公开(公告)号：US20230337406A1

公开(公告)日：2023-10-19

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu BAWA ,  Ruander CARDENAS ,  Kathiravan D ,  Jia Yan GO ,  Chin Kung GOH ,  Jeff KU ,  Prakash Kurma RAJU ,  Baomin LIU ,  Twan Sing LOO ,  Mikko MAKINEN ,  Columbia MISHRA ,  Juha PAAVOLA ,  Prasanna PICHUMANI ,  Daniel RAGLAND ,  Kannan RAJA ,  Khai Ern SEE ,  Javed SHAIKH ,  Gokul SUBRAMANIAM ,  George Baoci SUN ,  Xiyong TIAN ,  Hua YANG ,  Mark CARBONE ,  Vivek PARANJAPE ,  Nehakausar PINJARI ,  Hari Shanker THAKUR ,  Christopher MOORE ,  Gustavo FRICKE ,  Justin HUTTULA ,  Gavin SUNG ,  Sammi WY LIU ,  Arnab SEN ,  Chun-Ting LIU ,  Jason Y. JIANG ,  Gerry JUAN ,  Shih Wei NIEN ,  Lance LIN ,  Evan KUKLINSKI

IPC: H05K7/20 ,  H01L23/34 ,  G06F1/20

CPC classification number: H05K7/20963 ,  H01L23/34 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2099 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20154

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20230028777A1

公开(公告)日：2023-01-26

申请号：US17878527

申请日：2022-08-01

Applicant: Intel Corporation

Inventor： Gavin SUNG ,  Jayprakash THAKUR ,  Prakash Kurma RAJU ,  Madhukiran SRINIVASAREDDY ,  Smit KAPILA ,  Maruti TAMRAKAR ,  Khader Shareef ISMAIL SHERIF ,  Vijith HALESTOPH R ,  Sathiya Seelan SEKAR

IPC: H01Q1/44 ,  H01Q1/22 ,  H01Q1/24

Abstract: A kickstand for ergonomically positioning a computer device is equipped with an integrated antenna. In embodiments, the kickstand stores into a recess on a computer device, and can be deployed to help place the computer device into an ergonomic position. A switch or other sensor in the computer device may detect when the kickstand is deployed, and switch a radio within the computer device from an internal antenna to the antenna integrated into the kickstand. Other embodiments may be described and/or claimed.

公开(公告)号：US20230024409A1

公开(公告)日：2023-01-26

申请号：US17903278

申请日：2022-09-06

Applicant: Intel Corporation

Inventor： Smit KAPILA ,  Prakash Kurma RAJU ,  Abhishek SRIVASTAV ,  Prasanna PICHUMANI ,  Raghavendra Subramanya Setty KANIVIHALLI

IPC: H05K7/20 ,  G06F1/20 ,  G10K11/16

Abstract: A noise suppressing heat exchanger (also referred to as heat sink) includes a plurality of heat dissipating fins formed with baffles. The baffles suppress noise from a fan by slowing air flow and creating internal reflections within the heat exchanger that reflect noise away from the air flow path, absorbing sound energy and potentially setting up standing waves which dissipate noise via destructive interference. Other embodiments may be described and/or claimed.