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公开(公告)号:US12165306B2
公开(公告)日:2024-12-10
申请号:US17203719
申请日:2021-03-16
Applicant: KLA Corporation
Inventor: Manikandan Mariyappan , Jin Qian , Zhuang Liu , Xiaochun Li , Siqing Nie
Abstract: A rendered image is generated from a semiconductor device design file. The rendered image is segmented based on a grey level of the rendered image. Care areas are determined based on the segmenting. Defect inspection is performed in the care areas. This process can be performed on a wafer inspection tool that uses photon optics or electron beam optics.
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公开(公告)号:US20220301133A1
公开(公告)日:2022-09-22
申请号:US17203719
申请日:2021-03-16
Applicant: KLA Corporation
Inventor: Manikandan Mariyappan , Jin Qian , Zhuang Liu , Xiaochun Li , Siqing Nie
Abstract: A rendered image is generated from a semiconductor device design file. The rendered image is segmented based on a grey level of the rendered image. Care areas are determined based on the segmenting. Defect inspection is performed in the care areas. This process can be performed on a wafer inspection tool that uses photon optics or electron beam optics.
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公开(公告)号:US20220076973A1
公开(公告)日:2022-03-10
申请号:US17356473
申请日:2021-06-23
Applicant: KLA Corporation
Inventor: Zhuang Liu , Weifeng Zhou
Abstract: Location-based binning can separate defects on different rows of channel holes in a 3D NAND structure to corresponding bins. A one-dimensional projection of an image is generated and a one-dimensional curve is formed. A mask is generated from the one-dimensional curve. Defects in the image are detected using the mask and location-based binning is performed.
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公开(公告)号:US11494895B2
公开(公告)日:2022-11-08
申请号:US17003452
申请日:2020-08-26
Applicant: KLA Corporation
Inventor: Siqing Nie , Chunwei Song , Zhuang Liu , Weifeng Zhou
IPC: G01N21/95 , G06T7/00 , G01N23/2251
Abstract: Methods and systems for detecting defects in an array region on a specimen are provided. One method includes determining a center of a page break in output generated by an inspection subsystem for a specimen in an array region. The page break separates cell regions in the array region, and the cell regions include repeating patterned features. The method also includes determining an offset between the center of the page break in the output and a center of the page break in a design for the specimen and identifying portions of the output that correspond to care areas in the array region based on the offset. In addition, the method includes detecting defects in the array region by applying a defect detection method to the portions of the output that correspond to the care areas.
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公开(公告)号:US11798828B2
公开(公告)日:2023-10-24
申请号:US17356473
申请日:2021-06-23
Applicant: KLA Corporation
Inventor: Zhuang Liu , Weifeng Zhou
CPC classification number: H01L21/67288 , G03F7/7065 , G06T7/0004 , G06T7/73 , G06T2207/30148
Abstract: Location-based binning can separate defects on different rows of channel holes in a 3D NAND structure to corresponding bins. A one-dimensional projection of an image is generated and a one-dimensional curve is formed. A mask is generated from the one-dimensional curve. Defects in the image are detected using the mask and location-based binning is performed.
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公开(公告)号:US20210256675A1
公开(公告)日:2021-08-19
申请号:US17003452
申请日:2020-08-26
Applicant: KLA Corporation
Inventor: Siqing Nie , Chunwei Song , Zhuang Liu , Weifeng Zhou
IPC: G06T7/00 , G01N21/95 , G01N23/2251
Abstract: Methods and systems for detecting defects in an array region on a specimen are provided. One method includes determining a center of a page break in output generated by an inspection subsystem for a specimen in an array region. The page break separates cell regions in the array region, and the cell regions include repeating patterned features. The method also includes determining an offset between the center of the page break in the output and a center of the page break in a design for the specimen and identifying portions of the output that correspond to care areas in the array region based on the offset. In addition, the method includes detecting defects in the array region by applying a defect detection method to the portions of the output that correspond to the care areas.
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