公开(公告)号：US11862533B2

公开(公告)日：2024-01-02

申请号：US17557168

申请日：2021-12-21

Applicant: Infineon Technologies AG

Inventor： Andreas Grassmann ,  Wolfram Hable ,  Juergen Hoegerl ,  Ivan Nikitin ,  Achim Strass

IPC: H01L23/42 ,  H01L23/495 ,  H01L23/552 ,  H01L23/373 ,  H01L23/473 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/42 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/49531 ,  H01L23/552 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

Abstract: A package includes: at least one electronic chip; an encapsulant encapsulating at least part of the at least one electronic chip; a shielding layer on at least part of an external surface of the encapsulant; and a first heat removal body thermally coupled to the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip to a cooling fluid. The encapsulant has a surface portion that extends in a surface region extending laterally directly adjacent to the first heat removal body. The surface portion of the encapsulant delimits part of a cooling cavity configured to guide the cooling fluid. The shielding layer covers the surface portion of the encapsulant. A corresponding electronic device, method of manufacturing the package, method of manufacturing the electronic device, vehicle, and method of using the electronic device are also described.

公开(公告)号：US20180040537A1

公开(公告)日：2018-02-08

申请号：US15665574

申请日：2017-08-01

Applicant: Infineon Technologies AG

Inventor： Andreas GRASSMANN ,  Wolfram Hable ,  Juergen Hoegerl ,  Ivan Nikitin ,  Achim Strass

IPC: H01L23/473 ,  H01L21/56 ,  H01L23/433 ,  H01L21/48 ,  B60R16/02 ,  H01L23/31

Abstract: A power module which comprises a semiconductor chip, at least one cooling plate with at least one cooling channel thermally coupled to the semiconductor chip and being configured so that a coolant is guidable through the at least one cooling channel, and an encapsulant encapsulating at least part of the semiconductor chip and part of the at least one cooling channel, wherein at least part of a main surface of the cooling plate forms part of an external surface of the power module.

公开(公告)号：US10461017B2

公开(公告)日：2019-10-29

申请号：US15665574

申请日：2017-08-01

Applicant: Infineon Technologies AG

Inventor： Andreas Grassmann ,  Wolfram Hable ,  Juergen Hoegerl ,  Ivan Nikitin ,  Achim Strass

IPC: H01L23/473 ,  B60R16/02 ,  H01L21/56 ,  H01L23/31 ,  H01L23/433 ,  H01L23/46 ,  H01L21/48 ,  H01L23/373 ,  H01L23/42 ,  H01L23/00 ,  H01L25/07

Abstract: A power module which comprises a semiconductor chip, at least one cooling plate with at least one cooling channel thermally coupled to the semiconductor chip and being configured so that a coolant is guidable through the at least one cooling channel, and an encapsulant encapsulating at least part of the semiconductor chip and part of the at least one cooling channel, wherein at least part of a main surface of the cooling plate forms part of an external surface of the power module.

公开(公告)号：US20220115293A1

公开(公告)日：2022-04-14

申请号：US17557168

申请日：2021-12-21

Applicant: Infineon Technologies AG

Inventor： Andreas Grassmann ,  Wolfram Hable ,  Juergen Hoegerl ,  Ivan Nikitin ,  Achim Strass

IPC: H01L23/42 ,  H01L23/495 ,  H01L23/552 ,  H01L23/373 ,  H01L23/473

Abstract: A package includes: at least one electronic chip; an encapsulant encapsulating at least part of the at least one electronic chip; a shielding layer on at least part of an external surface of the encapsulant; and a first heat removal body thermally coupled to the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip to a cooling fluid. The encapsulant has a surface portion that extends in a surface region extending laterally directly adjacent to the first heat removal body. The surface portion of the encapsulant delimits part of a cooling cavity configured to guide the cooling fluid. The shielding layer covers the surface portion of the encapsulant. A corresponding electronic device, method of manufacturing the package, method of manufacturing the electronic device, vehicle, and method of using the electronic device are also described.

公开(公告)号：US11244886B2

公开(公告)日：2022-02-08

申请号：US15710852

申请日：2017-09-21

Applicant: Infineon Technologies AG

Inventor： Andreas Grassmann ,  Wolfram Hable ,  Juergen Hoegerl ,  Ivan Nikitin ,  Achim Strass

IPC: H01L23/42 ,  H01L23/495 ,  H01L23/552 ,  H01L23/373 ,  H01L23/473 ,  H01L23/00 ,  H01L23/31

Abstract: A package which comprises at least one electronic chip, an encapsulant encapsulating at least part of the at least one electronic chip, and a shielding layer on at least part of an external surface of the encapsulant configured for shielding an interior of the package with regard to cooling fluid for removing thermal energy from the at least one electronic chip.