公开(公告)号：US20220319892A1

公开(公告)日：2022-10-06

申请号：US17628776

申请日：2020-02-11

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM ,  Hyeyoung YANG ,  Jisoo KO ,  Wonjae CHANG

IPC: H01L21/68 ,  H01L21/683

Abstract: The present invention provides an assembly substrate used in a method for manufacturing a display device which mounts semiconductor light emitting devices on a predetermined position of an assembly substrate by using an electric field and a magnetic field. Specifically, the assembly substrate is characterized by comprising: a base part; a plurality of assembly electrodes formed extending in one direction and disposed on the base part; a dielectric layer laminated on the base part so as to cover the assembly electrodes; a partition wall formed on the base part and including a plurality of grooves for guiding the semiconductor light emitting devices to a predetermined position; and a metal shielding layer formed on the base part, wherein each of the plurality of grooves penetrates the partition wall so as to form a seating surface on which the guided light emitting devices are seated, and the metal shielding layer overlaps with a part of the seating surface such that an electric field formed on a part of the seating surface is shielded.

公开(公告)号：US20250040321A1

公开(公告)日：2025-01-30

申请号：US18576641

申请日：2021-07-05

Applicant: LG ELECTRONICS INC.

Inventor： Kitae AN ,  Bongchu SHIM ,  Hyunwoo CHO

IPC: H01L33/58 ,  H01L25/075 ,  H01L25/16 ,  H01L33/00 ,  H01L33/52 ,  H01L33/62

Abstract: The present invention can be applied to a technical field relating to display devices, and relates to a modular display device using, for example, light-emitting devices and to a method for manufacturing same. The present invention comprises: at least two display modules, each including a substrate having a first surface and a second surface, and a plurality of semiconductor light-emitting devices mounted on the first surface of the substrate; a light-absorbing layer positioned in a gap between the display modules; and an encapsulation layer positioned on the first surfaces of the display modules, wherein the light-absorbing layer may include: a first section positioned on the first surface of the substrate; a second section positioned in a gap between the display modules adjacent to each other; and a third section positioned on the second surface of the substrate.

公开(公告)号：US20220367421A1

公开(公告)日：2022-11-17

申请号：US17623853

申请日：2019-08-01

Applicant: LG ELECTRONICS INC.

Inventor： Jisoo KO ,  Hyeyoung YANG ,  Wonjae CHANG ,  Hyunwoo CHO

IPC: H01L25/075 ,  H01L33/62

Abstract: The present invention may be applied to display device-related technical fields and relates to a display device using a semiconductor light-emitting element, such as a micro light-emitting diode (LED), and a manufacturing method therefor. The present invention, according to one embodiment, may comprise: a substrate; a stepped film positioned on at least some pixel regions, among a plurality of individual pixel regions positioned on the substrate; an assembly electrode positioned on the substrate or the stepped film; an insulation layer positioned on the assembly electrode; a partition wall positioned on the insulation layer and defining an assembly groove having mounted therein a semiconductor light-emitting element forming the individual pixel; the semiconductor light-emitting element mounted in an assembly surface of the assembly groove; and a lighting electrode electrically connected to the semiconductor light-emitting element.

公开(公告)号：US20190326477A1

公开(公告)日：2019-10-24

申请号：US16415583

申请日：2019-05-17

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon KIM ,  Changseo PARK ,  Bongchu SHIM ,  Byoungkwon CHO ,  Hyunwoo CHO

IPC: H01L33/38 ,  H01L33/20 ,  H01L33/40 ,  H01L33/62 ,  H01L33/44 ,  H01L25/075 ,  H01L33/00

Abstract: The present disclosure relates a display device including a semiconductor light emitting device, and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed at an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer, and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction, wherein when the semiconductor light emitting device is assembled into the receiving groove, the first conductive semiconductor layer has an asymmetrical shape with respect to at least one direction so that the first conductive electrode and the second conductive electrode are arranged at preset positions.

公开(公告)号：US20220302342A1

公开(公告)日：2022-09-22

申请号：US17832221

申请日：2022-06-03

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon KIM ,  Hyunwoo CHO ,  Mihee HEO

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: A display device includes a plurality of semiconductor light emitting diodes, first and second electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes, a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode, a dielectric layer disposed on the plurality of pair electrodes, and a chemical bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes. The chemical bond layer bonds the semiconductor light emitting diodes to the dielectric layer when a voltage applied to the plurality of pair electrodes is cut off after the plurality of semiconductor light emitting diodes are assembled on the dielectric layer.

公开(公告)号：US20220293823A1

公开(公告)日：2022-09-15

申请号：US17633520

申请日：2019-08-21

Applicant: LG ELECTRONICS INC.

Inventor： Wonjae CHANG ,  Jisoo KO ,  Hyeyoung YANG ,  Hyunwoo CHO

IPC: H01L33/38 ,  H01L33/62 ,  H01L27/15 ,  H01L33/00

Abstract: Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semiconductor light emitting devices can be quickly and accurately assembled on the substrate with a concern about color mixing. Here, at least one of the plurality of semiconductor light emitting devices, according to one embodiment of the present invention, comprises a bump part located in the lateral direction of a surface to be assembled. An assembly groove in which the semiconductor light emitting device including the bump part is assembled is provided with a protrusion part facing toward the inside of the assembly groove.

公开(公告)号：US20220278082A1

公开(公告)日：2022-09-01

申请号：US17632058

申请日：2019-09-03

Applicant: LG ELECTRONICS INC.

Inventor： Dohee KIM ,  Gunho KIM ,  Yongil SHIN ,  Bongchu SHIM ,  Hyunwoo CHO

IPC: H01L25/075 ,  H01L23/00

Abstract: The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.

公开(公告)号：US20210399160A1

公开(公告)日：2021-12-23

申请号：US17289549

申请日：2019-10-08

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM

IPC: H01L33/00 ,  H01L25/075

Abstract: Discussed is a self-assembly apparatus of a semiconductor light emitting device, the self-assembly apparatus including a fluid chamber configured to accommodate a plurality of semiconductor light emitting devices, each semiconductor light emitting device having a magnetic body; a magnet disposed to be spaced apart from the fluid chamber and configured to apply a magnetic force to the plurality of semiconductor light emitting devices; and a position controller connected to the magnet, and configured to control a position of the magnet; and a power supply configured to induce formation of an electric field on a substrate placed at an assembly position so that the plurality of semiconductor light emitting devices are seated at preset positions on the substrate while being moved due to a positional change of the magnet, wherein the position controller transfers the magnet in one direction while rotating the magnet about a rotation axis for the magnet.

公开(公告)号：US20200303592A1

公开(公告)日：2020-09-24

申请号：US16894262

申请日：2020-06-05

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon KIM ,  Changseo PARK ,  Bongchu SHIM ,  Byoungkwon CHO ,  Hyunwoo CHO

IPC: H01L33/38 ,  H01L33/20 ,  H01L33/40 ,  H01L33/44 ,  H01L25/075 ,  H01L33/00 ,  H01L33/62

Abstract: Discussed is a display device, including a semiconductor light emitting device and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed on an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction of the semiconductor light emitting device, wherein the first conductive semiconductor layer has a symmetrical shape with respect to at least one direction of the semiconductor light emitting device so that the first conductive electrode and the second conductive electrode are arranged at preset positions when the semiconductor light emitting device is accommodated into the receiving groove.

公开(公告)号：US20190186808A1

公开(公告)日：2019-06-20

申请号：US16321170

申请日：2017-07-27

Applicant: LG ELECTRONICS INC.

Inventor： Seungyoun KIM ,  Geunhyung LEE ,  Minjae JEONG ,  Hyunwoo CHO

IPC: F25D21/12 ,  F25D11/02 ,  F25D21/08 ,  F25B39/02

CPC classification number: F25D21/12 ,  F25B39/02 ,  F25D11/02 ,  F25D21/08 ,  F25D21/14 ,  F28D21/00 ,  Y02B30/566

Abstract: The present invention provides an evaporator comprising: an evaporator case having first and second case sheets coupled to each other and bent such that both sides of the evaporator case are open, thereby forming a box shape, a food storing space being formed inside the evaporator case; a cooling tube provided as an empty space between the first and second case sheets, thereby forming a cooling channel through which a refrigerant flows; and a heating tube formed as an empty space between the first and second case sheets so as not to overlap with the cooling tube, thereby forming a heating channel for defrosting, wherein the cooling tube and the heating tube are shaped to protrude to the outside of the evaporator case, and the evaporator case has an inner surface formed to be flat.