-
公开(公告)号:US11022792B2
公开(公告)日:2021-06-01
申请号:US16464257
申请日:2016-12-27
Applicant: Intel Corporation
Inventor: Kyle Yazzie , Anna M. Prakash , Suriyakala Ramalingam , Liwei Wang , Robert Starkston , Arnab Choudhury , Sandeep S. Iyer , Amanuel M. Abebaw , Nick Labanok
Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.
-
公开(公告)号:US20180134547A1
公开(公告)日:2018-05-17
申请号:US15354761
申请日:2016-11-17
Applicant: Intel Corporation
Inventor: Robert Starkston , Amanuel M. Abebaw , Liwei Wang , Mark Saltas , Sandeep S. Iyer , Nick Labanok
CPC classification number: B81C1/00182 , B29C65/14 , B29C65/4805 , B29L2031/34 , B81B3/0032 , B81B3/0051 , B81B3/0054 , B81B3/0059 , B81B3/0062 , B81B2201/038 , B81B2201/042 , B81B2203/0163 , B81B2203/051 , B81C2203/032
Abstract: Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.
-
公开(公告)号:US20190391386A1
公开(公告)日:2019-12-26
申请号:US16464257
申请日:2016-12-27
Applicant: Intel Corporation
Inventor: Kyle Yazzie , Anna M. Prakash , Suriyakala Ramalingam , Liwei Wang , Robert Starkston , Arnab Choudhury , Sandeep S. Iyer , Amanuel M. Abebaw , Nick Labanok
Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.
-
公开(公告)号:US10125013B2
公开(公告)日:2018-11-13
申请号:US15354761
申请日:2016-11-17
Applicant: Intel Corporation
Inventor: Robert Starkston , Amanuel M. Abebaw , Liwei Wang , Mark Saltas , Sandeep S. Iyer , Nick Labanok
Abstract: Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.
-
-
-