公开(公告)号：US09793119B2

公开(公告)日：2017-10-17

申请号：US15347835

申请日：2016-11-10

Applicant: Infineon Technologies AG

Inventor： Martin Mischitz ,  Markus Heinrici ,  Florian Bernsteiner

IPC: H01L21/00 ,  H01L21/027 ,  H01L21/308 ,  H01L21/306 ,  H01L21/3065 ,  H01L21/02

CPC classification number: H01L21/0274 ,  H01L21/02107 ,  H01L21/02203 ,  H01L21/0271 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/3085 ,  H01L21/3086 ,  H01L21/31058 ,  H01L21/32139 ,  H01L21/47 ,  H01L21/70

Abstract: According to various embodiments, a method of processing a substrate may include: disposing a viscous material over a substrate including at least one topography feature extending into the substrate to form a protection layer over the substrate; adjusting a viscosity of the viscous material during a contacting period of the viscous material and the substrate to stabilize a spatial distribution of the viscous material as disposed; processing the substrate using the protection layer as mask; and removing the protection layer after processing the substrate.

公开(公告)号：US09768023B1

公开(公告)日：2017-09-19

申请号：US14953492

申请日：2015-11-30

Applicant: Infineon Technologies AG

Inventor： Martin Mischitz ,  Markus Heinrici ,  Florian Bernsteiner

IPC: H01L21/00 ,  H01L21/027 ,  H01L21/70 ,  H01L21/3105 ,  H01L21/02 ,  H01L21/47

CPC classification number: H01L21/0274 ,  H01L21/02107 ,  H01L21/02203 ,  H01L21/0271 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/3085 ,  H01L21/3086 ,  H01L21/31058 ,  H01L21/32139 ,  H01L21/47 ,  H01L21/70

Abstract: According to various embodiments, a method of processing a substrate may include: disposing a viscous material over a substrate including at least one topography feature extending into the substrate to form a protection layer over the substrate; adjusting a viscosity of the viscous material during a contacting period of the viscous material and the substrate to stabilize a spatial distribution of the viscous material as disposed; processing the substrate using the protection layer as mask; and removing the protection layer after processing the substrate.