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公开(公告)号：US20180364438A1
公开(公告)日：2018-12-20
申请号：US15623919
申请日：2017-06-15
申请人： Intel Corporation
摘要： Aspects of the embodiments are directed to an optical component with at least one substantially flat surface. The flat surface can be used as a surface onto which a pick and place tool can contact the optical component for assembly. The optical component can be formed from a mold that includes an insertable pin. For example, the mold can include a three-piece mold: a core and a cavity can be brought together to define a negative space conforming to a shape of the optical component. The core and the cavity, when brought together, also define an opening. The opening can have a shape that conforms to a desired cross-sectional shape of the flat surface of the optical component. An insertable pin, with a substantially flat end surface, can be inserted through the opening during the mold process to form the substantially flat surface.
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公开(公告)号：US10125013B2
公开(公告)日：2018-11-13
申请号：US15354761
申请日：2016-11-17
申请人： Intel Corporation
发明人： Robert Starkston , Amanuel M. Abebaw , Liwei Wang , Mark Saltas , Sandeep S. Iyer , Nick Labanok
摘要： Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.
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公开(公告)号：US20190391386A1
公开(公告)日：2019-12-26
申请号：US16464257
申请日：2016-12-27
申请人： Intel Corporation
发明人： Kyle Yazzie , Anna M. Prakash , Suriyakala Ramalingam , Liwei Wang , Robert Starkston , Arnab Choudhury , Sandeep S. Iyer , Amanuel M. Abebaw , Nick Labanok
摘要： Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.
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公开(公告)号：US11022792B2
公开(公告)日：2021-06-01
申请号：US16464257
申请日：2016-12-27
申请人： Intel Corporation
发明人： Kyle Yazzie , Anna M. Prakash , Suriyakala Ramalingam , Liwei Wang , Robert Starkston , Arnab Choudhury , Sandeep S. Iyer , Amanuel M. Abebaw , Nick Labanok
摘要： Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.
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公开(公告)号：US20190001342A1
公开(公告)日：2019-01-03
申请号：US15638167
申请日：2017-06-29
申请人： Intel Corporation
发明人： Amanuel M. Abebaw , Mark Saltas , Anna M. Prakash , Liwei Wang
摘要： An apparatus for storing magnetic materials may include a tray. The apparatus for storing magnetic materials may include a sheet. The apparatus for storing magnetic materials may include a first set of height modulators. The apparatus for storing magnetic materials may include a diamagnetic material.The tray may include one or more pockets. The one or more pockets may be configured to receive a magnetic device. The sheet may be configured to couple with the tray. The sheet may be located adjacent to a bottom of the one or more pockets. The sheet may include the diamagnetic material. The sheet may include the first set of height modulators. The first set of height modulators may protrude from a surface of the sheet. The first set of height modulators may be configured to extend into the one or more pockets at a first distance.
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公开(公告)号：US20200073099A1
公开(公告)日：2020-03-05
申请号：US16336607
申请日：2016-09-30
申请人： Intel Corporation
发明人： Chia-Pin Chiu , Anna M. Prakash , Amanuel M. Abebaw , Olga Gorbounova , Ching-Ping Janet Shen , Shan Zhong , Mark Saltas
摘要： Various embodiments disclosed relate to an assembly. The assembly includes a compound parabolic concentrator including an exit aperture that has a generally circular perimeter, which defines a circumference of the exit aperture. The assembly further includes a photodiode sensor generally that is aligned with the exit aperture of the compound parabolic concentrator. An optical adhesave layer adheres the exit aperture of the compound parabolic concentrator to the photodiode sensor. A protrusion extends between at least a portion of the perimeter of the compound parabolic concentrator exit aperture and the photodiode.
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公开(公告)号：US20190002191A1
公开(公告)日：2019-01-03
申请号：US15638671
申请日：2017-06-30
申请人： Intel Corporation
发明人： Amanuel M. Abebaw
摘要： An optical component storage tray may define a plane. The tray may include a first side. The tray may include a second side. The first side and second side may be located on opposite sides of the plane. The tray may include a plurality of sockets. The plurality of sockets may be positioned on the first side. The plurality of sockets may include engaging features. The plurality of sockets may include a pocket. The pocket may be configured to receive an optical component. The tray may include a plurality of plugs. The plurality of plugs may be positioned on the second side. The plurality of plugs may include mating features. The mating features and the engaging features may be configured to intermesh. The tray may be formed from a composite material. The composite material may include a polycarbonate matrix. The composite material may include a dispersed carbon phase.
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公开(公告)号：US20180134547A1
公开(公告)日：2018-05-17
申请号：US15354761
申请日：2016-11-17
申请人： Intel Corporation
发明人： Robert Starkston , Amanuel M. Abebaw , Liwei Wang , Mark Saltas , Sandeep S. Iyer , Nick Labanok
CPC分类号： B81C1/00182 , B29C65/14 , B29C65/4805 , B29L2031/34 , B81B3/0032 , B81B3/0051 , B81B3/0054 , B81B3/0059 , B81B3/0062 , B81B2201/038 , B81B2201/042 , B81B2203/0163 , B81B2203/051 , B81C2203/032
摘要： Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.
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