Semiconductor device and method for fabricating the same
    1.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08518779B2

    公开(公告)日:2013-08-27

    申请号:US13532170

    申请日:2012-06-25

    IPC分类号: H01L21/336

    摘要: A semiconductor device includes a step-type recess pattern formed in a substrate, a gate electrode buried in the recess pattern and having a gap disposed between the gate electrode and upper sidewalls of the recess pattern, an insulation layer filling the gap, and a source and drain region formed in a portion of the substrate at two sides of the recess pattern. The semiconductor device is able to secure a required data retention time by suppressing the increase of leakage current caused by the reduction of a design rule.

    摘要翻译: 半导体器件包括形成在衬底中的阶梯型凹槽图形,埋入凹槽图案中的栅电极,并且具有设置在凹槽图案的栅极电极和上侧壁之间的间隙,填充间隙的绝缘层和源极 以及在凹部图案的两侧形成在基板的一部分中的漏极区域。 半导体器件能够通过抑制由于设计规则的减少引起的漏电流的增加来确保所需的数据保持时间。

    Semiconductor device and method for fabricating the same
    2.
    发明授权
    Semiconductor device and method for fabricating the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08227859B2

    公开(公告)日:2012-07-24

    申请号:US12492607

    申请日:2009-06-26

    IPC分类号: H01L29/78

    摘要: A semiconductor device includes a step-type recess pattern formed in a substrate, a gate electrode buried in the recess pattern and having a gap disposed between the gate electrode and upper sidewalls of the recess pattern, an insulation layer filling the gap, and a source and drain region formed in a portion of the substrate at two sides of the recess pattern. The semiconductor device is able to secure a required data retention time by suppressing the increase of leakage current caused by the reduction of a design rule.

    摘要翻译: 半导体器件包括形成在衬底中的阶梯型凹槽图形,埋入凹槽图案中的栅电极,并且具有设置在凹槽图案的栅极电极和上侧壁之间的间隙,填充间隙的绝缘层和源极 以及在凹部图案的两侧形成在基板的一部分中的漏极区域。 半导体器件能够通过抑制由于设计规则的减少引起的漏电流的增加来确保所需的数据保持时间。

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20120264266A1

    公开(公告)日:2012-10-18

    申请号:US13532170

    申请日:2012-06-25

    IPC分类号: H01L21/336

    摘要: A semiconductor device includes a step-type recess pattern formed in a substrate, a gate electrode buried in the recess pattern and having a gap disposed between the gate electrode and upper sidewalls of the recess pattern, an insulation layer filling the gap, and a source and drain region formed in a portion of the substrate at two sides of the recess pattern. The semiconductor device is able to secure a required data retention time by suppressing the increase of leakage current caused by the reduction of a design rule.

    摘要翻译: 半导体器件包括形成在衬底中的阶梯型凹槽图形,埋入凹槽图案中的栅电极,并且具有设置在凹槽图案的栅极电极和上侧壁之间的间隙,填充间隙的绝缘层和源极 以及在凹部图案的两侧形成在基板的一部分中的漏极区域。 半导体器件能够通过抑制由于设计规则的减少引起的漏电流的增加来确保所需的数据保持时间。

    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20100001340A1

    公开(公告)日:2010-01-07

    申请号:US12492607

    申请日:2009-06-26

    IPC分类号: H01L29/78 H01L21/336

    摘要: A semiconductor device includes a step-type recess pattern formed in a substrate, a gate electrode buried in the recess pattern and having a gap disposed between the gate electrode and upper sidewalls of the recess pattern, an insulation layer filling the gap, and a source and drain region formed in a portion of the substrate at two sides of the recess pattern. The semiconductor device is able to secure a required data retention time by suppressing the increase of leakage current caused by the reduction of a design rule.

    摘要翻译: 半导体器件包括形成在衬底中的阶梯型凹槽图形,埋入凹槽图案中的栅电极,并且具有设置在凹槽图案的栅极电极和上侧壁之间的间隙,填充间隙的绝缘层和源极 以及在凹部图案的两侧形成在基板的一部分中的漏极区域。 半导体器件能够通过抑制由于设计规则的减少引起的漏电流的增加来确保所需的数据保持时间。

    Method for fabricating semiconductor device with recess gate
    5.
    发明授权
    Method for fabricating semiconductor device with recess gate 失效
    用于制造具有凹槽的半导体器件的方法

    公开(公告)号:US08232166B2

    公开(公告)日:2012-07-31

    申请号:US12614543

    申请日:2009-11-09

    IPC分类号: H01L21/336

    摘要: A semiconductor device includes a substrate with a recess pattern, a gate electrode filling the recess pattern, a threshold voltage adjusting layer formed in the substrate under the recess pattern, a source/drain region formed in the substrate on both sides of the gate electrode and a gate insulation layer, with the recess pattern being disposed between the gate electrode and the substrate, wherein the thickness of the gate insulation layer formed in a region adjacent to the source/drain region is greater than the thickness of the gate insulation layer formed in a region adjacent to the threshold voltage adjusting layer.

    摘要翻译: 半导体器件包括具有凹陷图案的衬底,填充凹陷图案的栅电极,在凹槽图案下形成在衬底中的阈值电压调节层,形成在栅电极两侧的衬底中的源/漏区,以及 栅极绝缘层,其中凹部图案设置在栅电极和衬底之间,其中形成在与源极/漏极区相邻的区域中的栅极绝缘层的厚度大于形成在栅极绝缘层中的栅极绝缘层的厚度 与阈值电压调整层相邻的区域。

    SEMICONDUCTOR DEVICE WITH RECESS GATE AND METHOD FOR FABRICATING THE SAME
    6.
    发明申请
    SEMICONDUCTOR DEVICE WITH RECESS GATE AND METHOD FOR FABRICATING THE SAME 审中-公开
    具有凹槽的半导体器件及其制造方法

    公开(公告)号:US20120261748A1

    公开(公告)日:2012-10-18

    申请号:US13534516

    申请日:2012-06-27

    IPC分类号: H01L29/78

    摘要: A semiconductor device includes a substrate with a recess pattern, a gate electrode filling the recess pattern, a threshold voltage adjusting layer formed in the substrate under the recess pattern, a source/drain region formed in the substrate on both sides of the gate electrode and a gate insulation layer, with the recess pattern being disposed between the gate electrode and the substrate, wherein the thickness of the gate insulation layer formed in a region adjacent to the source/drain region is greater than the thickness of the gate insulation layer formed in a region adjacent to the threshold voltage adjusting layer.

    摘要翻译: 半导体器件包括具有凹陷图案的衬底,填充凹陷图案的栅电极,在凹槽图案下形成在衬底中的阈值电压调节层,形成在栅电极两侧的衬底中的源/漏区,以及 栅极绝缘层,其中凹部图案设置在栅电极和衬底之间,其中形成在与源极/漏极区相邻的区域中的栅极绝缘层的厚度大于形成在栅极绝缘层中的栅极绝缘层的厚度 与阈值电压调整层相邻的区域。

    SEMICONDUCTOR DEVICE WITH RECESS GATE AND METHOD FOR FABRICATING THE SAME
    8.
    发明申请
    SEMICONDUCTOR DEVICE WITH RECESS GATE AND METHOD FOR FABRICATING THE SAME 失效
    具有凹槽的半导体器件及其制造方法

    公开(公告)号:US20100258861A1

    公开(公告)日:2010-10-14

    申请号:US12614543

    申请日:2009-11-09

    IPC分类号: H01L29/78 H01L21/336

    摘要: A semiconductor device includes a substrate with a recess pattern, a gate electrode filling the recess pattern, a threshold voltage adjusting layer formed in the substrate under the recess pattern, a source/drain region formed in the substrate on both sides of the gate electrode and a gate insulation layer, with the recess pattern being disposed between the gate electrode and the substrate, wherein the thickness of the gate insulation layer formed in a region adjacent to the source/drain region is greater than the thickness of the gate insulation layer formed in a region adjacent to the threshold voltage adjusting layer.

    摘要翻译: 半导体器件包括具有凹陷图案的衬底,填充凹陷图案的栅电极,在凹槽图案下形成在衬底中的阈值电压调节层,形成在栅电极两侧的衬底中的源/漏区,以及 栅极绝缘层,其中凹部图案设置在栅电极和衬底之间,其中形成在与源极/漏极区相邻的区域中的栅极绝缘层的厚度大于形成在栅极绝缘层中的栅极绝缘层的厚度 与阈值电压调整层相邻的区域。