公开(公告)号：US10001269B2

公开(公告)日：2018-06-19

申请号：US15152989

申请日：2016-05-12

Applicant: LG ELECTRONICS INC.

Inventor： Jaepyo Hong ,  Jaechan Kim ,  Injoong Kim ,  Hyeuk Chang ,  Sumin Jun

IPC: F21V21/00 ,  F21V29/74 ,  H01L33/64 ,  H01L33/62 ,  F21Y101/02

CPC classification number: F21V29/74 ,  F21Y2101/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647

Abstract: A light source module includes at least one light source emitting light, and a body supporting the light source, wherein the body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer contacted with the insulating layer, the conductive layer being at least provided in a path region in which electric current is applied to the light source, the conductive layer being contacted with the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

公开(公告)号：US10317068B2

公开(公告)日：2019-06-11

申请号：US15339066

申请日：2016-10-31

Applicant: LG ELECTRONICS INC.

Inventor： Jaepyo Hong ,  Jaechan Kim ,  Injoong Kim

IPC: H01J1/02 ,  F21V29/74 ,  F21V5/04 ,  F21V23/00 ,  H01L33/36 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64 ,  F21K9/00 ,  H05K1/05 ,  F21V29/76 ,  F21V29/83 ,  F21Y115/10 ,  F21V5/00 ,  F21V23/06 ,  H05K1/02 ,  H05K3/10 ,  F21W131/103 ,  F21Y113/00 ,  F21Y105/10

Abstract: A light source module includes a light source for emitting light, and a heat sink for absorbing heat from the light source and dissipating the heat to the outside. The heat sink includes a mounting part for attaching the light source, and a heat dissipation fin for absorbing heat generated by the light source and dissipating the heat to the outside. An electrical insulating layer is provided on at least one surface of the heat sink, and an electrically conductive layer is provided in the insulating layer. The electrically conductive layer provides a path through which electric current is applied to the light source. A lens cover is provided over the light source.

公开(公告)号：US10228119B2

公开(公告)日：2019-03-12

申请号：US15339033

申请日：2016-10-31

Applicant: LG ELECTRONICS INC.

Inventor： Jaepyo Hong ,  Jaechan Kim ,  Injoong Kim

IPC: F21V23/00 ,  F21V29/00 ,  F21V29/71 ,  F21V29/503 ,  F21V29/76 ,  F21V29/83 ,  F21S2/00 ,  F21V23/06 ,  F21V31/00 ,  H01L33/64 ,  H05K1/05 ,  F21V29/74 ,  F21V3/06 ,  F21Y115/10 ,  H05K1/02 ,  H05K3/10

Abstract: A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, an electrical insulating part provided on the heat sink, and a plating part provided on the insulating part. The plating part includes a contact heat dissipation part contacting a portion of a bottom surface of the light source to receive heat generated from the light source, and a diffusion heat dissipation part connected to the contact heat dissipation part for receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed.

公开(公告)号：US09970648B2

公开(公告)日：2018-05-15

申请号：US15153053

申请日：2016-05-12

Applicant: LG ELECTRONICS INC.

Inventor： Jaepyo Hong ,  Jaechan Kim ,  Injoong Kim ,  Hyeuk Chang ,  Sumin Jun

IPC: F21S4/00 ,  F21V29/74 ,  H01L33/64 ,  H05K1/05 ,  H01L33/62 ,  F21Y101/02 ,  H05K3/28

CPC classification number: F21V29/74 ,  F21Y2101/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647 ,  H05K1/053 ,  H05K3/28 ,  H05K2201/0376 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1355

Abstract: A light source module includes at least one light source, and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties, and a conductive layer provided on the insulating layer. The conductive layer includes connection regions through which electric current is supplied to the light source, and a light source region disposed between the connection regions, the light source region having the light source mounted therein. A protective layer is stacked in the connection region. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, improvement of the lifespan of products, and enhancement of the stability of products.

公开(公告)号：US09777916B2

公开(公告)日：2017-10-03

申请号：US15153114

申请日：2016-05-12

Applicant: LG ELECTRONICS INC.

Inventor： Jaepyo Hong ,  Jaechan Kim ,  Injoong Kim ,  Hyeuk Chang ,  Sumin Jun

IPC: F21V21/00 ,  F21V29/83 ,  H01L33/62 ,  H01L33/64 ,  F21V29/77 ,  F21K9/90 ,  F21V5/04 ,  F21V7/22 ,  F21V15/01 ,  F21V23/00 ,  F21V31/00 ,  F21K9/20 ,  F21Y101/00

CPC classification number: F21V29/83 ,  F21K9/20 ,  F21K9/90 ,  F21V5/04 ,  F21V7/22 ,  F21V15/01 ,  F21V23/002 ,  F21V29/77 ,  F21V31/00 ,  F21Y2101/00 ,  H01L33/62 ,  H01L33/64 ,  H01L33/647

Abstract: A light source module includes at least one light source and a body supporting the light source. The body includes a heat sink supporting the light source on a top surface thereof for absorbing heat from the light source and dissipating the heat to the outside, an electrically insulating layer provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer, the conductive layer being at least provided in a path region through which electric current is applied to the light source. The conductive layer includes light source connection parts supplying the electric current to the light source, and a light source mounting part disposed between the light source connection parts. One portion of the light source connection part is divided into at least two portions to be connected to each other. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and optimization of a conductive material.

公开(公告)号：US10401015B2

公开(公告)日：2019-09-03

申请号：US15153082

申请日：2016-05-12

Applicant: LG ELECTRONICS INC.

Inventor： Jaepyo Hong ,  Jaechan Kim ,  Injoong Kim ,  Hyeuk Chang ,  Sumin Jun

IPC: H01L21/00 ,  F21V29/74 ,  H01L33/62 ,  H01L33/64 ,  H05K1/05 ,  H05K3/38

Abstract: A light source module includes at least one light source emitting light, and a body supporting the light source. The body includes a heat sink absorbing heat from the light source and dissipating the heat to the outside, an insulating layer having electrical insulating properties, the insulating layer being provided on at least one surface of the heat sink, and a conductive layer provided on the insulating layer to enable electric current to flow therein. The conductive layer includes an electrically conductive layer providing a path region in which electric current is applied to the light source, and a heat dissipation conductive layer diffusing generated by the light source. Accordingly, it is possible to obtain effects such as rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, and promotion of heat dissipation. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

公开(公告)号：US10114411B2

公开(公告)日：2018-10-30

申请号：US15507745

申请日：2015-03-20

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon Hwang ,  Kyoungtae Kim ,  Seungyong Shin ,  Kuangjun An ,  Junhyuk Choi ,  Jaechan Kim ,  Taehyun Kim

IPC: G06F3/041 ,  G06F1/16 ,  G06F3/023 ,  H04W12/02 ,  H04L9/32 ,  G02B27/02

Abstract: The present invention relates to a watch-type electronic device and a manufacturing method therefor, the electronic device comprising: a main body including a display unit; a frame provided to the main body and having an upper surface, a lower surface formed to face the upper surface, and side surfaces formed so as to cover the upper surface and the lower surface; and a touch sensor formed on the frame, wherein the upper surface comprises: a planar part formed to be parallel to the lower surface; and a curved part formed so as to be inclined toward the end of the lower surface from an end portion of the planar part, the touch sensor is formed on the curved part so as to be spaced apart from the display unit, the display unit is placed on the planar part, the frame includes a laser direct structuring (LDS) material, and the touch sensor is formed of a metal thin film.