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公开(公告)号：US20230337406A1
公开(公告)日：2023-10-19
申请号：US17754429
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Ritu BAWA , Ruander CARDENAS , Kathiravan D , Jia Yan GO , Chin Kung GOH , Jeff KU , Prakash Kurma RAJU , Baomin LIU , Twan Sing LOO , Mikko MAKINEN , Columbia MISHRA , Juha PAAVOLA , Prasanna PICHUMANI , Daniel RAGLAND , Kannan RAJA , Khai Ern SEE , Javed SHAIKH , Gokul SUBRAMANIAM , George Baoci SUN , Xiyong TIAN , Hua YANG , Mark CARBONE , Vivek PARANJAPE , Nehakausar PINJARI , Hari Shanker THAKUR , Christopher MOORE , Gustavo FRICKE , Justin HUTTULA , Gavin SUNG , Sammi WY LIU , Arnab SEN , Chun-Ting LIU , Jason Y. JIANG , Gerry JUAN , Shih Wei NIEN , Lance LIN , Evan KUKLINSKI
CPC classification number: H05K7/20963 , H01L23/34 , G06F1/203 , H05K7/20336 , H05K7/2099 , H05K7/20309 , H05K7/20318 , H05K7/20154
Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
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公开(公告)号：US20230394004A1
公开(公告)日：2023-12-07
申请号：US18235172
申请日：2023-08-17
Applicant: Intel Corporation
Inventor： Hua YANG , Zhouzhou WU , Yean Sun YONG , Guoqiang SU , Shailendra Singh CHAUHAN , Anil Kumar NAMA , Rajesh CHANDRAN
IPC: G06F13/42
CPC classification number: G06F13/4221 , G06F2213/0026
Abstract: M.2 Universal Flash Storage (UFS) and combined UFS/PCIe cards are described herein. In one example, the same M.2 interface is reused on the main board of laptop for supporting both PCIe SSD and UFS storage. One M.2 socket can accommodate a UFS Add-In-Card, a combined PCIe/UFS card, and/or a PCIe SSD. In one example, an M.2 UFS card includes a printed circuit board (PCB), an edge to be received by an M.2 connector, conductive contacts at the edge to couple with contacts of the M.2 connector, a UFS storage device, and UFS signal lines between the conductive contacts and the UFS storage device.
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