Systems and methods for high-speed data transmission across an electrical isolation barrier

    公开(公告)号:US12171398B2

    公开(公告)日:2024-12-24

    申请号:US18199045

    申请日:2023-05-18

    Abstract: An illustrative system includes first and second electrical circuits, a free space optics interface assembly, and a feedthrough assembly. The free space optics interface assembly may include an optical transmitter having an input that is electrically coupled to the first electrical circuit, and an optical receiver having an output that is electrically coupled to the second electrical circuit. The feedthrough assembly electrically connects the input of the optical transmitter to the first electrical circuit and includes a first conductive receptacle electrically coupled to a first input pin of the optical transmitter, a second conductive receptacle electrically coupled to a second input pin of the optical transmitter, a first conductive pad providing electrical connection of the first input pin of the optical transmitter to the first electrical circuit, and a second conductive pad providing electrical connection of the second input pin of the optical transmitter to the first electrical circuit.

    SYSTEMS AND METHODS FOR HIGH-SPEED DATA TRANSMISSION ACROSS AN ELECTRICAL ISOLATION BARRIER

    公开(公告)号:US20210068617A1

    公开(公告)日:2021-03-11

    申请号:US17052125

    申请日:2019-06-05

    Abstract: An exemplary medical system includes a first electrical circuit on a printed circuit board (PCB) and configured to generate data, a second electrical circuit on the PCB and electrically isolated from the first electrical circuit, and a radio frequency (RF) communication interface assembly on the PCB. The RF communication interface assembly includes an RF transmitter electrically coupled to the first electrical circuit and electrically isolated from the second electrical circuit, an RF receiver out of direct RF signal path alignment with the RF transmitter, electrically coupled to the second electrical circuit, and electrically isolated from the first electrical circuit, and a waveguide between the RF transmitter and the RF receiver and configured to guide an RF signal representative of the data between the RF transmitter and the RF receiver.

    COMPACT BINOCULAR IMAGE CAPTURE DEVICE
    9.
    发明申请

    公开(公告)号:US20200214545A1

    公开(公告)日:2020-07-09

    申请号:US16787447

    申请日:2020-02-11

    Abstract: A binocular image capture device includes a plurality of stacked circuit boards, a front-facing dual image sensor mounted to a first circuit board of the plurality of stacked circuit boards, and signal conditioning electronics mounted to one or more of the plurality of stacked circuit boards and coupled to receive electrical signals generated by the dual image sensor. The dual image sensor is enclosed in a hermetic housing. In some examples, the hermetic housing may be formed by the first circuit board, a transition ring secured to the first circuit board, and an optics mount secured to the transition ring. In some examples, the hermetic housing may be formed using materials having matching coefficients of thermal expansion. In some examples, the binocular image capture device is enclosed by a shaft, the plurality of stacked circuit boards being stacked along a length of the shaft.

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