公开(公告)号：US5602934A

公开(公告)日：1997-02-11

申请号：US118921

申请日：1993-09-08

申请人： Jianhua Li ,  Haiguang Chen

发明人： Jianhua Li ,  Haiguang Chen

IPC分类号： A61B5/055 ,  G01R33/56 ,  G06T5/20 ,  H03H17/00 ,  H03H17/02 ,  H03H21/00 ,  H03M13/23 ,  H04N1/409 ,  G06K9/00

CPC分类号： G06T5/20 ,  G01R33/56 ,  G01R33/5608

摘要： A plurality of digitized subimage signal sets is generated by low-pass filtering an input digital image signal set along a respectively corresponding plurality of directions within the image. Thereafter, a set of noise-smoothed digital image signals is generated as a weighted combination of this first plurality of subimage signal sets. Preferably, the weight accorded to each subimage contribution is a function of the difference between the subimage and the original image, thus making the resultant filter adaptive to tissue structure.

摘要翻译： 通过对图像内的分别对应的多个方向设置的输入数字图像信号进行低通滤波来生成多个数字化的子图像信号组。 此后，产生一组噪声平滑的数字图像信号作为该第一多个子图像信号组的加权组合。 优选地，与每个子图像贡献一致的权重是子图像和原始图像之间的差异的函数，从而使所得到的滤波器适应于组织结构。

公开(公告)号：US10330608B2

公开(公告)日：2019-06-25

申请号：US13469339

申请日：2012-05-11

申请人： Haiguang Chen ,  Jaydeep K. Sinha ,  Sergey Kamensky

发明人： Haiguang Chen ,  Jaydeep K. Sinha ,  Sergey Kamensky

IPC分类号： G01N21/95 ,  H01L21/66 ,  G06T7/00 ,  G01N21/88 ,  G01N21/956 ,  G06T7/12 ,  G06T7/62 ,  G01B11/02

摘要： Systems and methods for providing micro defect inspection capabilities for optical systems such as wafer metrology tools and interferometer systems are disclosed. The systems and methods in accordance with the present disclosure may detect, classify and quantify wafer surface features, wherein the detected defects are classified and the important defect metrology information of height/depth, area and volume is reported. The systems and methods in accordance with the present disclosure therefore provide more values for quantifying the negative effect of these defects on the wafer quality.

公开(公告)号：US08010222B2

公开(公告)日：2011-08-30

申请号：US12032112

申请日：2008-02-15

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： G06F19/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

摘要翻译： 提供了用于在抛光期间监测测量装置的参数的方法和系统，抛光期间对样本的损坏，抛光垫的特性或抛光工具的特性。 一种方法包括在样品抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还包括确定输出信号是否在输出信号的范围之外。 超出范围的输出信号可能表示测量设备的参数失控。 在不同的实施例中，在该范围之外的输出信号可以指示对样本的损伤。 另一种方法包括用测量装置扫描抛光垫以在抛光垫上的测量点产生输出信号。 该方法还包括从输出信号确定抛光垫的特性。

公开(公告)号：US07373277B1

公开(公告)日：2008-05-13

申请号：US10858420

申请日：2004-06-01

申请人： Sean Wu ,  Haiguang Chen ,  Michael D. Kirk

发明人： Sean Wu ,  Haiguang Chen ,  Michael D. Kirk

IPC分类号： G06F11/30

CPC分类号： G06T7/0006 ,  G01N21/8851 ,  G01N21/9501 ,  G06T2207/10056 ,  G06T2207/20061 ,  G06T2207/30148

摘要： Various methods and systems for detection of selected defects particularly in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to raw inspection data acquired across an area on a substrate to determine a first portion of the raw inspection data that has a higher probability of being a selected type of defect than a second portion of the raw inspection data. The selected type of defect includes a non-point defect. The method also includes generating a raw two-dimensional map illustrating the first portion of the raw inspection data. In addition, the method includes searching the raw two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect. The method further includes determining if the event corresponds to a defect having the selected type.

摘要翻译： 提供用于检测所选缺陷的各种方法和系统，特别是在相对嘈杂的检查数据中。 一种方法包括将空间滤波器算法应用于跨越衬底上的区域获取的原始检查数据，以确定原始检查数据的第一部分与原始检查数据的第二部分相比具有较高选择类型的缺陷概率 。 所选择的缺陷类型包括非点缺陷。 该方法还包括生成示出原始检查数据的第一部分的原始二维映射。 此外，该方法包括搜索原始二维地图中具有与所选择的缺陷类型的空间特征近似匹配的空间特征的事件。 该方法还包括确定事件是否对应于具有所选类型的缺陷。

公开(公告)号：US20060148383A1

公开(公告)日：2006-07-06

申请号：US11362044

申请日：2006-02-24

申请人： Kurt Lehman ,  Charles Chen ,  Ronald Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Meng

IPC分类号： B24B51/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Systems and methods for detecting a presence of blobs on a specimen are provided. One method may include scanning measurement spots across a specimen during polishing of the specimen. The method may also include determining if the blobs are present on the specimen at the measurement spots. Each of the blobs may include unwanted material disposed upon a contiguous portion of the measurement spots. In some instances, the blobs may include copper. In some embodiments, scanning the measurement spots may include measuring an optical property and/or an electrical property of the specimen at the measurement spots. Another embodiment includes dynamically determining a signal threshold distinguishing a presence of the blobs from an absence of the blobs. An additional embodiment includes determining an endpoint of polishing if, for example, blobs are not determined to be present on the specimen.

公开(公告)号：US09031810B2

公开(公告)日：2015-05-12

申请号：US13170094

申请日：2011-06-27

申请人： Haiguang Chen ,  Jaydeep K. Sinha ,  Sergey Kamensky

发明人： Haiguang Chen ,  Jaydeep K. Sinha ,  Sergey Kamensky

IPC分类号： G06F15/00 ,  H01L21/66

CPC分类号： H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system and method for enhanced and expanded localized geometry characterization. Objects of interest are enhanced, detected, and classified according to user-defined parameters, and this enables enhanced contrast and more accurate feature detection, as well as more accurately defined feature object regions for feature geometry measurement and characterization.

摘要翻译： 用于增强和扩展的局部几何特征的系统和方法。 感兴趣的对象根据用户定义的参数被增强，检测和分类，并且这使得增强的对比度和更精确的特征检测以及用于特征几何测量和表征的更精确定义的特征对象区域。

公开(公告)号：US20120179419A1

公开(公告)日：2012-07-12

申请号：US13170094

申请日：2011-06-27

申请人： Haiguang Chen ,  Jaydeep K. Sinha ,  Sergey Kamensky

发明人： Haiguang Chen ,  Jaydeep K. Sinha ,  Sergey Kamensky

IPC分类号： G06F15/00

CPC分类号： H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a system and method for enhanced and expanded localized geometry characterization. Objects of interest are classified according to user-defined parameters, and this enables enhanced contrast and more accurate feature detection, as well as more accurately defined feature object regions.

摘要翻译： 本文公开了用于增强和扩展的局部几何表征的系统和方法。 感兴趣的对象根据用户定义的参数分类，这使得能够增强对比度和更精确的特征检测以及更准确地定义的特征对象区域。

公开(公告)号：US20110218762A1

公开(公告)日：2011-09-08

申请号：US13028074

申请日：2011-02-15

申请人： Haiguang Chen ,  Jaydeep Sinha

发明人： Haiguang Chen ,  Jaydeep Sinha

IPC分类号： G06F15/00 ,  G01B1/00

CPC分类号： G01B11/24 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a method to enhance detection and quantification of features in the wafer edge/wafer roll off regions. Modifications and improvements have been made to earlier methods which enable improved accuracy and increased scope of feature detection.

摘要翻译： 本文公开了一种增强晶片边缘/晶片滚降区域中的特征的检测和量化的方法。 已经对先前的方法进行了改进和改进，这些方法能够提高精度并增加特征检测的范围。

公开(公告)号：US07030018B2

公开(公告)日：2006-04-18

申请号：US10358101

申请日：2003-02-04

申请人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

发明人： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC分类号： H01L21/302

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

摘要： Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, a characteristic of a polishing pad, or a characteristic of a polishing tool are provided. One method includes scanning a specimen with a measurement device during polishing of a specimen to generate output signals at measurement spots on the specimen. The method also includes determining if the output signals are outside of a range of output signals. Output signals outside of the range may indicate that a parameter of the measurement device is out of control limits. In a different embodiment, output signals outside of the range may indicate damage to the specimen. Another method includes scanning a polishing pad with a measurement device to generate output signals at measurement spots on the polishing pad. The method also includes determining a characteristic of the polishing pad from the output signals.

公开(公告)号：US08630479B2

公开(公告)日：2014-01-14

申请号：US12986176

申请日：2011-01-07

申请人： Haiguang Chen ,  Jaydeep Sinha ,  Shouhong Tang ,  John Hager ,  Andrew Zeng ,  Sergey Kamensky

发明人： Haiguang Chen ,  Jaydeep Sinha ,  Shouhong Tang ,  John Hager ,  Andrew Zeng ,  Sergey Kamensky

IPC分类号： G06K9/00

CPC分类号： G06T5/002 ,  G06T5/20 ,  G06T7/0004 ,  G06T2207/30148

摘要： A method for enabling more accurate measurements of localized features on wafers is disclosed. The method includes: a) performing high order surface fitting to more effectively remove the low frequency shape components and also to reduce possible signal attenuations commonly observed from SEMI standard high pass, such as Gaussian and Double Gaussian filtering; b) constructing and applying a proper two dimensional LFM window to the residual image from the surface fitting processing stage to effectively reduce the residual artifacts at the region boundaries; c) calculating the metrics of the region using the artifact-reduced image to obtain more accurate and reliable measurements; and d) using site-based metrics obtained from front and back surface data to quantify the features of interest. Additional steps may also include: filtering data from measurements of localized features on wafers and adjusting the filtering behavior according to the statistics of extreme data samples.

摘要翻译： 公开了一种能够更精确地测量晶片上局部特征的方法。 该方法包括：a）执行高阶表面拟合，以更有效地去除低频形状分量，并减少通常从SEMI标准高通（如高斯和双高斯滤波）观察到的信号衰减; b）从表面拟合处理阶段构造和应用适当的二维LFM窗口到残余图像，以有效地减少区域边界处的残余伪像; c）使用伪影图像计算该区域的度量以获得更准确和可靠的测量; 以及d）使用从前面和背面数据获得的基于站点的度量来量化感兴趣的特征。 附加步骤还可以包括：根据晶片上局部特征的测量过滤数据，并根据极端数据样本的统计调整滤波行为。