公开(公告)号：US11817369B2

公开(公告)日：2023-11-14

申请号：US16435355

申请日：2019-06-07

Applicant: INTEL CORPORATION

Inventor： Bamidele Daniel Falola ,  Susmriti Das Mahapatra ,  Sergio Antonio Chan Arguedas ,  Peng Li ,  Amitesh Saha

IPC: H01L23/42 ,  H01L23/367 ,  H01L23/373 ,  H01L23/522 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/42 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/5226 ,  H01L25/0652 ,  H01L24/09 ,  H01L24/17 ,  H01L2924/15311

Abstract: Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.

公开(公告)号：US12166004B2

公开(公告)日：2024-12-10

申请号：US16406593

申请日：2019-05-08

Applicant: Intel Corporation

Inventor： Susmriti Das Mahapatra ,  Bamidele Daniel Falola ,  Amitesh Saha ,  Peng Li

IPC: H01L23/00 ,  H01L23/373

Abstract: Embodiments may relate to a microelectronic package comprising that includes a solder thermal interface material (STIM). The STIM may include indium and a dopant material which may provide a number of benefits to the STIM. The STIM may physically and thermally couple a die and an integrated heat spreader (IHS). Other embodiments may be described or claimed.

公开(公告)号：US20200260609A1

公开(公告)日：2020-08-13

申请号：US16273633

申请日：2019-02-12

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Je-Young Chang ,  Betsegaw K. Gebrehiwot

IPC: H05K7/20 ,  H01L23/373 ,  H05K1/02

Abstract: A heat dissipation device may be formed having a planar structure with a first surface and a surface area enhancement structure projecting from or extending into the first surface of the planar structure. In one embodiment, an integrated circuit package may be formed with the heat dissipation device, wherein the heat dissipation device and at least one integrated circuit device are brought into thermal contact with a thermal interface material between the at least one integrated circuit device and the heat dissipation device and wherein the surface area enhancement structure of the heat dissipation device directly contacts the thermal interface material.

公开(公告)号：US11551997B2

公开(公告)日：2023-01-10

申请号：US16355468

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Shushan Gong ,  Shrenik Kothari

IPC: H01L23/42 ,  H01L21/48 ,  H01L23/00

Abstract: A thermal interface material may be formed comprising a polymer material and a self-healing constituent. The thermal interface material may be used in an integrated circuit assembly between at least one integrated and a heat dissipation device, wherein the self-healing constituent changes the physical properties of the thermal interface material in response to thermo-mechanical stresses to prevent failure modes from occurring during the operation of the integrated circuit assembly.

公开(公告)号：US20200373220A1

公开(公告)日：2020-11-26

申请号：US16419827

申请日：2019-05-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Emilio Tarango Valles

IPC: H01L23/42 ,  H01L23/373

Abstract: Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

公开(公告)号：US12062592B2

公开(公告)日：2024-08-13

申请号：US16419827

申请日：2019-05-22

Applicant: Intel Corporation

Inventor： Sergio Antonio Chan Arguedas ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Emilio Tarango Valles

IPC: H01L23/42 ,  H01L23/373 ,  H01L23/00 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07

CPC classification number: H01L23/42 ,  H01L23/3736 ,  H01L23/538 ,  H01L24/09 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/16157 ,  H01L2224/16227

Abstract: Disclosed herein are integrated circuit (IC) packages with thermal interface materials (TIMs) with different material compositions, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a die, and TIM, wherein the die is between the TIM and the package substrate along a vertical axis. The TIM may include a first TIM having a first material composition and a second TIM having a second material composition; the first material composition may be different than the second material composition, and the first TIM and the second TIM may be in different locations along a lateral axis perpendicular to the vertical axis.

公开(公告)号：US11670569B2

公开(公告)日：2023-06-06

申请号：US16437872

申请日：2019-06-11

Applicant: Intel Corporation

Inventor： Manish Dubey ,  Amitesh Saha ,  Marco Aurelio Cartas ,  Peng Li ,  Bamidele Daniel Falola

IPC: H01L23/42 ,  H01L23/00 ,  H01L23/373

CPC classification number: H01L23/42 ,  H01L23/3737 ,  H01L24/17 ,  H01L2924/15311

Abstract: Disclosed herein are channeled lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a die between a lid and a package substrate. A bottom surface of the lid may include a channel that at least partially overlaps the die.

公开(公告)号：US20200381332A1

公开(公告)日：2020-12-03

申请号：US16423700

申请日：2019-05-28

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Sergio Antonio Chan Arguedas ,  Marco Aurelio Cartas ,  Ken Hackenberg ,  Peng Li

IPC: H01L23/373 ,  H01L23/367

Abstract: Disclosed herein are integrated circuit (IC) packages with solder thermal interface materials (STIMs) with embedded particles, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, a die between the package substrate and the lid and a STIM between the die and the lid. The STIM may include embedded particles, and at least some of the embedded particles may have a diameter equal to a distance between the die and the lid.

公开(公告)号：US20200294886A1

公开(公告)日：2020-09-17

申请号：US16355468

申请日：2019-03-15

Applicant: Intel Corporation

Inventor： Amitesh Saha ,  Shushan Gong ,  Shrenik Kothari

IPC: H01L23/42 ,  H01L23/00 ,  H01L21/48

Abstract: A thermal interface material may be formed comprising a polymer material and a self-healing constituent. The thermal interface material may be used in an integrated circuit assembly between at least one integrated and a heat dissipation device, wherein the self-healing constituent changes the physical properties of the thermal interface material in response to thermo-mechanical stresses to prevent failure modes from occurring during the operation of the integrated circuit assembly.