公开(公告)号：US20230337406A1

公开(公告)日：2023-10-19

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu BAWA ,  Ruander CARDENAS ,  Kathiravan D ,  Jia Yan GO ,  Chin Kung GOH ,  Jeff KU ,  Prakash Kurma RAJU ,  Baomin LIU ,  Twan Sing LOO ,  Mikko MAKINEN ,  Columbia MISHRA ,  Juha PAAVOLA ,  Prasanna PICHUMANI ,  Daniel RAGLAND ,  Kannan RAJA ,  Khai Ern SEE ,  Javed SHAIKH ,  Gokul SUBRAMANIAM ,  George Baoci SUN ,  Xiyong TIAN ,  Hua YANG ,  Mark CARBONE ,  Vivek PARANJAPE ,  Nehakausar PINJARI ,  Hari Shanker THAKUR ,  Christopher MOORE ,  Gustavo FRICKE ,  Justin HUTTULA ,  Gavin SUNG ,  Sammi WY LIU ,  Arnab SEN ,  Chun-Ting LIU ,  Jason Y. JIANG ,  Gerry JUAN ,  Shih Wei NIEN ,  Lance LIN ,  Evan KUKLINSKI

IPC: H05K7/20 ,  H01L23/34 ,  G06F1/20

CPC classification number: H05K7/20963 ,  H01L23/34 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2099 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20154

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20240147654A1

公开(公告)日：2024-05-02

申请号：US18050502

申请日：2022-10-28

Applicant: Intel Corporation

Inventor： Jiunn Shyong CHEE ,  Howe Yin LOO ,  Tin Poay CHUAH ,  Chin Kung GOH ,  Yew San LIM

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20136 ,  G06F1/203

Abstract: The present disclosure is directed to a laptop arrangement including: a chassis defining a space that is divided into a first compartment and a second compartment, the first compartment including an air inlet and the second compartment including an air outlet; and a partitioning element positioned between the first and second compartments, whereby the partitioning element at least partially seals the first compartment from the second compartment and enables the second compartment to have a greater pressurization than the first compartment.

公开(公告)号：US20210333848A1

公开(公告)日：2021-10-28

申请号：US17368851

申请日：2021-07-07

Applicant: Intel Corporation

Inventor： Jeff KU ,  Tin Poay CHUAH ,  Howe Yin LOO ,  Chin Kung GOH ,  Yew San LIM ,  Cora Shih Wei NIEN

IPC: G06F1/20 ,  F28F3/04 ,  F28F21/08 ,  G06F1/16

Abstract: According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.