公开(公告)号：US09355884B2

公开(公告)日：2016-05-31

申请号：US14470477

申请日：2014-08-27

Applicant: Lam Research Corporation

Inventor： Rish Chhatre ,  David Schaefer ,  Sung Lee ,  Dan Haber

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68735 ,  H01L21/67069 ,  H01L21/6719 ,  Y10T29/49826 ,  Y10T29/49863 ,  Y10T29/53 ,  Y10T29/53657

Abstract: A kit comprising an installation fixture, a plurality of mechanical fasteners and an embedding tool is provided which allows for an elastomer band to be disposed in a mounting groove around a semiconductor substrate support in a manner that relieves the internal stresses of the elastomer band, leading to an elastomer band with a longer operational lifetime. The installation fixture is secured to a substrate support with mechanical fasteners. An elastomer band is placed around an outer circumference of the installation fixture and rotated back and forth to relieve internal stresses of the elastomer band. The fixture is inverted and the elastomer band is slid vertically off the fixture and into the mounting groove. An embedding tool can be used to completely insert the elastomer band into the mounting groove.

Abstract translation: 提供一种包括安装夹具，多个机械紧固件和嵌入工具的套件，其允许弹性体带以减轻弹性体带的内部应力的方式设置在半导体衬底支撑件周围的安装槽中，引导 到具有更长使用寿命的弹性体带。 安装夹具用机械紧固件固定到基板支架上。 弹性体带围绕安装夹具的外周放置并且来回旋转以减轻弹性体带的内应力。 夹具被倒置，弹性体带从夹具垂直滑入安装槽。 可以使用嵌入工具将弹性体带完全插入到安装槽中。

公开(公告)号：US20150170942A1

公开(公告)日：2015-06-18

申请号：US14109400

申请日：2013-12-17

Applicant: Lam Research Corporation

Inventor： Rish Chhatre ,  David Schaefer

IPC: H01L21/67 ,  H01L21/70

CPC classification number: H01L21/70 ,  H01L21/67126 ,  H01L21/68785 ,  Y10T29/4987 ,  Y10T29/53657

Abstract: An installation fixture adapted to mount an elastomer band in a mounting groove around a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber is disclosed, which includes an annular ring having a vertically extending portion on an outer edge of the ring and adapted to receive the elastomer band, and a base plate configured to be attached to the annular ring, the base plate having a plurality of radially extending portions adapted to receive a plurality of mechanical fasteners at locations corresponding to mounting holes in the semiconductor substrate support.

Abstract translation: 公开了一种适于将弹性体带安装在用于在等离子体处理室中用于支撑半导体衬底的半导体衬底支架周围的安装槽中的安装夹具，其包括在环的外边缘上具有垂直延伸部分的环形环， 适于容纳弹性体带和配置成附接到环形圈的基板，所述基板具有多个径向延伸部分，其适于在对应于半导体衬底支撑件中的安装孔的位置处容纳多个机械紧固件。

公开(公告)号：US20140366360A1

公开(公告)日：2014-12-18

申请号：US14470477

申请日：2014-08-27

Applicant: Lam Research Corporation

Inventor： Rish Chhatre ,  David Schaefer ,  Sung Lee ,  Dan Haber

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68735 ,  H01L21/67069 ,  H01L21/6719 ,  Y10T29/49826 ,  Y10T29/49863 ,  Y10T29/53 ,  Y10T29/53657

Abstract: A kit comprising an installation fixture, a plurality of mechanical fasteners and an embedding tool is provided which allows for an elastomer band to be disposed in a mounting groove around a semiconductor substrate support in a manner that relieves the internal stresses of the elastomer band, leading to an elastomer band with a longer operational lifetime. The installation fixture is secured to a substrate support with mechanical fasteners. An elastomer band is placed around an outer circumference of the installation fixture and rotated back and forth to relieve internal stresses of the elastomer band. The fixture is inverted and the elastomer band is slid vertically off the fixture and into the mounting groove. An embedding tool can be used to completely insert the elastomer band into the mounting groove.

Abstract translation: 提供一种包括安装夹具，多个机械紧固件和嵌入工具的套件，其允许弹性体带以减轻弹性体带的内部应力的方式设置在半导体衬底支撑件周围的安装槽中，引导 到具有更长使用寿命的弹性体带。 安装夹具用机械紧固件固定到基板支架上。 弹性体带围绕安装夹具的外周放置并且来回旋转以减轻弹性体带的内应力。 夹具被倒置，弹性体带从夹具垂直滑入安装槽。 可以使用嵌入工具将弹性体带完全插入到安装槽中。

公开(公告)号：US09583377B2

公开(公告)日：2017-02-28

申请号：US14109400

申请日：2013-12-17

Applicant: Lam Research Corporation

Inventor： Rish Chhatre ,  David Schaefer

IPC: B23Q1/70 ,  H01L21/70 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/70 ,  H01L21/67126 ,  H01L21/68785 ,  Y10T29/4987 ,  Y10T29/53657

Abstract: An installation fixture adapted to mount an elastomer band in a mounting groove around a semiconductor substrate support used for supporting a semiconductor substrate in a plasma processing chamber is disclosed, which includes an annular ring having a vertically extending portion on an outer edge of the ring and adapted to receive the elastomer band, and a base plate configured to be attached to the annular ring, the base plate having a plurality of radially extending portions adapted to receive a plurality of mechanical fasteners at locations corresponding to mounting holes in the semiconductor substrate support.

Abstract translation: 公开了一种适于将弹性体带安装在用于在等离子体处理室中用于支撑半导体衬底的半导体衬底支架周围的安装槽中的安装夹具，其包括在环的外边缘上具有垂直延伸部分的环形环， 适于容纳弹性体带和配置成附接到环形圈的基板，所述基板具有多个径向延伸部分，其适于在对应于半导体衬底支撑件中的安装孔的位置处容纳多个机械紧固件。

公开(公告)号：US09105676B2

公开(公告)日：2015-08-11

申请号：US13624822

申请日：2012-09-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Hong Shih ,  Tuochuan Huang ,  Yan Fang ,  Cliff LaCroix ,  Neal Newton ,  Rish Chhatre

IPC: B08B7/00 ,  H01L21/683 ,  B08B1/00 ,  B08B5/00 ,  B08B5/02

CPC classification number: H01L21/6833 ,  B08B1/00 ,  B08B5/00 ,  B08B5/02 ,  B08B7/00 ,  B08B7/0071

Abstract: A method of removing an epoxy band from an electrostatic chuck includes securing the electrostatic chuck in a servicing fixture, applying a thermal source to the epoxy band to breakdown a plurality of adhesive bonds securing the epoxy band to the electrostatic chuck, forming a hole in the epoxy band and pulling the epoxy band from the electrostatic chuck. A system for removing an epoxy band from an electrostatic chuck is also described.

Abstract translation: 从静电卡盘去除环氧树脂带的方法包括将静电卡盘固定在维修夹具中，将热源施加到环氧树脂带上，以将多个粘合剂固定到静电卡盘上，从而在环形带中形成孔 环氧树脂带，并从静电吸盘拉环氧树脂带。 还描述了用于从静电卡盘除去环氧树脂带的系统。

公开(公告)号：US20140083461A1

公开(公告)日：2014-03-27

申请号：US13624822

申请日：2012-09-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Hong Shih ,  Tuochuan Huang ,  Yan Fang ,  Cliff LaCroix ,  Neal Newton ,  Rish Chhatre

IPC: B08B7/00

CPC classification number: H01L21/6833 ,  B08B1/00 ,  B08B5/00 ,  B08B5/02 ,  B08B7/00 ,  B08B7/0071

Abstract: A method of removing an epoxy band from an electrostatic chuck includes securing the electrostatic chuck in a servicing fixture, applying a thermal source to the epoxy band to breakdown a plurality of adhesive bonds securing the epoxy band to the electrostatic chuck, forming a hole in the epoxy band and pulling the epoxy band from the electrostatic chuck. A system for removing an epoxy band from an electrostatic chuck is also described.

Abstract translation: 从静电卡盘去除环氧树脂带的方法包括将静电卡盘固定在维修夹具中，将热源施加到环氧树脂带上，以将多个粘合剂固定到静电卡盘上，从而在环形带中形成孔 环氧树脂带，并从静电吸盘拉环氧树脂带。 还描述了用于从静电卡盘除去环氧树脂带的系统。