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公开(公告)号:US20220336493A1
公开(公告)日:2022-10-20
申请号:US17854072
申请日:2022-06-30
Applicant: Kioxia Corporation
Inventor: Yuta SAITO , Shinji MORI , Keiichi SAWA , Kazuhisa MATSUDA , Kazuhiro MATSUO , Hiroyuki YAMASHITA
IPC: H01L27/11582 , H01L21/324 , H01L23/532 , H01L21/28
Abstract: A semiconductor device includes a semiconductor layer containing metal atoms, a charge storage layer provided on a surface of the semiconductor layer via a first insulating film, and an electrode layer provided on a surface of the charge storage layer via a second insulating film. The thickness of the first insulating film is 5 nm or more and 10 nm or less. The concentration of the metal atoms in the semiconductor layer is 5.0×1017 [EA/cm3] or higher and 1.3×1020 [EA/cm3] or lower.
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公开(公告)号:US20220246640A1
公开(公告)日:2022-08-04
申请号:US17659881
申请日:2022-04-20
Applicant: KIOXIA CORPORATION
Inventor: Keiichi SAWA , Kazuhiro MATSUO , Kazuhisa MATSUDA , Hiroyuki YAMASHITA , Yuta SAITO , Shinji MORI , Masayuki TANAKA , Kenichiro TORATANI , Atsushi TAKAHASHI , Shouji HONDA
IPC: H01L27/11582 , H01L27/11578 , H01L27/11519
Abstract: In one embodiment, a semiconductor device includes a substrate, insulating films and first films alternately stacked on the substrate, at least one of the first films including an electrode layer and a charge storage layer provided on a face of the electrode layer via a first insulator, and a semiconductor layer provided on a face of the charge storage layer via a second insulator. The device further includes at least one of a first portion including nitrogen and provided between the first insulator and the charge storage layer with an air gap provided in the first insulator, a second portion including nitrogen, provided between the charge storage layer and the second insulator, and including a portion protruding toward the charge storage layer, and a third portion including nitrogen and provided between the second insulator and the semiconductor layer with an air gap provided in the first insulator.
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