公开(公告)号：US20170153214A1

公开(公告)日：2017-06-01

申请号：US14952924

申请日：2015-11-26

Applicant: Industrial Technology Research Institute

Inventor： Chin-Hung Wang ,  Cheng-Ta Ko ,  Sheng-Shu Yang

IPC: G01N33/00 ,  G01N21/27 ,  G01N21/25

CPC classification number: G01N33/0062 ,  G01J3/0208 ,  G01J3/0259 ,  G01J3/0286 ,  G01J3/18 ,  G01J2003/1852 ,  G01N21/255 ,  G01N21/31 ,  G01N33/0013 ,  G01N33/0027

Abstract: An optical sensing module, adapted to sense a characteristic of an object by a sensing beam, comprises a carrying substrate, a transparent cover having a reflective surface thereon, a side wall, an optical grating, and an optical sensor. The reflective surface has a light-transmissive opening that exposes a part of the transparent cover. The side wall is disposed around the carrying substrate and is located between the carrying substrate and the transparent cover. The optical grating is disposed on the carrying substrate and a position of the optical grating corresponds to the light-transmissive opening. The optical sensor is disposed on the carrying substrate and is located at a side of the optical grating, wherein the carrying substrate, the side wall and the transparent cover form a vacuum chamber. The optical grating and the optical sensor are disposed in the vacuum chamber.

公开(公告)号：US20160043239A1

公开(公告)日：2016-02-11

申请号：US14919744

申请日：2015-10-22

Applicant: Industrial Technology Research Institute

Inventor： Hsiang-Hung Chang ,  Wen-Chih Chen ,  Chia-Wei Jui ,  Zhi-Cheng Hsiao ,  Cheng-Ta Ko ,  Rong-Shen Lee ,  Sheng-Shu Yang

IPC: H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02002 ,  H01L23/481 ,  H01L24/09 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L31/0203 ,  H01L2224/05009

Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.

Abstract translation: 提供适用于层叠半导体器件封装的导电插塞结构，其中可以实现导电插塞结构和相应的器件焊盘之间的大的接触区域，以减少电阻抗。 因此，使用导电插塞结构的诸如光敏器件封装的封装结构具有优异的电性能和可靠性。

公开(公告)号：US10361235B2

公开(公告)日：2019-07-23

申请号：US15391867

申请日：2016-12-28

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Shu Yang ,  Hsiang-Hung Chang

IPC: H01L27/146

Abstract: An image sensor including a substrate, an image sensing element, and an adhesive layer is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit the contour of the arc surface. The adhesive layer is disposed on the arc surface and encapsulates the image sensing element.

公开(公告)号：US20180145107A1

公开(公告)日：2018-05-24

申请号：US15788816

申请日：2017-10-20

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Shu Yang ,  Hsiang-Hung Chang

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14607 ,  H01L27/14618 ,  H01L27/14643

Abstract: A manufacturing method of an image sensor. A substrate is provided, and the substrate has an arc surface. A cover, an adhesive layer, and an image sensing element are provided. The adhesive layer is bonded between the cover and the image sensing element. The cover, the adhesive layer, and the image sensing element bonded together are aligned to the substrate. The cover, the adhesive layer, and the image sensing element are pressed onto the substrate, such that the image sensing element is pressed by the adhesive layer and is thus curved to fit a contour of the arc surface, and the image sensing element is encapsulated by the adhesive layer.

公开(公告)号：US20180145106A1

公开(公告)日：2018-05-24

申请号：US15391867

申请日：2016-12-28

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Shu Yang ,  Hsiang-Hung Chang

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14607 ,  H01L27/14618 ,  H01L27/14643

Abstract: An image sensor including a substrate, an image sensing element, and an adhesive layer is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit the contour of the arc surface. The adhesive layer is disposed on the arc surface and encapsulates the image sensing element.