公开(公告)号：US20240314928A1

公开(公告)日：2024-09-19

申请号：US18581441

申请日：2024-02-20

Applicant: KYOCERA AVX Components Corporation

Inventor： Cory Nelson ,  Ronald Demcko ,  Jeff Borgman

IPC: H05K1/11 ,  H01P1/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K1/111 ,  H01P1/20 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/0047 ,  H05K3/0064 ,  H05K3/0067 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09981 ,  H05K2201/1006 ,  H05K2203/025 ,  H05K2203/1461

Abstract: Components, methods of forming components, and methods of assembling components on an electronic device are provided. For example, a method of forming a component includes providing a first substrate having a first surface, a second surface opposite the first surface along a height direction, and an initial thickness from the first surface to the second surface along the height direction; forming one or more vias in the first substrate, each via extending from the first surface to the second surface of the first substrate; depositing one or more conductive pathways on the first surface of the first substrate; plating the one or more vias; disposing a second substrate on the first surface of the first substrate to form a component sandwich; processing the second surface of the first substrate to reduce a thickness of the component sandwich; and forming one or more contact pads on the first substrate.

公开(公告)号：US20240292540A1

公开(公告)日：2024-08-29

申请号：US18582750

申请日：2024-02-21

Applicant: KYOCERA AVX Components Corporation

Inventor： Ronald Demcko ,  Cory Nelson ,  Marianne Berolini

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/18 ,  H05K1/0203 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10393 ,  H05K2201/10522 ,  H05K2201/1053

Abstract: The present disclosure provides multicomponent connector assemblies and methods of forming such assemblies. For example, a multicomponent connector assembly includes a multicomponent connector having first and support members and also includes a plurality of components disposed between the first and second support members. At least one of the plurality of components may be a heat sink component configured to conduct heat from a first area to a second area. Additionally, or alternatively, the plurality of components may include a capacitor, a resistor, a varistor, an inductor, or the like. In at least some connectors, a plurality of slots are defined, and at least one component is disposed between the first and support members in a respective one slot of the plurality of slots.

公开(公告)号：US20240032185A1

公开(公告)日：2024-01-25

申请号：US18350782

申请日：2023-07-12

Applicant: KYOCERA AVX Components Corporation

Inventor： Cory Nelson ,  Marianne Berolini ,  Ronald Demcko

IPC: H05K1/02

CPC classification number: H05K1/021 ,  H05K2201/10757 ,  H05K2201/10537 ,  H05K2201/066

Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a surface of the body. At least one second terminal can be formed over the surface of the body. A terminal spacing distance can be defined along the surface between the first terminal and the second terminal. A ratio of a length of the surface to the terminal spacing distance can be greater than about 10. Additionally or alternatively, a ratio of the area of the at least one body surface to the total terminal area can be less than 1.2. A component assembly can include a device having a plurality of terminals exposed on a top surface, and the heat source terminal and the heat sink terminal of the heat sink component can be connected with respective terminals of the device.