Thin Film Transistor Substrate Having High Reliability Metal Oxide Semiconductor Material
    1.
    发明申请
    Thin Film Transistor Substrate Having High Reliability Metal Oxide Semiconductor Material 有权
    具有高可靠性金属氧化物半导体材料的薄膜晶体管基板

    公开(公告)号:US20160343878A1

    公开(公告)日:2016-11-24

    申请号:US15156263

    申请日:2016-05-16

    Abstract: The present disclosure relates to a thin film transistor substrate having a high reliability oxide semiconductor material including a metal oxide semiconductor material. A thin film transistor substrate includes a substrate, a gate electrode disposed on the substrate, a semiconductor layer including an oxide semiconductor material combining one or more of indium, gallium and zinc, oxygen, and a doping material. The doping material may be a group 15 or 16 gaseous element. The semiconductor layer has a channel area overlapping with the gate electrode with a gate insulating layer, a source area extended from one side of the channel area, and a drain area extended from another side of the channel area, a source electrode connected to the source area, and a drain electrode connected to the drain area.

    Abstract translation: 本公开涉及具有包括金属氧化物半导体材料的高可靠性氧化物半导体材料的薄膜晶体管基板。 薄膜晶体管衬底包括衬底,设置在衬底上的栅电极,包括结合铟,镓和锌中的一种或多种氧化物和氧化物的掺杂材料的氧化物半导体材料的半导体层。 掺杂材料可以是15或16族气态元素。 半导体层具有与栅电极重叠的沟道区域,栅极绝缘层,从沟道区域的一侧延伸的源极区域和从沟道区域的另一侧延伸的漏极区域,源极连接到源极 区域和连接到漏极区域的漏电极。

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