公开(公告)号：US20220102887A1

公开(公告)日：2022-03-31

申请号：US17033401

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Feifei CHENG ,  Thomas BOYD ,  Kuang LIU ,  Steven A. KLEIN ,  Daniel NEUMANN ,  Mohanraj PRABHUGOUD

IPC: H01R12/77 ,  H01R12/52 ,  H01R13/629

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

公开(公告)号：US20220200178A1

公开(公告)日：2022-06-23

申请号：US17131686

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Feifei CHENG ,  Zhe CHEN ,  Ahmet C. DURGUN ,  Zhichao ZHANG

IPC: H01R12/71 ,  H01R12/70 ,  H01R33/76 ,  H01R13/6594 ,  H01R13/24 ,  H01R13/6585 ,  H01R13/6597

Abstract: In an embodiment, a socket comprises a housing, where the housing is a dielectric material. In an embodiment, a shell passes through a thickness of the, where the shell is conductive. The socket may further comprise a plug within the shell, where the plug is a dielectric material, and where the plug has a bottom surface. In an embodiment, a pin passes through the thickness of the housing within an inner diameter of the shell, where the pin has a first portion with a first diameter and a second portion with a second diameter, and where the pin is conductive. In an embodiment, the socket further comprises a spring around the first portion of the pin, where a first end of the spring presses against the bottom surface, and where a second end of the spring presses against the second portion of the pin.

公开(公告)号：US20220102889A1

公开(公告)日：2022-03-31

申请号：US17033386

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Thomas BOYD ,  Feifei CHENG ,  Eric W. BUDDRIUS ,  Mohanraj PRABHUGOUD

IPC: H01R12/91 ,  H01R12/70 ,  H01R12/71 ,  H01R12/88

Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.