公开(公告)号：US08020264B2

公开(公告)日：2011-09-20

申请号：US12794180

申请日：2010-06-04

申请人： Kiyoshi Aratake ,  Yasuo Kawada

发明人： Kiyoshi Aratake ,  Yasuo Kawada

IPC分类号： H04R17/00 ,  H05K3/10

CPC分类号： H03H9/1021 ,  H03H9/21 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49798

摘要： There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.

摘要翻译： 提供了制造压电振动器1的方法。该方法包括通孔35和36的方法，其通过基底晶片，使得通孔的开口朝向空腔C的凹部的外侧开口; 用相同的导电材料在基底晶片的上表面上构图接合层30，成对安装层和成对的引出电极层33和34的工艺; 以及通过在两个晶片之后用激光照射形成在通孔36的接合层和开口之间的引出电极层34的部分（区域S2），使中间的引出电极层34电隔离的工艺 相互阳极结合。 接合层30围绕凹部，这些安装层位于凹部中，并且成对的引出电极层33和34将成对的安装层电连接到接合层。

公开(公告)号：US20100236038A1

公开(公告)日：2010-09-23

申请号：US12791286

申请日：2010-06-01

申请人： Kiyoshi Aratake ,  Yasuo Kawada

发明人： Kiyoshi Aratake ,  Yasuo Kawada

IPC分类号： H04R17/00 ,  H01L41/053

CPC分类号： H03H3/02 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42

摘要： There is There is provided a method of manufacturing a package 1 having a base substrate 10 and a lid substrate 20 bonded to each other and both formed of a glass base material; and a cavity C formed between the both substrates for storing an encapsulated object 2 in a state of being hermetically encapsulated, including: a depression forming step for forming a depression C1 for a cavity which defines the cavity when the both substrates are superimposed to each other on at least one of the both substrates; and a bonding step for superimposing the both substrates so as to store the encapsulated object in the depression and then bonding the both substrates to encapsulate the encapsulated object in the cavity, characterized in that in the depression forming step, printed layers 12 are laminated on an upper surface of a flat plate-shaped glass base material 11 in a frame shape in plan view by screen printing, and then the printed layers and the glass base material are baked at the same time to form the depression.

摘要翻译： 提供了一种制造包装1的方法，该包装1具有彼此接合并且都由玻璃基材形成的基底10和盖基底20; 以及形成在两个基板之间的空腔C，用于以密封的状态存储被封装物体2，包括：凹陷形成步骤，用于在两个基板彼此叠置时形成限定空腔的空腔的凹陷C1 在两个基材中的至少一个上; 以及结合步骤，用于叠加两个基板，以将封装物体存储在凹陷中，然后将两个基板接合以将封装物体封装在空腔中，其特征在于，在凹陷形成步骤中，将印刷层12层压在 通过丝网印刷在平面图中以平板状的平板状玻璃基材11的上表面，然后同时烘烤印刷层和玻璃基材以形成凹陷。

公开(公告)号：US08013499B2

公开(公告)日：2011-09-06

申请号：US12791286

申请日：2010-06-01

申请人： Kiyoshi Aratake ,  Yasuo Kawada

发明人： Kiyoshi Aratake ,  Yasuo Kawada

IPC分类号： H01L41/04 ,  H01L41/08

CPC分类号： H03H3/02 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42

摘要： There is provided a method of manufacturing a package 1 having a base substrate 10 and a lid substrate 20 bonded to each other and both formed of a glass base material; and a cavity C formed between the both substrates for storing an encapsulated object 2 in a state of being hermetically encapsulated, including: a depression forming step for forming a depression C1 for a cavity which defines the cavity when the both substrates are superimposed to each other on at least one of the both substrates; and a bonding step for superimposing the both substrates so as to store the encapsulated object in the depression and then bonding the both substrates to encapsulate the encapsulated object in the cavity, characterized in that in the depression forming step, printed layers 12 are laminated on an upper surface of a flat plate-shaped glass base material 11 in a frame shape in plan view by screen printing, and then the printed layers and the glass base material are baked at the same time to form the depression.

摘要翻译： 提供一种制造封装1的方法，该封装1具有彼此接合且均由玻璃基材形成的基底基板10和盖基板20; 以及形成在两个基板之间的空腔C，用于以密封的状态存储被封装物体2，包括：凹陷形成步骤，用于在两个基板彼此叠置时形成限定空腔的空腔的凹陷C1 在两个基材中的至少一个上; 以及结合步骤，用于叠加两个基板，以将封装物体存储在凹陷中，然后将两个基板接合以将封装物体封装在空腔中，其特征在于，在凹陷形成步骤中，将印刷层12层压在 通过丝网印刷在平面图中以平板状的平板状玻璃基材11的上表面，然后同时烘烤印刷层和玻璃基材以形成凹陷。

公开(公告)号：US20100313399A1

公开(公告)日：2010-12-16

申请号：US12860570

申请日：2010-08-20

申请人： Kiyoshi ARATAKE ,  Yasuo Kawada

发明人： Kiyoshi ARATAKE ,  Yasuo Kawada

IPC分类号： H01L41/22

CPC分类号： H03H9/1021 ,  H03H3/02 ,  H03H9/0542 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42

摘要： When a base substrate where through electrodes are formed is anodically bonded to a lid substrate that includes a bonding film formed on the entire lower surface thereof, a method of manufacturing a piezoelectric vibrator includes a superimposing process for superimposing the lid substrate on the base substrate so that a piezoelectric vibrating reed is received in a cavity, after bonding the piezoelectric vibrating reed to the upper surface of the base substrate; a setting process for placing a dummy member, which is made of a material in which ions can be transferred at a bonding temperature, on an electrode plate, and placing the superimposed substrates on the dummy member so that the base substrate faces the dummy member; and an applying process for applying a bonding voltage between the electrode plate and the bonding film after heating the dummy member and the substrates up to the bonding temperature.

摘要翻译： 当形成贯通电极的基底基板阳极接合到包括形成在其整个下表面上的接合膜的盖基板时，压电振动器的制造方法包括用于将盖基板叠加在基底基板上的叠加处理 在将压电振动片接合到基底基板的上表面之后，将压电振动片接收在空腔中; 用于将由接合温度下的离子可以转移的材料制成的虚拟构件放置在电极板上，并将叠置的基板放置在虚拟构件上使得基底朝向假构件的设定处理; 以及在将虚拟构件和基板加热至接合温度之后，在电极板和接合膜之间施加接合电压的施加处理。

公开(公告)号：US20100237740A1

公开(公告)日：2010-09-23

申请号：US12794180

申请日：2010-06-04

申请人： Kiyoshi Aratake ,  Yasuo Kawada

发明人： Kiyoshi Aratake ,  Yasuo Kawada

IPC分类号： H01L41/053 ,  H01L41/04 ,  H01L41/22

CPC分类号： H03H9/1021 ,  H03H9/21 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49798

摘要： There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.

摘要翻译： 提供了制造压电振动器1的方法。该方法包括通孔35和36的方法，其通过基底晶片，使得通孔的开口朝向空腔C的凹部的外侧开口; 用相同的导电材料在基底晶片的上表面上构图接合层30，成对安装层和成对的引出电极层33和34的工艺; 以及通过在两个晶片之后用激光照射形成在通孔36的接合层和开口之间的引出电极层34的部分（区域S2），使中间的引出电极层34电隔离的工艺 相互阳极结合。 接合层30围绕凹部，这些安装层位于凹部中，并且成对的引出电极层33和34将成对的安装层电连接到接合层。

公开(公告)号：US08448311B2

公开(公告)日：2013-05-28

申请号：US12860570

申请日：2010-08-20

申请人： Kiyoshi Aratake ,  Yasuo Kawada

发明人： Kiyoshi Aratake ,  Yasuo Kawada

IPC分类号： H04R17/10

CPC分类号： H03H9/1021 ,  H03H3/02 ,  H03H9/0542 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42

摘要： When a base substrate where through electrodes are formed is anodically bonded to a lid substrate that includes a bonding film formed on the entire lower surface thereof, a method of manufacturing a piezoelectric vibrator includes a superimposing process for superimposing the lid substrate on the base substrate so that a piezoelectric vibrating reed is received in a cavity, after bonding the piezoelectric vibrating reed to the upper surface of the base substrate; a setting process for placing a dummy member, which is made of a material in which ions can be transferred at a bonding temperature, on an electrode plate, and placing the superimposed substrates on the dummy member so that the base substrate faces the dummy member; and an applying process for applying a bonding voltage between the electrode plate and the bonding film after heating the dummy member and the substrates up to the bonding temperature.

摘要翻译： 当形成贯通电极的基底基板阳极接合到包括形成在其整个下表面上的接合膜的盖基板时，压电振动器的制造方法包括用于将盖基板叠加在基底基板上的叠加处理 在将压电振动片接合到基底基板的上表面之后，将压电振动片接收在空腔中; 用于将由接合温度下的离子可以转移的材料制成的虚拟构件放置在电极板上，并将叠置的基板放置在虚拟构件上使得基底朝向假构件的设定处理; 以及在将虚拟构件和基板加热至接合温度之后，在电极板和接合膜之间施加接合电压的施加处理。

公开(公告)号：US07872404B2

公开(公告)日：2011-01-18

申请号：US12328130

申请日：2008-12-04

申请人： Masashi Numata ,  Yasuo Kawada

发明人： Masashi Numata ,  Yasuo Kawada

IPC分类号： H01L41/08 ,  H03H9/215

CPC分类号： H03B5/30 ,  H03H9/1021 ,  H03H9/21 ,  Y10T29/42

摘要： A piezoelectric vibrating reed includes a piezoelectric plate made of a piezoelectric material, a pair of exciter electrodes formed on outer surfaces of the piezoelectric plate and configured to vibrate the piezoelectric plate when a predetermined voltage is applied thereon, and a pair of mount electrodes electrically connected to the pair of exciter electrodes, respectively. One mount electrode in the pair of mount electrodes is formed on one surface (under surface) of the piezoelectric plate and the other mount electrode is formed on the other surface (top surface) of the piezoelectric plate in a state not to oppose the one mount electrode with the piezoelectric plate in between. Accordingly, not only can power be saved, but also higher performance can be achieved by lowering the R1 characteristic and thereby enhancing the vibration characteristic.

摘要翻译： 压电振动片包括由压电材料制成的压电板，形成在压电板的外表面上的一对激励器电极，用于在施加预定电压时使压电板振动，并且一对安装电极电连接 分别对该激励电极。 在一对安装电极中的一个安装电极形成在压电板的一个表面（下表面）上，另一个安装电极形成在压电板的另一个表面（上表面）上，而不与一个安装座 电极之间带有压电板。 因此，不仅可以节省电力，而且可以通过降低R1特性从而提高振动特性来实现更高的性能。

公开(公告)号：US06478919B1

公开(公告)日：2002-11-12

申请号：US09576913

申请日：2000-05-23

申请人： Yasuo Kawada ,  Tsutomu Inose ,  Takashi Setsuda ,  Tatsuo Tanaka

发明人： Yasuo Kawada ,  Tsutomu Inose ,  Takashi Setsuda ,  Tatsuo Tanaka

IPC分类号： B32B3112

CPC分类号： B32B43/006 ,  B29C63/02 ,  B32B38/162 ,  B32B2309/65 ,  H01J9/20 ,  H01J2209/015 ,  Y10T156/14 ,  Y10T156/17 ,  Y10T156/1788

摘要： A functional film sticking apparatus includes: a separator peeling unit for peeling a separator from a functional film having the separator stuck on the functional film via an adhesive; a functional film sticking unit for sticking the functional film, from which the separator has been peeled by the separator peeling unit, on a panel surface; and a film fixing portion for carrying the functional film at least from the separator peeling unit to the functional film sticking unit while holding the functional film by suction, the film fixing portion being provided with a roller for sticking the functional film. The separator peeling unit is provided with a suction device for sucking, upon peeling the separator from the functional film, the atmosphere at the portion to be peeled and its neighborhood, or is provided with an electrostatic eraser for removing, upon peeling the separator from the functional film, electrostatic charges at the portion to be peeled and its neighborhood. With this apparatus, it is possible to reduce the entrapment of air and foreign matters upon sticking a functional film on a product and hence to improve the quality of the product on which the function film has been stuck.

摘要翻译： 功能膜贴附装置包括：剥离单元，用于通过粘合剂将具有分隔件粘附在功能膜上的功能膜剥离隔膜; 功能膜粘贴单元，用于将隔膜已经被隔膜剥离单元剥离的功能膜粘附在面板表面上; 以及膜固定部，用于在通过抽吸保持功能膜的同时将功能膜至少从分离器剥离单元运送到功能膜粘贴单元，膜固定部设置有用于粘附功能膜的辊。 分离器剥离单元设置有用于在从功能膜剥离隔板时吸附待吸附的部分的气氛及其附近的抽吸装置，或者在从隔板剥离时提供用于除去的静电橡皮擦 功能膜，待剥离部分的静电电荷及其附近。 利用这种装置，可以在产品上粘贴功能膜时减少空气和异物的夹带，从而提高功能膜已被卡住的产品的质量。

公开(公告)号：US5626277A

公开(公告)日：1997-05-06

申请号：US516823

申请日：1995-08-18

申请人： Yasuo Kawada

发明人： Yasuo Kawada

IPC分类号： B23K3/06 ,  H01L21/60 ,  H01L23/12 ,  H05K3/34 ,  B23K3/00

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2201/40 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05K2203/041 ,  H05K2203/081 ,  H05K2203/082

摘要： A solder-ball mounting apparatus is provided with a ball feed jig having a ball tank that may receive a predetermined number of solder-balls for feeding the solder-balls to a ball suction jig through a guide mask mounted on an opening portion of the ball tank, and blowout holes formed in a bottom of the ball tank for a blow gas as a blow unit for agitating the solder-balls received in the ball tank in the ball feed jig. The solder-balls may be positively sucked to ball suction holes one by one without turning over the ball suction jig.

摘要翻译： 焊球安装装置设置有球进给夹具，其具有球罐，该球罐可以接收预定数量的焊球，用于通过安装在球的开口部分上的引导掩模将焊球馈送到球吸入夹具 罐和吹出孔形成在球罐的底部，用于吹气，作为用于搅拌容纳在球罐送入夹具中的球罐的焊球的吹塑单元。 焊球可以一个接一个地被吸引到球吸入孔，而不会转过球吸引夹具。

公开(公告)号：US5434650A

公开(公告)日：1995-07-18

申请号：US163760

申请日：1993-12-09

申请人： Kazuyuki Nakahara ,  Tomofumi Harada ,  Yasunari Hashimoto ,  Yasuo Kawada ,  Osamu Kizaki

发明人： Kazuyuki Nakahara ,  Tomofumi Harada ,  Yasunari Hashimoto ,  Yasuo Kawada ,  Osamu Kizaki

IPC分类号： G03G21/00 ,  G03G15/00 ,  G03G21/02 ,  H04M11/00 ,  H04N1/00

CPC分类号： G03G15/5079 ,  G03G15/502 ,  G03G15/55 ,  G03G2215/00113

摘要： An image forming unit management system includes: an image forming unit; a communication control unit for connecting the image forming unit to a management unit via a communication line to transmit a message from the image forming unit to the management unit and to transmit a response message from the management unit to the image forming unit; a storage part for storing a plurality of message codes respectively indicating a plurality of message types; an operation part for inputting a message type and a request for transmitting a message of the message type to the management unit; a first control part for setting one of the plurality of message codes that corresponds to the input message type and for transmitting a message including the message code to the communication control unit if the request is inputted from the operation part; and a second control part for transmitting the message, received from the first control part, to the management unit, and for transmitting a response message to the image forming unit if the response message is received from the management unit.

摘要翻译： 图像形成单元管理系统包括：图像形成单元; 通信控制单元，用于经由通信线路将图像形成单元连接到管理单元，以将消息从图像形成单元发送到管理单元，并将响应消息从管理单元发送到图像形成单元; 存储部分，用于存储分别指示多个消息类型的多个消息代码; 用于输入消息类型的操作部分和用于向所述管理单元发送所述消息类型的消息的请求; 第一控制部分，用于设置与所述输入消息类型相对应的所述多个消息代码中的一个，并且如果所述请求是从所述操作部分输入的，则向所述通信控制单元发送包括所述消息代码的消息; 以及第二控制部分，用于将从第一控制部分接收的消息发送到管理单元，并且如果从管理单元接收到响应消息，则将响应消息发送到图像形成单元。