Abstract:
A vehicle lamp including a base portion; and a plurality of light source modules arranged on one surface of the base portion. Further, each of the light source modules includes a plurality of semiconductor light emitting devices, and a plurality of electrodes electrically connected to the semiconductor light emitting devices. At least first side included in the light source modules faces a second side of a neighboring light source module, and the plurality of electrodes are arranged on sides facing to each other, respectively, such that the light source modules are electrically connected to each other.
Abstract:
A display device includes a first electrode; a second electrode; and a plurality of semiconductor light emitting devices coupled to a conductive adhesive layer, and electrically connected to the first electrode and the second electrode, wherein at least one of the plurality of semiconductor light emitting devices includes: a first conductive electrode and a second conductive electrode spaced from each other; a protruding unit extending from the second conductive electrode, and protruding from a side surface of at least one of the plurality of semiconductor light emitting devices; and a protection unit configured to cover at least part of the protruding unit for protection of the protruding unit.
Abstract:
Discussed is a lamp and a lamp device, and more particularly, to a lamp using a semiconductor light-emitting device, and a method of manufacturing the lamp. The lamp includes a substrate; a plurality of semiconductor light-emitting devices disposed on the substrate; a flat layer formed between the plurality of semiconductor light-emitting devices; a spacer disposed between the substrate and the flat layer; and an air gap disposed between each semiconductor light-emitting device and the spacer.
Abstract:
A vehicle lamp includes a plurality of light emitting modules electrically connected together. Each of the light emitting modules includes a wiring board, a plurality of semiconductor light emitting devices arranged on one surface of the wiring board, a first wiring electrically connected to first conductive electrodes of the semiconductor light emitting devices and arranged on the one surface of the wiring board, and a second wiring electrically connected to second conductive electrodes of the semiconductor light emitting devices and extending to another surface of the wiring board through a via hole. The first wiring of at least one of the light emitting modules and the second wiring of the neighboring light source module overlap each other in a thickness direction of the light emitting modules, such that the light emitting modules are connected in series.