by soldering, and a positioning portion 514 that performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element from the solder fixation portion.

    PHYSICAL QUANTITY MEASUREMENT DEVICE
    9.
    发明申请
    PHYSICAL QUANTITY MEASUREMENT DEVICE 有权

    公开(公告)号：US20210396561A1

    公开(公告)日：2021-12-23

    申请号：US17291535

    申请日：2019-11-14

    Applicant: Hitachi Astemo, Ltd.

    Inventor： Takayuki YOGO ,  Binti Haridan FATIN FARHANAH ,  Hiroyuki ABE ,  Satoshi IKEO ,  Yuta CHIBA

    IPC: G01F1/69

    Abstract: Provided is a physical quantity measurement device capable of preventing a sealing of a cavity portion on a back surface side of a diaphragm of a thermal air flow rate sensor while improving measurement accuracy of the thermal air flow rate sensor as compared with the related art. A physical quantity measurement device 20 includes a lead frame 208f having a mounting surface f1 on which a flow rate sensor 205 which is the thermal air flow rate sensor is mounted, and a flow passage forming member 209 disposed on a back surface f2 opposite to the mounting surface f1 of the lead frame 208f. A ventilation flow path 210 is formed by a first through hole 211 provided in the lead frame 208f and communicating with a cavity portion 205c of the flow rate sensor 205, a second through hole 212 provided in the lead frame 208f and opened in the mounting surface f1, and a connection flow path 213 that is defined between the lead frame 208f and the flow passage forming member 209 and connecting the first through hole 211 and the second through hole 212.

    PHYSICAL QUANTITY DETECTING DEVICE
    10.
    发明申请
    PHYSICAL QUANTITY DETECTING DEVICE 有权

    公开(公告)号：US20240416927A1

    公开(公告)日：2024-12-19

    申请号：US18702944

    申请日：2021-10-21

    Applicant: HITACHI ASTEMO, LTD.

    Inventor： Fumio YUKI ,  Takeo HOSOKAWA ,  Kenji YOSHIHARA ,  Atsuo SOMA ,  Hiroyuki ABE

    IPC: B60W40/12 ,  B60W40/105

    Abstract: A physical quantity detecting device (10) detects a plurality of different physical quantities on the basis of an output signal waveform. A strain sensor (3) as one sensor element outputs a sensor signal waveform (15) having a reference level (151), a positive level positively changing from the reference level (151), and a negative level negatively changing from the reference level (151). An estimating unit (4) estimates a first physical quantity corresponding to a peak value (152) of the positive level and a second physical quantity corresponding to a peak value (153) of the negative level on the basis of the sensor signal waveform (15) output by the strain sensor (3).

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