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1.Method of packaging a circuit module and joining same to a circuit substrate 失效
Title translation: 将电路模块封装并连接到电路基板的方法公开(公告)号:US3517438A
公开(公告)日:1970-06-30
申请号:US3517438D
申请日:1966-05-12
Applicant: IBM
Inventor: JOHNSON ALFRED H , MCCONNELL WILLIAM R
CPC classification number: G01R1/04 , H01L21/67126 , H05K1/0271 , H05K3/3426 , H05K13/003 , H05K2201/09709 , H05K2201/10424 , H05K2201/10757 , H05K2201/10924 , Y02P70/613 , Y10S206/82 , Y10T29/435 , Y10T29/49101 , Y10T29/49121 , Y10T29/49146
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公开(公告)号:US3253246A
公开(公告)日:1966-05-24
申请号:US29869563
申请日:1963-07-30
Applicant: IBM
Inventor: MCCONNELL WILLIAM R , SCHULZ PETER R
IPC: G06F1/00 , G06F1/18 , H01L23/538 , H01R12/50 , H05K1/14
CPC classification number: H05K1/14 , G06F1/00 , G06F1/18 , H01L23/5385 , H01L2924/0002 , H01L2924/3011 , H01R12/728 , H05K2201/044 , H05K2201/10325 , H01L2924/00
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公开(公告)号:US3300686A
公开(公告)日:1967-01-24
申请号:US29860363
申请日:1963-07-30
Applicant: IBM
Inventor: JOHNSON ALFRED H , MCCONNELL WILLIAM R , SCHULZ PETER R
CPC classification number: H05K1/14 , G06F1/18 , H05K2201/044 , H05K2201/09609 , H05K2201/10325 , H05K2201/10704
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