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公开(公告)号:US20170148750A1
公开(公告)日:2017-05-25
申请号:US15323615
申请日:2014-08-07
Applicant: INTEL CORPORATION
Inventor: Ruchir SARASWAT , Uwe ZILLMANN , Nicholas P. COWLEY , Richard J. GOLDMAN
CPC classification number: H01L23/645 , H01F17/0006 , H01F27/2804 , H01F41/041 , H01F2017/002 , H01L23/481 , H01L23/5227 , H01L28/10
Abstract: Described is an apparatus which comprises: a substrate; a plurality of holes formed as vias (e.g., through-silicon-vias (TSVs)) in the substrate; and a metal loop formed in a metal layer positioned above the plurality of holes such that a plane of the metal loop is orthogonal to the plurality of holes.
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公开(公告)号:US20160241126A1
公开(公告)日:2016-08-18
申请号:US15025227
申请日:2013-11-27
Applicant: INTEL CORPORATION
Inventor: Vaibhav VAIDYA , Krishnan RAVICHANDRAN , Nicholas P. COWLEY
CPC classification number: H02M1/088 , H02M3/07 , H02M3/158 , H02M2001/0087 , H02M2001/009
Abstract: Described is an apparatus which comprises: an interconnect to provide current; a bridge having a high-side switch and a low-side switch, wherein the high-side switch and the low-side switch are coupled to an inductor, and wherein the inductor is coupled to the interconnect; a plurality of switching load stages coupled to the interconnect, wherein each of the switching load stages of the plurality to provide a voltage supply to a load; a first controller to control duty cycle of an input to the bridge to regulate the current provided to the interconnect; and a second controller to control duty cycle of a plurality of inputs, each input to be received by a corresponding switching load stage of the plurality of switching load stages.
Abstract translation: 描述了一种装置,其包括:提供电流的互连; 具有高侧开关和低侧开关的桥,其中所述高侧开关和所述低侧开关耦合到电感器,并且其中所述电感器耦合到所述互连; 耦合到所述互连的多个开关负载级,其中所述多个开关负载级中的每一个为负载提供电压供应; 第一控制器,用于控制到桥的输入的占空比以调节提供给互连的电流; 以及第二控制器,用于控制多个输入的占空比,每个输入由所述多个开关负载级的对应的开关负载级接收。
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公开(公告)号:US20190109107A1
公开(公告)日:2019-04-11
申请号:US16216881
申请日:2018-12-11
Applicant: Intel Corporation
Inventor: Kevin J. LEE , Ruchir SARASWAT , Uwe ZILLMANN , Nicholas P. COWLEY , Richard J. GOLDMAN
IPC: H01L23/00 , H01L23/64 , H01L23/48 , H01L23/522 , H01L23/66 , H01F27/28 , G06F1/16 , H03H7/42 , H03H9/64
Abstract: Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.
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公开(公告)号:US20170025953A1
公开(公告)日:2017-01-26
申请号:US15188205
申请日:2016-06-21
Applicant: Intel Corporation
Inventor: Nicholas P. COWLEY , Harish K. Krishnamurthy , Ruchir Saraswat
IPC: H02M3/158 , H01L25/065 , H02M1/088 , H02M3/157
CPC classification number: H02M3/158 , H01L25/0657 , H01L2225/06541 , H02M1/088 , H02M3/157 , H02M2001/008
Abstract: Described is an apparatus which comprises: a first bridge to be coupled to a first load; a first Pulse Width Modulation (PWM) circuit to drive the first bridge; a second bridge to be coupled to a second load; and a second PWM circuit to drive the second bridge, wherein the first PWM circuit is controlled by a first digital word separate from a second digital word, wherein the second PWM circuit is controlled by the second digital, and wherein the second digital word is derived from the first digital word.
Abstract translation: 描述了一种装置,其包括:要耦合到第一负载的第一桥; 用于驱动第一桥的第一脉宽调制(PWM)电路; 耦合到第二负载的第二桥; 以及驱动所述第二桥的第二PWM电路,其中所述第一PWM电路由与第二数字字分离的第一数字字来控制,其中所述第二PWM电路由所述第二数字控制,并且其中所述第二数字字被导出 从第一个数字字。
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