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公开(公告)号：US09674627B2
公开(公告)日：2017-06-06
申请号：US15099758
申请日：2016-04-15
Applicant: Infineon Technologies AG
Inventor： Shu-Ting Hsu , Alfons Dehe
CPC classification number: H04R31/006 , H04R1/02 , H04R9/048 , H04R19/005 , H04R19/013 , H04R2201/003 , H04R2201/029
Abstract: A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.
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Patent Agency Ranking
公开(公告)号：US20160234619A1
公开(公告)日：2016-08-11
申请号：US15099758
申请日：2016-04-15
Applicant: Infineon Technologies AG
Inventor： Shu-Ting Hsu , Alfons Dehe
CPC classification number: H04R31/006 , H04R1/02 , H04R9/048 , H04R19/005 , H04R19/013 , H04R2201/003 , H04R2201/029
Abstract: A sound transducer includes a substrate with a cavity with extending from a first surface of the substrate, a body at least partially covering the cavity and being connected to the substrate by at least one resilient hinge, a first set of comb fingers mounted to the substrate, and a second set of comb fingers mounted to the body. The first set of comb fingers and the second set of comb fingers are interdigitated and configured to create an electrostatic force driving the body in a direction perpendicular to the first surface of the substrate. The body and the at least one resilient hinge are configured for a resonant or a near-resonant excitation by the electrostatic force.
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公开(公告)号：US20150125003A1
公开(公告)日：2015-05-07
申请号：US14073672
申请日：2013-11-06
Applicant: Infineon Technologies AG
Inventor： Andreas Wiesbauer , Christian Mandl , Marc Fueldner , Shu-Ting Hsu
CPC classification number: B81B7/0077 , B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81C1/00388 , B81C1/00523 , H01L2224/48137 , H01L2224/8592 , H01L2924/15151 , H01L2924/16152 , H04R1/04 , H04R1/406 , H04R3/005 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.
Abstract translation: 如本文所述的实施例包括具有第一MEMS换能器元件的微机电系统（MEMS），第二MEMS换能器元件和半导体基板。 第一和第二MEMS换能器元件设置在半导体衬底的顶表面处，并且半导体衬底包括声耦合到第一和第二MEMS换能器元件的共享空腔。
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公开(公告)号：US11225408B2
公开(公告)日：2022-01-18
申请号：US16744857
申请日：2020-01-16
Applicant: Infineon Technologies AG
Inventor： Andreas Wiesbauer , Christian Mandl , Marc Füldner , Shu-Ting Hsu
IPC: B81B7/00 , H04R19/00 , H04R31/00 , H04R19/04 , H04R1/40 , B81B3/00 , B81C1/00 , H04R1/04 , H04R3/00
Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.
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公开(公告)号：US20200148531A1
公开(公告)日：2020-05-14
申请号：US16744857
申请日：2020-01-16
Applicant: Infineon Technologies AG
Inventor： Andreas Wiesbauer , Christian Mandl , Marc Fueldner , Shu-Ting Hsu
IPC: B81B7/00 , H04R1/40 , H04R19/04 , H04R31/00 , H04R19/00 , H04R3/00 , H04R1/04 , B81C1/00 , B81B3/00
Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.
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公开(公告)号：US10589987B2
公开(公告)日：2020-03-17
申请号：US14073672
申请日：2013-11-06
Applicant: Infineon Technologies AG
Inventor： Andreas Wiesbauer , Christian Mandl , Marc Fueldner , Shu-Ting Hsu
IPC: B81B7/00 , H04R19/00 , H04R31/00 , H04R19/04 , H04R1/40 , B81B3/00 , B81C1/00 , H04R1/04 , H04R3/00
Abstract: An embodiment as described herein includes a microelectromechanical system (MEMS) with a first MEMS transducer element, a second MEMS transducer element, and a semiconductor substrate. The first and second MEMS transducer elements are disposed at a top surface of the semiconductor substrate and the semiconductor substrate includes a shared cavity acoustically coupled to the first and second MEMS transducer elements.
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