公开(公告)号：US20240276675A1

公开(公告)日：2024-08-15

申请号：US18605305

申请日：2024-03-14

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Vishnu Prasadh Sugumar ,  Patrick L. Connor ,  Ying Feng Pang ,  Mark Lawrence Bianco

IPC: H05K7/20 ,  B05B1/16 ,  B05B15/68 ,  B05B15/70 ,  G06F1/20

CPC classification number: H05K7/20272 ,  B05B1/16 ,  B05B15/68 ,  B05B15/70 ,  G06F1/20 ,  H05K7/20281

Abstract: Systems, apparatus, articles of manufacture, and methods to mitigate hotspots in integrated circuit packages using gimballing nozzles and jet vectoring impingement are disclosed. An apparatus includes an array of nozzles to direct a cooling fluid toward an integrated circuit package. The array of nozzles includes a first nozzle and a second nozzle. The apparatus further includes a plate to carry the array of nozzles. The first nozzle is selectively moveable relative to the integrated circuit package and relative to the second nozzle. Movement of the first nozzle relative to the integrated circuit package including rotational movement and translational movement.

公开(公告)号：US20240029539A1

公开(公告)日：2024-01-25

申请号：US18476069

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Viktor Polyanko ,  Vishnu Prasadh Sugumar ,  Ying-Feng Pang ,  Mark Lawrence Bianco ,  Sandeep Ahuja ,  Tejas Shah

IPC: G08B21/18 ,  H05K7/20

CPC classification number: G08B21/182 ,  H05K7/20263 ,  H05K7/20763 ,  H05K7/20236

Abstract: Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirs are disclosed. An example apparatus includes programmable circuitry to detect, based on outputs of a sensor associated with a first reservoir, a coolant level of the first reservoir, the first reservoir removably coupled to a second reservoir, the first reservoir to supply coolant to the second reservoir, predict, based on the coolant level, a characteristic associated with operation of a cooling device fluidly coupled to the second reservoir, and cause an output to be presented at a user device based on the predicted characteristic.

公开(公告)号：US20230422389A1

公开(公告)日：2023-12-28

申请号：US18344308

申请日：2023-06-29

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Tejas J. Shah ,  Yi Xia ,  Ying-Feng Pang ,  Mark Lawrence Bianco ,  Vishnu Prasadh Sugumar ,  Vikas Kundapura Rao ,  Srinivasa Rao Damaraju ,  Ridvan Amir Sahan ,  Emad Shehadeh Al-Momani ,  Rahima Khatun Mohammed ,  Mirui Wang ,  Devdatta Prakash Kulkarni

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20254 ,  H05K1/0271 ,  H05K2201/064

Abstract: Cold plates for secondary side components of printed circuit boards are disclosed herein. An example apparatus disclosed herein includes a first printed circuit board, a second printed circuit board coupled to the first printed circuit board, the second printed circuit board having a first side and a second side opposite the first side, the second side facing the first printed circuit board, and a cold plate coupled to the second side of the second printed circuit board.