-
公开(公告)号：US20230380080A1
公开(公告)日：2023-11-23
申请号：US18030252
申请日：2021-09-22
Applicant: Hitachi Astemo, Ltd.
Inventor： Ryo AKIBA , Yoshio KAWAI
CPC classification number: H05K5/0065 , H05K5/0073 , H05K5/0247 , H05K5/0217 , B60R16/02
Abstract: There is provided an electronic control device fixed to an in-vehicle device to be controlled. The electronic control device is a unit that includes a base attached to the in-vehicle device, a case fixed to the base, a circuit board held by the case, and an electronic component mounted on the circuit board. At least one of the case and the base is made of a resin, the case and the base are fixed with a plurality of fixing screws, and the case and the base are fixed by an adhesive disposed away from the plurality of fixing screws.
-
公开(公告)号：US20220279671A1
公开(公告)日：2022-09-01
申请号：US17626884
申请日：2020-07-10
Applicant: Hitachi Astemo, Ltd.
Inventor： Yoshio KAWAI , Ryo AKIBA
Abstract: Provided is an electronic control device capable of suppressing failure of an electronic component due to static electricity. The electronic control device 100 includes a substrate 10, an electronic component 1 mounted on the substrate 10, an insulating case 20 that holds the substrate 10, a conductive cover 30 that covers the insulating case 20, a conductive base 40 that holds the insulating case 20, and a conductive fixture 21 that fixes the insulating case 20 to the conductive base 40. A distance L1 between the conductive cover 30 and the conductive fixture 21 is equal to or less than a distance L2 between the conductive cover 30 and a conductive terminal 1a of the electronic component 1.
-
公开(公告)号：US20240414903A1
公开(公告)日：2024-12-12
申请号：US18700980
申请日：2021-10-26
Applicant: Hitachi Astemo, Ltd.
Inventor： Takayuki FUKUZAWA , Yoshio KAWAI , Akihiro NAMBA , Ning TANG
Abstract: An electronic control device includes: a substrate; a housing; and a shielding material that is filled between the substrate and the housing and electrically connects the substrate to the housing. In addition, in the shielding material, formed is a low-impedance region which has a low impedance and in which the density of a conductive filler is higher than in other portions.
-
公开(公告)号：US20220394881A1
公开(公告)日：2022-12-08
申请号：US17776857
申请日：2020-11-20
Applicant: Hitachi Astemo, Ltd.
Inventor： Yasuhiro TSUYUKI , Yoshio KAWAI , Toshiaki ISHII , Eiichi IDE
Abstract: The present invention provides an in-vehicle electronic control device which further improves heat dissipation by forming a protrusion extending toward an electronic component on an inner surface of a cover portion formed of a highly thermally conductive resin in consideration of orientation of a filling material contained in the highly thermally conductive resin. An in-vehicle electronic control device of the present invention includes: a circuit board on which an electronic component is mounted; a base portion in which the circuit board is installed; and a cover portion with which the circuit board is covered together with the base portion, which is formed of a resin containing a filling material, and which has a protrusion protruding toward the electronic component, in which the protrusion is formed of a resin containing a filling material and a width of the protrusion is smaller than a width of the electronic component.
-
公开(公告)号：US20220240395A1
公开(公告)日：2022-07-28
申请号：US17595423
申请日：2020-06-02
Applicant: Hitachi Astemo, Ltd.
Inventor： Ryo AKIBA , Yoshio KAWAI
Abstract: Provided is an electronic device capable of enhancing salt damage resistance. An electronic device includes a circuit board 3 on which an electronic component 2 is mounted, a housing 4 that houses the circuit board 3, a connector 5 that is mounted on the circuit board 3 and is exposed to an outside of the housing via a first opening portion 4a of the housing 4, a cover member 6 that constitutes a part of a case 131 of an external device 103 to hold the housing 4, and has a second opening portion 66a to which the connector 5 is fitted, and a seal member 8 that is interposed between the connector 5 and the cover member 6, and liquid-tightly seals the case 131 of the external device 103. The housing 4 has a first wall portion 18 extending toward the cover member 6 so as to cover a part of the connector 5 at a distance, and the cover member 6 has a second barrier portion 68 extending toward the housing 4 so as to cover a part of the connector 5 at a distance.
-
Patent Agency Ranking
公开(公告)号：US20240400789A1
公开(公告)日：2024-12-05
申请号：US18698314
申请日：2022-09-22
Applicant: Hitachi Astemo, Ltd.
Inventor： Yasuhiro TSUYUKI , Akihiro NAMBA , Yoshio KAWAI
Abstract: A heat dissipation material that has insulating properties and uses spherical fillers includes at least one of a filler having a particle size of 200 μm or more and 1000 μm or less and having a ratio of 20% or more and a filler having a particle size of 1 nm or more and 10 μm or less and having a ratio of 20% or more, with respect to the total amount of the fillers.
-
公开(公告)号：US20230354509A1
公开(公告)日：2023-11-02
申请号：US17797541
申请日：2020-12-28
Applicant: Hitachi Astemo, Ltd.
Inventor： Ryo AKIBA , Yoshio KAWAI
IPC: H05K1/02
CPC classification number: H05K1/0259 , H05K2201/09827 , H05K2201/10371 , H05K2201/10606
Abstract: An electronic control device capable of suppressing failure of an electronic component due to static electricity is provided. An electronic control device that controls an actuator includes a circuit board, an electronic component mounted on the circuit board, a resin case (insulating case) that holds the circuit board, a metal cover (first conductive cover) that covers the resin case, an actuator cover (second conductive cover) that holds the resin case and covers an opening portion of the actuator, and a conductive portion that make the metal cover (first conductive cover) and the actuator cover (second conductive cover) conductive.
-
公开(公告)号：US20230255009A1
公开(公告)日：2023-08-10
申请号：US18015644
申请日：2021-05-31
Applicant: Hitachi Astemo, Ltd.
Inventor： Yusuke TAKAHASHI , Yoshio KAWAI
CPC classification number: H05K9/0039 , H05K9/0026 , H05K5/0069
Abstract: In order to prevent a short-circuit failure between a conductive connecting portion (1) that is provided as a countermeasure against external electrical noises and an electronic circuit, a structure is adopted where a large number of electronic components (8) are mounted on a circuit board (5) that is mounted on a base (7), a metal cover (6) is disposed so as to cover upper portions of the electronic components (8), opening portions (3) are formed in the circuit board (5) at four positions on a periphery of the circuit board (5), protruding members (12) that are integrally formed with the base (7) are disposed at four positions respectively in alignment with the positions where the opening portions (3) are formed, the protruding members (12) are made to pass through the opening portions (3) at four positions from a back surface side of the circuit board (5) to protrude to a front surface side of the circuit board 5, the conductive connecting portions (1) are arranged in an outside direction with respect to the protruding members (12) at four positions on the board, the protruding members (12) are disposed between the conductive connecting portions (1) and the electronic circuit so as to electrically connect the metal cover (6), the conductive connecting portion (1), and a ground circuit to each other.
-
公开(公告)号：US20220361314A1
公开(公告)日：2022-11-10
申请号：US17619186
申请日：2020-06-12
Applicant: Hitachi Astemo, Ltd.
Inventor： Yasuhiro TSUYUKI , Toshiaki ISHII , Yoshio KAWAI
IPC: H05K1/02
Abstract: A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).
-
公开(公告)号：US20240249993A1
公开(公告)日：2024-07-25
申请号：US18559153
申请日：2022-02-07
Applicant: Hitachi Astemo, Ltd.
Inventor： Ryo AKIBA , Yoshio KAWAI , Keiko UENO
IPC: H01L23/367
CPC classification number: H01L23/3675
Abstract: An electronic control device capable of achieving both high heat dissipation and solder connection reliability is achieved. An electronic control device 101 includes a circuit board 3 mounted with an electronic component 7 and a connector 4, a base 1 housing this circuit board 3, a cover 2 closing this base 1, a heat dissipation pedestal 9 formed on the base 1, and a thermally conductive material 8 arranged on an upper surface of this heat dissipation pedestal 9. On the upper surface of the heat dissipation pedestal 9 on which the thermally conductive material 8 is arranged, a plurality of grooves 14 formed radially from the center of the upper surface of the heat dissipation pedestal 9 and where the thermally conductive material 8 enters are formed. The electronic component 7 is configured to be in contact with the heat dissipation pedestal 9 via the thermally conductive material 8. This can achieve an electronic control device capable of achieving both high heat dissipation and solder connection reliability.
-
-
-
-
-
-
-
-
-
Search Results
14
records
(took 0.014 seconds)
