Cover and method of manufacturing the same
    3.
    发明申请
    Cover and method of manufacturing the same 审中-公开
    封面及其制造方法

    公开(公告)号:US20100295286A1

    公开(公告)日:2010-11-25

    申请号:US12800474

    申请日:2010-05-13

    IPC分类号: B42D3/02 B29C44/06

    CPC分类号: G06K19/07749 B42D3/12

    摘要: An electronic cover for a passport, booklet or the like includes an electronic device and a layer of cover material that are bonded together by a fill-up adhesive layer, the electronic device preferably being in the form of an RFID inlay that includes a substrate, an antenna coupled to the substrate and an integrated circuit (IC) chip module conductively coupled to the antenna. During manufacture of the cover, the fill-up adhesive layer is applied to at least one of the electronic device and the layer of cover material. Immediately thereafter, the electronic device and the layer of cover material are held spaced apart from one another a predefined distance so as to define a void therebetween. Through a suitable trigger, the fill-up adhesive layer expands to fill in the entire void and subsequently cures to bond the electronic device to the layer of cover material.

    摘要翻译: 用于护照,小册子等的电子盖包括通过填充粘合剂层结合在一起的电子装置和覆盖材料层,电子装置优选地为包括基板的RFID嵌体的形式, 耦合到衬底的天线以及与天线导电耦合的集成电路(IC)芯片模块。 在盖的制造期间,将填充粘合剂层施加到电子装置和覆盖材料层中的至少一个。 此后,电子设备和覆盖材料层彼此间隔开预定距离,以便在它们之间形成空隙。 通过合适的触发器,填充粘合剂层膨胀以填充整个空隙,随后固化以将电子装置粘合到覆盖材料层。