Display device using semiconductor light emitting device and method of fabricating the same
    2.
    发明授权
    Display device using semiconductor light emitting device and method of fabricating the same 有权
    使用半导体发光元件的显示装置及其制造方法

    公开(公告)号:US09406656B2

    公开(公告)日:2016-08-02

    申请号:US14693633

    申请日:2015-04-22

    Abstract: A display device includes a first electrode; a second electrode; and a plurality of semiconductor light emitting devices coupled to a conductive adhesive layer, and electrically connected to the first electrode and the second electrode, wherein at least one of the plurality of semiconductor light emitting devices includes: a first conductive electrode and a second conductive electrode spaced from each other; a protruding unit extending from the second conductive electrode, and protruding from a side surface of at least one of the plurality of semiconductor light emitting devices; and a protection unit configured to cover at least part of the protruding unit for protection of the protruding unit.

    Abstract translation: 显示装置包括第一电极; 第二电极; 以及耦合到导电粘合剂层并且电连接到第一电极和第二电极的多个半导体发光器件,其中多个半导体发光器件中的至少一个包括:第一导电电极和第二导电电极 彼此间隔; 从所述第二导电电极延伸并从所述多个半导体发光器件中的至少一个的侧面突出的突出单元; 以及保护单元,被配置为覆盖所述突出单元的至少一部分以保护所述突出单元。

    Vehicle lamp using semiconductor light emitting device

    公开(公告)号:US10400979B2

    公开(公告)日:2019-09-03

    申请号:US15498956

    申请日:2017-04-27

    Abstract: A vehicle lamp includes a plurality of light emitting modules electrically connected together. Each of the light emitting modules includes a wiring board, a plurality of semiconductor light emitting devices arranged on one surface of the wiring board, a first wiring electrically connected to first conductive electrodes of the semiconductor light emitting devices and arranged on the one surface of the wiring board, and a second wiring electrically connected to second conductive electrodes of the semiconductor light emitting devices and extending to another surface of the wiring board through a via hole. The first wiring of at least one of the light emitting modules and the second wiring of the neighboring light source module overlap each other in a thickness direction of the light emitting modules, such that the light emitting modules are connected in series.

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