公开(公告)号：US20240214022A1

公开(公告)日：2024-06-27

申请号：US18145860

申请日：2022-12-23

Applicant: Intel Corporation

Inventor： Vamshi Krishna AAGIRU ,  Santhosh AP ,  Praveen Kashyap Ananta BHAT ,  Arjun C ,  Shailendra Singh CHAUHAN ,  Sajal Kumar DAS ,  Walid EL HAJJ ,  Isha GARG ,  Sagar GUPTA ,  Mallari HANCHATE ,  Mythili HEGDE ,  Siva Prasad JANGILI GANGA ,  Satyajit Siddharay KAMAT ,  Noam KOGOS ,  Ronen KRONFELD ,  Adiel LANGER ,  Gil MEYUHAS ,  Padmesh MURUGAN LATHA ,  Vishram Shriram PANDIT ,  Abhijith PRABHA ,  Manisha RAIGURU ,  Ehud RESHEF ,  Amir RUBIN ,  Shubham Kumar SAHU ,  Gurpreet SANDHU ,  Michael SHACHAR ,  Harry SKINNER ,  Madhukiran SRINIVASAREDDY ,  Gokul SUBRAMANIAM ,  Maruti TAMRAKAR ,  Jayprakash THAKUR ,  Vijaya Prasad UMMELLA ,  Yagnesh Vinodrai WAGHELA

IPC: H04B1/3827 ,  H04W52/36

CPC classification number: H04B1/3838 ,  H04W52/365 ,  H04B2001/3844

Abstract: Various principles and methods are described herein to improve wireless communication in a user computing device. Certain aspects of the disclosure describe management of wireless transmissions relative to various regulations related to a specific absorption rate. Other aspects of the disclosure relate to detection of user proximity to a transmitting antenna. Other aspects relate to alternative strategies to improve wireless communication, such as selection of alternate antennas or baseband modems, or changes in device orientation.

公开(公告)号：US20230337406A1

公开(公告)日：2023-10-19

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu BAWA ,  Ruander CARDENAS ,  Kathiravan D ,  Jia Yan GO ,  Chin Kung GOH ,  Jeff KU ,  Prakash Kurma RAJU ,  Baomin LIU ,  Twan Sing LOO ,  Mikko MAKINEN ,  Columbia MISHRA ,  Juha PAAVOLA ,  Prasanna PICHUMANI ,  Daniel RAGLAND ,  Kannan RAJA ,  Khai Ern SEE ,  Javed SHAIKH ,  Gokul SUBRAMANIAM ,  George Baoci SUN ,  Xiyong TIAN ,  Hua YANG ,  Mark CARBONE ,  Vivek PARANJAPE ,  Nehakausar PINJARI ,  Hari Shanker THAKUR ,  Christopher MOORE ,  Gustavo FRICKE ,  Justin HUTTULA ,  Gavin SUNG ,  Sammi WY LIU ,  Arnab SEN ,  Chun-Ting LIU ,  Jason Y. JIANG ,  Gerry JUAN ,  Shih Wei NIEN ,  Lance LIN ,  Evan KUKLINSKI

IPC: H05K7/20 ,  H01L23/34 ,  G06F1/20

CPC classification number: H05K7/20963 ,  H01L23/34 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2099 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20154

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.