POLYAMIC ACID, POLYIMIDE, POLYAMIC ACID SOLUTION, AND USE OF POLYIMIDE
    1.
    发明申请
    POLYAMIC ACID, POLYIMIDE, POLYAMIC ACID SOLUTION, AND USE OF POLYIMIDE 有权
    聚酰亚胺,聚酰亚胺,聚酰胺溶液和聚酰亚胺的用途

    公开(公告)号:US20150183931A1

    公开(公告)日:2015-07-02

    申请号:US14409126

    申请日:2013-06-25

    Abstract: The object of the present invention is to obtain the polyimide and the polyamic acid excellent in heat resistance, low thermal expansion property, and transparency and achieve low birefringence and to provide a product or a member, demanded to have high heat resistance and transparency, by using the polyimide or the polyamic acid. In particular, the object is to provide a product and a member in which the polyimide or the polyamic acid of the present invention is formed on a surface of an inorganic substance such as glass, metal, a metal oxide, or a single crystal silicon. The objects are attained by introducing a rigid structure and an alicyclic structure into a skeleton and using a monomer having a fluorene skeleton together.

    Abstract translation: 本发明的目的是获得耐热性,低热膨胀性和透明性优异的聚酰亚胺和聚酰胺酸,并且实现低双折射并提供要求具有高耐热性和透明性的产品或部件,通过 使用聚酰亚胺或聚酰胺酸。 特别是,本发明的目的在于提供一种在玻璃,金属,金属氧化物或单晶硅等无机物质的表面上形成本发明的聚酰亚胺或聚酰胺酸的物质和成分。 通过将刚性结构和脂环结构引入骨架并使用具有芴骨架的单体在一起来实现。

    RETARDATION FILM
    2.
    发明申请
    RETARDATION FILM 审中-公开

    公开(公告)号:US20200025989A1

    公开(公告)日:2020-01-23

    申请号:US16583814

    申请日:2019-09-26

    Abstract: Provided are: a novel retardation film which has low photoelastic coefficient, while having good linear thermal expansion coefficient and water absorption; and the novel retardation film which additionally has high heat resistance. The above-described problem is solved by a retardation film which has an absolute value of the linear thermal expansion coefficient of 100 ppm/° C. or less, a glass transition temperature of 180° C. or more, a photoelastic coefficient of from 5×10−12 m2/N to 30×10−12 m2/N and a water absorption of 2.0 wt % or less, or a retardation film which has an absolute value of the linear thermal expansion coefficient of 100 ppm/° C. or less, a photoelastic coefficient of from 5×10−12 m2/N to 30×10−12 m2/N and a water absorption of 2.0 wt % or less.

    Polyamic acid, polyimide, polyamic acid solution, and use of polyimide
    6.
    发明授权
    Polyamic acid, polyimide, polyamic acid solution, and use of polyimide 有权
    聚酰胺酸,聚酰亚胺,聚酰胺酸溶液,以及聚酰亚胺的用途

    公开(公告)号:US09353223B2

    公开(公告)日:2016-05-31

    申请号:US14409126

    申请日:2013-06-25

    Abstract: The object of the present invention is to obtain the polyimide and the polyamic acid excellent in heat resistance, low thermal expansion property, and transparency and achieve low birefringence and to provide a product or a member, demanded to have high heat resistance and transparency, by using the polyimide or the polyamic acid. In particular, the object is to provide a product and a member in which the polyimide or the polyamic acid of the present invention is formed on a surface of an inorganic substance such as glass, metal, a metal oxide, or a single crystal silicon. The objects are attained by introducing a rigid structure and an alicyclic structure into a skeleton and using a monomer having a fluorene skeleton together.

    Abstract translation: 本发明的目的是获得耐热性,低热膨胀性和透明性优异的聚酰亚胺和聚酰胺酸,并且实现低双折射并提供要求具有高耐热性和透明性的产品或部件,通过 使用聚酰亚胺或聚酰胺酸。 特别是,本发明的目的在于提供一种在玻璃,金属,金属氧化物或单晶硅等无机物质的表面上形成本发明的聚酰亚胺或聚酰胺酸的物质和成分。 通过将刚性结构和脂环结构引入骨架并使用具有芴骨架的单体在一起来实现。

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