Defect detection
    1.
    发明授权
    Defect detection 有权
    缺陷检测

    公开(公告)号:US07796805B1

    公开(公告)日:2010-09-14

    申请号:US11234974

    申请日:2005-09-26

    CPC classification number: G01N21/9501 G01N21/94 G01N21/956

    Abstract: A wafer having improved inspection sensitivity to foreign matter on a top-most surface of the wafer, as detected with a surface scanning optical inspection system that uses an inspection wavelength. The wafer includes a substantially homogenous first layer at the top-most surface of the wafer, the first layer having a first thickness. The first layer is at least partially transparent to the inspection wavelength. A substantially homogenous second layer immediately underlies the first layer, the second layer having a second thickness. The second layer is at least partially transparent to the inspection wavelength. A substrate immediately underlies the second layer. The first thickness and the second thickness are set in a combination that produces a local minimum of an electric field at the top-most surface and a local maximum of an electric field within one hundred nanometers above the top-most surface.

    Abstract translation: 如使用检查波长的表面扫描光学检查系统检测到的,具有对晶片最顶面上的杂质的检查灵敏度提高的晶片。 晶片在晶片的最顶表面包括基本均匀的第一层,第一层具有第一厚度。 第一层对于检测波长至少部分透明。 基本均匀的第二层紧邻第一层,第二层具有第二厚度。 第二层对于检查波长至少部分透明。 底物紧靠第二层。 第一厚度和第二厚度被设置为组合,其产生最顶面处的电场的局部最小值,以及最高表面之上的百纳米以内的电场的局部最大值。

    Methods and systems for detection of selected defects particularly in relatively noisy inspection data
    2.
    发明授权
    Methods and systems for detection of selected defects particularly in relatively noisy inspection data 有权
    用于检测选定缺陷的方法和系统,特别是在相对嘈杂的检查数据中

    公开(公告)号:US07373277B1

    公开(公告)日:2008-05-13

    申请号:US10858420

    申请日:2004-06-01

    Abstract: Various methods and systems for detection of selected defects particularly in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to raw inspection data acquired across an area on a substrate to determine a first portion of the raw inspection data that has a higher probability of being a selected type of defect than a second portion of the raw inspection data. The selected type of defect includes a non-point defect. The method also includes generating a raw two-dimensional map illustrating the first portion of the raw inspection data. In addition, the method includes searching the raw two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect. The method further includes determining if the event corresponds to a defect having the selected type.

    Abstract translation: 提供用于检测所选缺陷的各种方法和系统,特别是在相对嘈杂的检查数据中。 一种方法包括将空间滤波器算法应用于跨越衬底上的区域获取的原始检查数据,以确定原始检查数据的第一部分与原始检查数据的第二部分相比具有较高选择类型的缺陷概率 。 所选择的缺陷类型包括非点缺陷。 该方法还包括生成示出原始检查数据的第一部分的原始二维映射。 此外,该方法包括搜索原始二维地图中具有与所选择的缺陷类型的空间特征近似匹配的空间特征的事件。 该方法还包括确定事件是否对应于具有所选类型的缺陷。

    Scanning force microscope having aligning and adjusting means
    3.
    再颁专利
    Scanning force microscope having aligning and adjusting means 失效
    具有对准和调节装置的扫描力显微镜

    公开(公告)号:USRE35514E

    公开(公告)日:1997-05-20

    申请号:US325997

    申请日:1994-10-19

    CPC classification number: G01Q40/00 B82Y35/00 G01Q70/02 Y10S977/868

    Abstract: A scanning force microscope having a sensor head and a base wherein a moveable sample holder is housed in the base and is positioned relative to a probe housed in the sensor head, such sample being monitored by an optical deflection detection system. The detection system is configured to provide direct visual observation of the probe with respect to the sample. The mirror of the detection system is mounted in a cut away portion of a sphere and defines the axis of rotation of a kinematic mount, such providing ease of fine adjustment of the detection system. The sensor head is in communication with the base by a stage kinematic mount, such providing ease of position adjustment of the sensor head with respect to the base.

    Abstract translation: 一种扫描力显微镜,其具有传感器头和基座,其中可移动的样品保持器容纳在基座中并且相对于容纳在传感器头中的探针定位,该样品由光学偏转检测系统监测。 检测系统被配置为提供相对于样品的探针的直接目视观察。 检测系统的镜子安装在球体的切除部分中并且限定运动学座架的旋转轴线,从而提供了检测系统的微调。 传感器头通过平台运动学支架与基座连通,从而提供传感头相对于底座的位置调节的便利性。

    Scanning probe microscope
    4.
    发明授权
    Scanning probe microscope 失效
    扫描探针显微镜

    公开(公告)号:US5496999A

    公开(公告)日:1996-03-05

    申请号:US320490

    申请日:1994-10-11

    Abstract: A scanning probe microscope having numerous advantages is disclosed. Respective scanning force and scanning tunneling probes are removably mounted in the head using kinematic mounting techniques so that they may be substituted for one another without the need to adjust the cantilever deflection sensor. A linear position-sensitive photodetector in the deflection sensor eliminates further the need for adjustments. A motorized, non-stacked x,y coarse movement stage is kinematically positioned with respect to the base and features a minimized mechanical loop to reduce thermal and vibrational effects on the position of the sample. A z coarse movement stage positions the head kinematically with respect to the base and includes a motorized drive means which allows the height, tilt and pitch of the probe to be adjusted. The scanner includes x,y and z sample position detectors which provide an accurate measurement of the position of the sample with respect to the probe. The z position detector provides an output which is exclusive of sample tilt and which may be used as an output of the scanning probe microscope. The outputs of the x,y and z position detectors may also be connected in feedback loops with the controller to improve the performance of the scanning probe microscope.

    Abstract translation: 公开了具有许多优点的扫描探针显微镜。 使用运动学安装技术将各扫描力和扫描隧道探针可拆卸地安装在头部中,使得它们可以彼此替代,而不需要调整悬臂偏转传感器。 偏转传感器中的线性位置敏感光电检测器进一步消除了对调整的需要。 机动的,非堆叠的x,y粗移动台相对于基座运动地定位,并具有最小化的机械回路,以减少对样品位置的热和振动影响。 z粗移动台将头相对于基座运动地定位,并且包括允许调节探头的高度,倾斜和俯仰的电动驱动装置。 扫描器包括x,y和z采样位置检测器,其提供样品相对于探针的位置的精确测量。 z位置检测器提供的输出不包括样品倾斜,可用作扫描探针显微镜的输出。 x,y和z位置检测器的输出也可以与控制器连接在反馈回路中,以提高扫描探针显微镜的性能。

    Scanning probe microscope
    5.
    发明授权
    Scanning probe microscope 失效
    扫描探针显微镜

    公开(公告)号:US5376790A

    公开(公告)日:1994-12-27

    申请号:US850669

    申请日:1992-03-13

    Abstract: A scanning probe microscope having numerous advantages is disclosed. Respective scanning force and scanning tunneling probes are removably mounted in the head using kinematic mounting techniques so that they may be substituted for one another without the need to adjust the cantilever deflection sensor. A linear position-sensitive photodetector in the deflection sensor eliminates further the need for adjustments. A motorized, non-stacked x,y coarse movement stage is kinematically positioned with respect to the base and features a minimized mechanical loop to reduce thermal and vibrational effects on the position of the sample. A z coarse movement stage positions the head kinematically with respect to the base and includes a motorized drive means which allows the height, tilt and pitch of the probe to be adjusted. The scanner includes x,y and z sample position detectors which provide an accurate measurement of the position of the sample with respect to the probe. The z position detector provides an output which is exclusive of sample tilt and which may be used as an output of the scanning probe microscope. The outputs of the x,y and z position detectors may also be connected in feedback loops with the controller to improve the performance of the scanning probe microscope.

    Abstract translation: 公开了具有许多优点的扫描探针显微镜。 使用运动学安装技术将各扫描力和扫描隧道探针可拆卸地安装在头部中,使得它们可以彼此替代,而不需要调整悬臂偏转传感器。 偏转传感器中的线性位置敏感光电检测器进一步消除了对调整的需要。 机动的,非堆叠的x,y粗移动台相对于基座运动地定位,并具有最小化的机械回路,以减少对样品位置的热和振动影响。 z粗移动台将头相对于基座运动地定位,并且包括允许调节探头的高度,倾斜和俯仰的电动驱动装置。 扫描器包括x,y和z采样位置检测器,其提供样品相对于探针的位置的精确测量。 z位置检测器提供的输出不包括样品倾斜,可用作扫描探针显微镜的输出。 x,y和z位置检测器的输出也可以与控制器连接在反馈回路中,以提高扫描探针显微镜的性能。

    Methods and systems for determining a characteristic of a wafer
    6.
    发明授权
    Methods and systems for determining a characteristic of a wafer 有权
    用于确定晶片特性的方法和系统

    公开(公告)号:US08284394B2

    公开(公告)日:2012-10-09

    申请号:US11673150

    申请日:2007-02-09

    CPC classification number: G01N21/9501 G01N21/4738 G01N21/55

    Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.

    Abstract translation: 提供了用于确定晶片特性的方法和系统。 一种方法包括使用检查系统响应来自晶片的光产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出确定晶片的特性。 一个系统包括检查子系统,该检查子系统配置成照亮晶片并产生响应于来自晶片的光的输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该系统还包括配置成使用第二输出来确定晶片的特性的处理器。

    Single axis vibration reducing system
    7.
    发明授权
    Single axis vibration reducing system 失效
    单轴减振系统

    公开(公告)号:US5811821A

    公开(公告)日:1998-09-22

    申请号:US694690

    申请日:1996-08-09

    CPC classification number: F16F15/02 G05D19/02 F16F2230/08 Y10S977/872

    Abstract: A single-axis active vibration reducing system for reducing vibrations in an object in a single axis. The vibration isolation system enables the sensing of motion of the center of mass of an object along a single axis and, with the proper positioning of a single sensor-actuator pair with feedback operation, the dampening of vibrations of the object along that axis. Due to the positioning and alignment of the actuator, the vibration isolation system of the present invention does not introduce appreciable off-axis vibration. The vibration reducing system includes an actuator positioned on the object to impart an actuation force along an actuator axis to reduce vibrations of the object in the vibrational axis without imparting substantial motion to the object other than in the vibrational axis.

    Abstract translation: 单轴主动减振系统,用于减少单个轴上物体的振动。 振动隔离系统使得能够沿着单个轴检测物体的质心的运动,并且通过具有反馈操作的单个传感器 - 致动器对的适当定位,沿着该轴阻尼物体的振动。 由于致动器的定位和对准,本发明的隔振系统不会产生明显的离轴振动。 减振系统包括定位在物体上的致动器,以沿着致动器轴线施加致动力,以减少物体在振动轴线中的振动,而不会对振动轴线以外的物体施加相当大的运动。

    Methods and systems for determining a characteristic of a wafer
    9.
    发明授权
    Methods and systems for determining a characteristic of a wafer 有权
    用于确定晶片特性的方法和系统

    公开(公告)号:US08422010B2

    公开(公告)日:2013-04-16

    申请号:US13610860

    申请日:2012-09-12

    CPC classification number: G01N21/9501 G01N21/4738 G01N21/55

    Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.

    Abstract translation: 提供了用于确定晶片特性的方法和系统。 一种方法包括使用检查系统响应来自晶片的光产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出确定晶片的特性。 一个系统包括检查子系统,该检查子系统配置成照亮晶片并产生响应于来自晶片的光的输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该系统还包括配置成使用第二输出来确定晶片的特性的处理器。

    Methods and Systems for Determining a Characteristic of a Wafer
    10.
    发明申请
    Methods and Systems for Determining a Characteristic of a Wafer 有权
    确定晶圆特性的方法和系统

    公开(公告)号:US20130035877A1

    公开(公告)日:2013-02-07

    申请号:US13610860

    申请日:2012-09-12

    CPC classification number: G01N21/9501 G01N21/4738 G01N21/55

    Abstract: Methods and systems for determining a characteristic of a wafer are provided. One method includes generating output responsive to light from the wafer using an inspection system. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The method also includes determining the characteristic of the wafer using the second output. One system includes an inspection subsystem configured to illuminate the wafer and to generate output responsive to light from the wafer. The output includes first output corresponding to defects on the wafer and second output that does not correspond to the defects. The system also includes a processor configured to determine the characteristic of the wafer using the second output.

    Abstract translation: 提供了用于确定晶片特性的方法和系统。 一种方法包括使用检查系统响应来自晶片的光产生输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该方法还包括使用第二输出确定晶片的特性。 一个系统包括检查子系统,该检查子系统配置成照亮晶片并产生响应于来自晶片的光的输出。 输出包括对应于晶片上的缺陷的第一输出和不对应于缺陷的第二输出。 该系统还包括配置成使用第二输出来确定晶片的特性的处理器。

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