公开(公告)号：US11044548B2

公开(公告)日：2021-06-22

申请号：US16727854

申请日：2019-12-26

Applicant: Intel Corporation

Inventor： Samarth Alva ,  Sumod Cherukkate ,  Sachin Bedare

IPC: H04R1/28 ,  H04R1/02 ,  G06F1/16 ,  H04R29/00 ,  H03G5/16

Abstract: In one embodiment, a portable computing device is described. The portable computing device includes a first surface comprising at least one user interface. The portable computing device also includes a second surface opposite the first surface. Further, the portable computing device includes at least one speaker port in the first surface. Further yet, the portable computing device includes a collapsible speaker chamber configured on the second surface opposite the at least one speaker port. Moreover, the portable computing device includes a speaker configured in the portable computing device between the speaker port and the collapsible speaker chamber.

公开(公告)号：US20220015273A1

公开(公告)日：2022-01-13

申请号：US17483415

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Bala P. Subramanya ,  Prakash Kurma Raju ,  Navneet K. Singh ,  Sachin Bedare ,  Vijith Halestoph R.

IPC: H05K9/00 ,  H05K1/02

Abstract: An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.

公开(公告)号：US10403560B2

公开(公告)日：2019-09-03

申请号：US16146927

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Bijendra Singh ,  Sachin Bedare

IPC: H01L23/427 ,  H05K7/20 ,  H05K1/02 ,  C09K5/06 ,  G06F1/20

Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.

公开(公告)号：US20220376623A1

公开(公告)日：2022-11-24

申请号：US17323862

申请日：2021-05-18

Applicant: Intel Corporation

Inventor： Jagadish Singh ,  Tarakesava Reddy Koki ,  Mallari C. Hanchate ,  Anoop Parchuru ,  Praveen Kashyap Ananta Bhat ,  Don J. Nguyen ,  Sachin Bedare ,  Raghavendra R. Rao ,  Vinaya Kumar Chandrasekhara ,  Govindaraj G.

IPC: H02M3/158 ,  G05F1/575 ,  H02J7/02 ,  G01R31/3835

Abstract: A computing system having a high-performance battery pack (e.g., 3S, 4S battery packs) coupled to a voltage regulator and logic to control an input supply of the voltage regulator. The logic determines the context of usage of the computing device (or user attentiveness) and either dynamically bypasses the voltage regulator to provide the voltage from the high-performance battery pack directly to various components of the computing system, or dynamically engages devices of the voltage regulator to provide a lower supply voltage to the various components of the computing system.

公开(公告)号：US20190326081A1

公开(公告)日：2019-10-24

申请号：US16455576

申请日：2019-06-27

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Raghavendra Doddi ,  Prasanna Pichumani ,  Sachin Bedare ,  Bijendra Singh ,  Gopinath Kandasamy

IPC: H01H13/84 ,  H01H13/705 ,  G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.

公开(公告)号：US10275016B2

公开(公告)日：2019-04-30

申请号：US14976366

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： Sachin Bedare ,  Ayeshwarya Mahajan

IPC: G06F1/00 ,  G06F1/26 ,  G06F1/32 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/3203 ,  G06F1/3212

Abstract: Disclosed are electrical systems and electronic devices. An electrical system includes an electronic device. The electronic device is configured to receive external power from an external power source, the external power sufficient to support normal mode operation of the electronic device. The electronic device includes control circuitry programmed to operate in the normal mode while receiving external power, and transition to one of a low power mode and a pre-shutdown mode responsive to sensor inputs. An electronic device includes an internal power source configured to provide internal power sufficient to support low power requirements of the electronic device operating in a low power mode, but not sufficient to support normal power requirements of a normal mode. The electronic device includes control circuitry programmed to transition from the low power mode to a hibernate mode while powered by only the internal power source.

公开(公告)号：US20190045665A1

公开(公告)日：2019-02-07

申请号：US16146927

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Bijendra Singh ,  Sachin Bedare

IPC: H05K7/20 ,  C09K5/06

CPC classification number: H01L23/4275 ,  G06F1/20 ,  H05K1/02 ,  H05K7/2029 ,  H05K7/20463 ,  H05K7/205

Abstract: Particular embodiments described herein provide for a thermal cooling system that is part of a device that includes a hole-in-motherboard configuration. The device can include a substrate, one or more dies on a top portion of the substrate, one or more printed circuit boards below the substrate, where the printed circuit boards are coupled to the substrate with solder balls, and one or more land side capacitors below the substrate. A thermal conducting plate, phase change material, and one or more sponge walls to help insulate the solder balls from the thermal conductive layer can be located in the hole of the hole-in-motherboard configuration and help transfer heat and thermal energy away from the device.

公开(公告)号：US20170177069A1

公开(公告)日：2017-06-22

申请号：US14976366

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： Sachin Bedare ,  Ayeshwarya Mahajan

IPC: G06F1/32

CPC classification number: G06F1/3296 ,  G06F1/263 ,  G06F1/3203 ,  G06F1/3206 ,  G06F1/3212 ,  Y02D10/172 ,  Y02D10/174

Abstract: Disclosed are electrical systems and electronic devices. An electrical system includes an electronic device. The electronic device is configured to receive external power from an external power source, the external power sufficient to support normal mode operation of the electronic device. The electronic device includes control circuitry programmed to operate in the normal mode while receiving external power, and transition to one of a low power mode and a pre-shutdown mode responsive to sensor inputs. An electronic device includes an internal power source configured to provide internal power sufficient to support low power requirements of the electronic device operating in a low power mode, but not sufficient to support normal power requirements of a normal mode. The electronic device includes control circuitry programmed to transition from the low power mode to a hibernate mode while powered by only the internal power source.

公开(公告)号：US11551891B2

公开(公告)日：2023-01-10

申请号：US16455576

申请日：2019-06-27

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Raghavendra Doddi ,  Prasanna Pichumani ,  Sachin Bedare ,  Bijendra Singh ,  Gopinath Kandasamy

IPC: H01H13/84 ,  H01H13/705 ,  G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that can include a key height activation engine and a keyboard. The keyboard can include a plurality of keys and one or more of the plurality of keys can include a key height mechanism. The key height mechanism includes a shape memory material and when the key height mechanism is activated by the key height activation engine, the shape memory material raises the one or more of the plurality of keys that includes the key height mechanism from a first height to a second height.

公开(公告)号：US20200322714A1

公开(公告)日：2020-10-08

申请号：US16727854

申请日：2019-12-26

Applicant: Intel Corporation

Inventor： Samarth Alva ,  Sumod Cherukkate ,  Sachin Bedare

IPC: H04R1/28 ,  H04R1/02 ,  H04R29/00 ,  G06F1/16

Abstract: In one embodiment, a portable computing device is described. The portable computing device includes a first surface comprising at least one user interface. The portable computing device also includes a second surface opposite the first surface. Further, the portable computing device includes at least one speaker port in the first surface. Further yet, the portable computing device includes a collapsible speaker chamber configured on the second surface opposite the at least one speaker port. Moreover, the portable computing device includes a speaker configured in the portable computing device between the speaker port and the collapsible speaker chamber.