公开(公告)号：US20120247658A1

公开(公告)日：2012-10-04

申请号：US13429879

申请日：2012-03-26

申请人： Yasuo Kawada

发明人： Yasuo Kawada

IPC分类号： B32B38/04 ,  C03B33/02

CPC分类号： C03B33/033 ,  C03B33/0222 ,  C03B33/037 ,  C03B33/076 ,  C03B33/0855 ,  G04R20/10 ,  H03H3/04 ,  H03H9/1021 ,  H03H2003/0492 ,  Y02P40/57 ,  Y10T156/1052 ,  Y10T225/12

摘要： Disclosed is a glass body cutting method for cutting a glass body along a planned cutting line, the method including: a groove forming process of forming a groove on one surface of the glass body along the planned cutting line by irradiation of a laser light along the planned cutting line; an attachment process of attaching an adhesive sheet to the one surface to cover at least the groove, after the groove forming process; and a cutting process of cutting the glass body along the planned cutting line by applying a tear stress along the planned cutting line while pressing a cutting blade against the other surface of the glass body in a state where the glass body is disposed on a supporting section through the adhesive sheet, after the attachment process.

摘要翻译： 本发明公开了一种沿着规划切割线切割玻璃体的玻璃体切割方法，其特征在于，包括：沿着所述规划切割线在所述玻璃体的一个面上沿着沿着所述切割线的激光的照射形成凹槽的槽形成工序 规划切割线; 在槽形成处理之后，将粘合片附着到所述一个表面以覆盖至少所述凹槽的附接过程; 以及在玻璃体设置在支撑部上的状态下，通过沿着规划切割线施加撕裂应力而切割玻璃体的切割过程，同时将切割刀片压靠在玻璃体的另一个表面上 通过粘合片，在附着过程之后。

公开(公告)号：US20120228744A1

公开(公告)日：2012-09-13

申请号：US13411969

申请日：2012-03-05

申请人： Yasuo Kawada

发明人： Yasuo Kawada

IPC分类号： H01L27/06 ,  H01L21/78

CPC分类号： H03H9/1021 ,  H01L2224/16225 ,  H03H3/04 ,  H03H9/0519 ,  H03H9/21 ,  H03H2003/026 ,  H03H2003/0478 ,  H03H2003/0492

摘要： To provide a wafer in which out-gas emitted between wafers during bonding of the wafers can be easily discharged to the outside and the bonded wafers can be favorably cut to improve the yields, and a method of manufacturing a package product using the wafer. A groove portion is formed in a wafer for lid substrate along a plurality of imaginary straight lines passing through a center in a diameter direction of the wafer for lid substrate and extending in the diameter direction. The groove portion is divided into a plurality of groove portions in the diameter direction placed such that the groove portions are not in contact with each other.

摘要翻译： 为了提供晶片，其中在晶片接合期间在晶片之间发射的气体可以容易地排放到外部，并且可以有利地切割结合的晶片以提高产量，以及使用该晶片制造封装产品的方法。 沿着通过盖基板的晶圆的直径方向的中心的多个假想直线，沿着直径方向延伸的方式，在用于盖基板的晶片中形成有槽部。 槽部被分割成直径方向的多个槽部，使得槽部彼此不接触。

公开(公告)号：US20110284148A1

公开(公告)日：2011-11-24

申请号：US13204376

申请日：2011-08-05

申请人： Yasuo Kawada

发明人： Yasuo Kawada

IPC分类号： B32B37/02 ,  B32B41/00 ,  B32B37/10

CPC分类号： C03C27/06

摘要： An anodic bonding method for anodically bonding a first substrate and a second substrate includes: a substrate placement step in which the first substrate and the second substrate are stacked and placed on a flat surface of a base with a surface of one of the first substrate and the second substrate to be cathode in contact with the flat surface of the base; a jig placement step, following the substrate placement step, in which the anodic bonding jig is placed so as to be in contact with a surface of one of the first substrate and the second substrate to be anode, the anodic bonding jig having a visual checking area formed of a material that allows visible light to pass through; an alignment step in which the relative positional relation between the first substrate and the second substrate is adjusted based on visible light passing through the visual checking area so that pairs of marks provided on the first substrate and the second substrate will be in a predetermined positional relation; a pressurizing step in which the base and the anodic bonding jig are pressurized in the direction to move the base and the anodic bonding jig close to each other, and the first substrate and the second substrate are sandwiched; and an application step in which a DC voltage is applied between the first substrate and the second substrate.

摘要翻译： 用于阳极结合第一基板和第二基板的阳极接合方法包括：基板放置步骤，其中第一基板和第二基板被堆叠并放置在基板的平坦表面上，其中第一基板和第二基板的表面之一 所述第二基板为与所述基板的平坦表面接触的阴极; 夹具放置步骤，在所述基板放置步骤之后，将所述阳极接合夹具放置成与所述第一基板和所述第二基板中的一个的表面接触为阳极，所述阳极接合夹具具有目视检查 由允许可见光通过的材料形成的区域; 基于通过目视检查区域的可见光来调整第一基板和第二基板之间的相对位置关系的对准步骤，使得设置在第一基板和第二基板上的一对标记将处于预定的位置关系 ; 将底座和阳极接合夹具沿使底座和阳极接合夹具移动的方向加压的加压工序，将第一基板和第二基板夹持; 以及在第一基板和第二基板之间施加直流电压的施加步骤。

公开(公告)号：US08020264B2

公开(公告)日：2011-09-20

申请号：US12794180

申请日：2010-06-04

申请人： Kiyoshi Aratake ,  Yasuo Kawada

发明人： Kiyoshi Aratake ,  Yasuo Kawada

IPC分类号： H04R17/00 ,  H05K3/10

CPC分类号： H03H9/1021 ,  H03H9/21 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49798

摘要： There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.

摘要翻译： 提供了制造压电振动器1的方法。该方法包括通孔35和36的方法，其通过基底晶片，使得通孔的开口朝向空腔C的凹部的外侧开口; 用相同的导电材料在基底晶片的上表面上构图接合层30，成对安装层和成对的引出电极层33和34的工艺; 以及通过在两个晶片之后用激光照射形成在通孔36的接合层和开口之间的引出电极层34的部分（区域S2），使中间的引出电极层34电隔离的工艺 相互阳极结合。 接合层30围绕凹部，这些安装层位于凹部中，并且成对的引出电极层33和34将成对的安装层电连接到接合层。

公开(公告)号：US20100236038A1

公开(公告)日：2010-09-23

申请号：US12791286

申请日：2010-06-01

申请人： Kiyoshi Aratake ,  Yasuo Kawada

发明人： Kiyoshi Aratake ,  Yasuo Kawada

IPC分类号： H04R17/00 ,  H01L41/053

CPC分类号： H03H3/02 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42

摘要： There is There is provided a method of manufacturing a package 1 having a base substrate 10 and a lid substrate 20 bonded to each other and both formed of a glass base material; and a cavity C formed between the both substrates for storing an encapsulated object 2 in a state of being hermetically encapsulated, including: a depression forming step for forming a depression C1 for a cavity which defines the cavity when the both substrates are superimposed to each other on at least one of the both substrates; and a bonding step for superimposing the both substrates so as to store the encapsulated object in the depression and then bonding the both substrates to encapsulate the encapsulated object in the cavity, characterized in that in the depression forming step, printed layers 12 are laminated on an upper surface of a flat plate-shaped glass base material 11 in a frame shape in plan view by screen printing, and then the printed layers and the glass base material are baked at the same time to form the depression.

摘要翻译： 提供了一种制造包装1的方法，该包装1具有彼此接合并且都由玻璃基材形成的基底10和盖基底20; 以及形成在两个基板之间的空腔C，用于以密封的状态存储被封装物体2，包括：凹陷形成步骤，用于在两个基板彼此叠置时形成限定空腔的空腔的凹陷C1 在两个基材中的至少一个上; 以及结合步骤，用于叠加两个基板，以将封装物体存储在凹陷中，然后将两个基板接合以将封装物体封装在空腔中，其特征在于，在凹陷形成步骤中，将印刷层12层压在 通过丝网印刷在平面图中以平板状的平板状玻璃基材11的上表面，然后同时烘烤印刷层和玻璃基材以形成凹陷。

公开(公告)号：US07511405B2

公开(公告)日：2009-03-31

申请号：US11947553

申请日：2007-11-29

申请人： Masashi Numata ,  Yasuo Kawada ,  Sadao Oku

发明人： Masashi Numata ,  Yasuo Kawada ,  Sadao Oku

IPC分类号： H01L41/053

CPC分类号： H03H9/1021 ,  H01L2224/45144 ,  H01L2224/48091 ,  Y10T29/42 ,  Y10T29/49169 ,  Y10T29/49179 ,  H01L2924/00014 ,  H01L2924/00

摘要： To achieve small-sized formation of a piezoelectric vibrator while preventing exciting electrodes provided at both faces of the piezoelectric vibrating piece from being shortcircuited to each other and enabling to fabricate the piezoelectric vibrating piece easily, there is provided a piezoelectric vibrator 1 including a case 3 in a shape of a bottomed cylinder having an opening portion 3a and having a conductivity, a ring 12 substantially in a cylindrical shape press-fitted to the opening portion 3a of the case 3 and having a conductivity, one piece of a lead 13 inserted to the ring 12 and having an inner lead portion 15 and an outer lead portion 16, a filling member 14 having an insulting property for sealing an interval between the lead 13 and the ring 12 in airtight, and a piezoelectric vibrating piece 2 which is constituted by substantially a plate-like shape arranged at inside of the case 3 and includes exciting electrodes 8, 9 at both faces thereof and in which the exciting electrode 8 is supported by the inner lead portion 15 by being subjected to bump connection with the inner lead portion 15 of the lead 13 and the exciting electrode 9 is subjected to wire bonding with the ring 12.

摘要翻译： 为了实现压电振动器的小尺寸形成，同时防止设置在压电振动片的两个面处的激励电极彼此短路并且能够容易地制造压电振动片，提供了一种压电振动器1，其包括壳体3 在具有开口部分3a并具有导电性的有底圆柱体的形状中，基本上为圆柱形的环12压配合到壳体3的开口部分3a并且具有导电性，一个引线13插入到 环12并具有内引线部分15和外引线部分16，具有用于密封引线13和环12之间的间隔的绝缘性的填充部件14，以及压电振动片2，其由 基本上是在壳体3的内侧布置的板状，并且在其两个面上包括激励电极8,9，其中激励电子 通过与引线13的内引线部分15进行凸点连接，并且激励电极9与环12进行引线接合，由引线部分15支撑。

公开(公告)号：US5610725A

公开(公告)日：1997-03-11

申请号：US541967

申请日：1995-10-10

申请人： Yasuo Kawada ,  Hidenori Sakai ,  Makoto Obu ,  Katsuhiro Echigo ,  Yasuhiro Kawashima ,  Hidetoshi Yano ,  Fumio Kishi

发明人： Yasuo Kawada ,  Hidenori Sakai ,  Makoto Obu ,  Katsuhiro Echigo ,  Yasuhiro Kawashima ,  Hidetoshi Yano ,  Fumio Kishi

IPC分类号： B41J29/00 ,  B41J29/38 ,  G03G15/00 ,  G03G21/00 ,  H04N1/00 ,  H04N1/32

CPC分类号： G03G15/5075 ,  H04N1/00002 ,  H04N1/32561 ,  G03G2215/00113 ,  G05B2219/2228 ,  H04N2201/0074

摘要： A communication system includes: an image forming unit connected to a communication line through a communication control unit; and a management unit for managing data of resources of the image forming unit, the management unit being connected to the communication line, the image forming unit including: at least one component part; a first storage part for storing a control program for the component part, so that the component part is controlled in accordance with the control program; and a first control part for transmitting a first code to the management unit via the communication line in response to an update request signal, the first code indicating a model of the image forming unit and indicating a type of the component part, the management unit including: a second storage part for storing a plurality of control programs for different types of the component part of the image forming unit; and a second control part for reading out a first control program from the second storage part in accordance with the first code received from the first control part, and for transmitting the first control program to the image forming unit via the communication line, so that the first control program is stored in the first storage part.

摘要翻译： 通信系统包括：通过通信控制单元连接到通信线路的图像形成单元; 以及管理单元，用于管理图像形成单元的资源数据，所述管理单元连接到所述通信线路，所述图像形成单元包括：至少一个组成部分; 第一存储部分，用于存储组件部分的控制程序，使得根据控制程序控制组件部分; 以及第一控制部分，用于响应于更新请求信号经由通信线路将第一代码发送到管理单元，第一代码指示图像形成单元的模型并指示组件部分的类型，管理单元包括 ：第二存储部分，用于存储用于不同类型的图像形成单元的组成部分的多个控制程序; 以及第二控制部分，用于根据从第一控制部分接收到的第一代码从第二存储部分读出第一控制程序，并且用于经由通信线路将第一控制程序发送到图像形成单元，使得 第一控制程序存储在第一存储部分中。

公开(公告)号：US5583615A

公开(公告)日：1996-12-10

申请号：US159480

申请日：1993-11-30

申请人： Yasunari Hashimoto ,  Yasuo Kawada ,  Kazuyuki Nakahara ,  Osamu Kizaki ,  Tomofumi Harada ,  Nobuaki Tomidokoro

发明人： Yasunari Hashimoto ,  Yasuo Kawada ,  Kazuyuki Nakahara ,  Osamu Kizaki ,  Tomofumi Harada ,  Nobuaki Tomidokoro

IPC分类号： G03G21/00 ,  G03G15/00 ,  H04M11/00 ,  H04N1/00

CPC分类号： H04N1/00015 ,  G03G15/5079 ,  H04N1/00002 ,  H04N1/00037 ,  H04N1/0005 ,  H04N1/00079 ,  H04N1/0009

摘要： A communication control device connected between an image forming apparatus and a communication line in an image forming apparatus supervising system which connects the image forming apparatus and a host machine by the communication line. Assume that particular data of an image forming apparatus and which is updated day by day should be read periodically. Then, even when the power supply to the image forming apparatus is shut off, a host machine can access the apparatus to read the data which should be read periodically, and receive it. In addition, the data can be preserved until the next time for reading. The data is stored in a first memory until the data is ready for transfer to the host machine, at which time the data is transferred to a second memory and then to the host machine.

摘要翻译： 一种连接在通过通信线连接图像形成装置和主机的图像形成装置监视系统中的图像形成装置和通信线路之间的通信控制装置。 假设应该周期性地读取图像形成装置的特定数据并且被逐日更新。 然后，即使关闭图像形成装置的电源，主机也可以访问该装置以读取周期性地读取的数据并且接收它。 此外，数据可以保留到下一次阅读。 数据存储在第一个存储器中，直到数据准备好传输到主机，此时数据被传送到第二个存储器，然后传送到主机。

公开(公告)号：US08496767B2

公开(公告)日：2013-07-30

申请号：US13204376

申请日：2011-08-05

申请人： Yasuo Kawada

发明人： Yasuo Kawada

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： C03C27/06

摘要： An anodic bonding method for anodically bonding a first substrate and a second substrate includes: a substrate placement step in which the first substrate and the second substrate are stacked and placed on a flat surface of a base with a surface of one of the first substrate and the second substrate to be cathode in contact with the flat surface of the base; a jig placement step, following the substrate placement step, in which the anodic bonding jig is placed so as to be in contact with a surface of one of the first substrate and the second substrate to be anode, the anodic bonding jig having a visual checking area formed of a material that allows visible light to pass through; an alignment step in which the relative positional relation between the first substrate and the second substrate is adjusted based on visible light passing through the visual checking area so that pairs of marks provided on the first substrate and the second substrate will be in a predetermined positional relation; a pressurizing step in which the base and the anodic bonding jig are pressurized in the direction to move the base and the anodic bonding jig close to each other, and the first substrate and the second substrate are sandwiched; and an application step in which a DC voltage is applied between the first substrate and the second substrate.

摘要翻译： 用于阳极结合第一基板和第二基板的阳极接合方法包括：基板放置步骤，其中第一基板和第二基板被堆叠并放置在基板的平坦表面上，其中第一基板和第二基板的表面之一 所述第二基板为与所述基板的平坦表面接触的阴极; 夹具放置步骤，在所述基板放置步骤之后，将所述阳极接合夹具放置成与所述第一基板和所述第二基板中的一个的表面接触为阳极，所述阳极接合夹具具有目视检查 由允许可见光通过的材料形成的区域; 基于通过目视检查区域的可见光来调整第一基板和第二基板之间的相对位置关系的对准步骤，使得设置在第一基板和第二基板上的一对标记将处于预定的位置关系 ; 将底座和阳极接合夹具沿使底座和阳极接合夹具移动的方向加压的加压工序，将第一基板和第二基板夹持; 以及在第一基板和第二基板之间施加直流电压的施加步骤。

公开(公告)号：US20120247291A1

公开(公告)日：2012-10-04

申请号：US13432446

申请日：2012-03-28

申请人： Yasuo Kawada

发明人： Yasuo Kawada

IPC分类号： B26D3/00

CPC分类号： C03B33/076 ,  C03B33/0222 ,  C03B33/033 ,  C03B33/091 ,  H01L21/67092 ,  H01L21/67132 ,  H03H9/1021 ,  Y02P40/57 ,  Y10T83/0495

摘要： Disclosed is a bonded glass cutting method including: a first focus adjustment process of focusing laser light; a second focus adjustment process of moving the focus of the laser light toward one surface side of the bonded glass along a thickness direction of the bonded glass, after the first focus adjustment process; a detection target portion forming process of forming a detection target portion on one surface by irradiation of the laser light, after the second focus adjustment process; a third focus adjustment process of refocusing the laser light on the detection target portion; a groove forming process of forming a groove on one surface by irradiation of the laser light along the planned cutting line, after the third focus adjustment process.

摘要翻译： 公开了一种粘合玻璃切割方法，包括：聚焦激光的第一聚焦调整处理; 在第一焦点调整处理之后，沿着粘合玻璃的厚度方向将激光的焦点向粘合玻璃的一个表面侧移动的第二焦点调整处理; 在第二焦点调整处理之后，通过激光的照射在一个表面上形成检测目标部分的检测目标部分形成处理; 将激光重新聚焦在检测目标部分上的第三焦点调整过程; 在第三焦点调整处理之后，沿着预定切割线照射激光，在一个表面上形成凹槽的槽形成工艺。