THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    薄膜晶体管基板及其制造方法

    公开(公告)号:US20160307936A1

    公开(公告)日:2016-10-20

    申请号:US15133419

    申请日:2016-04-20

    Abstract: A thin film transistor substrate includes a substrate; a first thin film transistor on the substrate and including a polycrystalline semiconductor layer, a first gate electrode on the polycrystalline semiconductor layer, a first source electrode, and a first drain electrode; a second thin film transistor on the substrate and including a second gate electrode, an oxide semiconductor layer on the second gate electrode, a second source electrode, and a second drain electrode; an intermediate insulating layer on the first gate electrode and the second gate electrode and under the oxide semiconductor layer; and a dummy layer between the first source electrode and the intermediate insulating layer and between the first drain electrode and the intermediate insulating layer, wherein the dummy layer is formed of a same material as the oxide semiconductor layer.

    Abstract translation: 薄膜晶体管基板包括基板; 在所述基板上的第一薄膜晶体管,包括多晶半导体层,所述多晶半导体层上的第一栅电极,第一源电极和第一漏电极; 第二薄膜晶体管,其包括第二栅电极,第二栅电极上的氧化物半导体层,第二源电极和第二漏电极; 在所述第一栅极电极和所述第二栅极电极之下和所述氧化物半导体层下方的中间绝缘层; 以及在第一源极和中间绝缘层之间以及第一漏极和中间绝缘层之间的虚设层,其中虚设层由与氧化物半导体层相同的材料形成。

    THIN FILM TRANSISTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20180350848A1

    公开(公告)日:2018-12-06

    申请号:US16047875

    申请日:2018-07-27

    Abstract: A thin film transistor substrate includes a substrate; a first thin film transistor on the substrate and including a polycrystalline semiconductor layer, a first gate electrode on the polycrystalline semiconductor layer, a first source electrode, and a first drain electrode; a second thin film transistor on the substrate and including a second gate electrode, an oxide semiconductor layer on the second gate electrode, a second source electrode, and a second drain electrode; an intermediate insulating layer on the first gate electrode and the second gate electrode and under the oxide semiconductor layer; and a dummy layer between the first source electrode and the intermediate insulating layer and between the first drain electrode and the intermediate insulating layer, wherein the dummy layer is formed of a same material as the oxide semiconductor layer.

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