公开(公告)号：US20240224463A1

公开(公告)日：2024-07-04

申请号：US18147522

申请日：2022-12-28

Applicant: Intel Corporation

Inventor： Ali Kalantarian ,  Saanjali Maharaj ,  Tejas Shah ,  Tamara Low Foon ,  Mirui Wang

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20209 ,  G06F1/206 ,  H05K7/20154 ,  H05K7/20172

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed. An example system includes interface circuitry; first programmable circuitry; and instructions to cause the first programmable circuitry to: determine, based on a first signal output by a first sensor, a first temperature at a first location that is associated with second programmable circuitry; determine, based on a second signal output by a second sensor, a second temperature at a second location that is different than the first location; set a first thermal setpoint for the second programmable circuitry in response to the second temperature failing to satisfy a threshold value; and set a second thermal setpoint for the second programmable circuitry in response to the second temperature satisfying the threshold value, wherein the second thermal setpoint is higher than the first thermal setpoint.

公开(公告)号：US20230422389A1

公开(公告)日：2023-12-28

申请号：US18344308

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Tejas J. Shah ,  Yi Xia ,  Ying-Feng Pang ,  Mark Lawrence Bianco ,  Vishnu Prasadh Sugumar ,  Vikas Kundapura Rao ,  Srinivasa Rao Damaraju ,  Ridvan Amir Sahan ,  Emad Shehadeh Al-Momani ,  Rahima Khatun Mohammed ,  Mirui Wang ,  Devdatta Prakash Kulkarni

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20254 ,  H05K1/0271 ,  H05K2201/064

Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.