公开(公告)号：US20220246593A1

公开(公告)日：2022-08-04

申请号：US17616125

申请日：2019-06-11

申请人： LG ELECTRONICS INC.

发明人： Bongchu SHIM ,  Dohee KIM ,  Yongil SHIN ,  Dohwan YANG

IPC分类号： H01L25/16 ,  H01L23/00 ,  H01L33/00 ,  H01L27/12

摘要： A method for manufacturing a display device can include forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining an assembly groove in the partition wall; providing an light emitting diode (LED) having an assembly face corresponding to a shape of the assembly groove in the partition wall; and assembling the assembly face of the LED into the assembly groove in the partition wall, in which the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure.

公开(公告)号：US20230317491A1

公开(公告)日：2023-10-05

申请号：US18024371

申请日：2020-09-29

申请人： LG ELECTRONICS INC.

发明人： Kisu KIM ,  Jinhyung LEE ,  Yongil SHIN

IPC分类号： H01L21/683

CPC分类号： H01L21/6833 ,  H01L25/0753

摘要： A semiconductor light emitting diode self-assembling device according to the present invention comprises: an assembly chamber in which fluid and semiconductor light emitting diodes are received; a magnetic chuck disposed above the assembly chamber and applying, while moving in a horizontal direction, a magnetic force thereto so as to induce movement of the semiconductor light emitting diodes in the assembly chamber; a substrate chuck for placing an assembly substrate, on which the semiconductor light emitting diodes in the assembly chamber are seated, between the assembly chamber and the magnetic chuck and supporting the assembly substrate; and a control part for controlling the driving of the magnetic chuck and the substrate chuck, wherein the magnetic chuck includes: a magnetic force forming part including a plurality of magnets; and a vacuum forming part for correcting a bending phenomenon of the assembly substrate by using vacuum pressure between the plurality of magnets so as to maintain a predetermined interval between one side of the magnetic chuck and the assembly substrate.

公开(公告)号：US20230083951A1

公开(公告)日：2023-03-16

申请号：US17799080

申请日：2020-02-19

申请人： LG ELECTRONICS INC.

发明人： Dohee KIM ,  Dohwan YANG ,  Yongil SHIN

IPC分类号： H01L21/673

摘要： The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.

公开(公告)号：US20240332475A1

公开(公告)日：2024-10-03

申请号：US18697320

申请日：2021-09-30

申请人： LG ELECTRONICS INC.

发明人： Jungsub KIM ,  Changseo PARK ,  Gunho KIM ,  Yongil SHIN ,  Yoonchul KIM

IPC分类号： H01L33/62 ,  H01L25/075

CPC分类号： H01L33/62 ,  H01L25/0753

摘要： The display device includes a substrate, first assembly wiring, second assembly wiring, a partition, and first to third semiconductor light emitting devices. Each of the plurality of pixels includes first to third sub-pixels. The first to third assembly holes are located in the first to third sub-pixels. The first assembly wiring includes a first bus wiring in a plurality of pixels, and a plurality of first branch wirings branching from the first bus wiring. The second assembly wiring includes a second bus wiring in a plurality of pixels, and a plurality of second branch wirings branching from the second bus wiring. Each of the first to third semiconductor light emitting devices may be disposed in first to third assembly holes between the first bus wiring, the second bus wiring, the first branch wiring, and the second branch wiring.

公开(公告)号：US20230005888A1

公开(公告)日：2023-01-05

申请号：US17783731

申请日：2020-01-08

申请人： LG ELECTRONICS INC.

发明人： Yongil SHIN ,  Dohee KIM ,  Dohwan YANG

IPC分类号： H01L25/075 ,  H01L33/00

摘要： A semiconductor light-emitting element supply device according to an embodiment of the present invention supplies semiconductor light-emitting elements in a fluid chamber in which self-assembly occurs, the semdconductor light-emitting element supply device comprising: a tray disposed in the fluid chamber; a transfer unit which includes a magnet and a magnet accommodating part for accommodating the magnet and which transfers the semiconductor light-emitting elements by using magnetic force; a supply unit disposed above the tray to supply the transferred semiconductor light-emitting elements to the tray; and a control unit for controlling operations of the tray, the transfer unit and the supply unit, wherein the control unit controls the position of the magnet accommodated in the magnet accommodating part so that the semiconductor light-emitting elements are adhered on one surface of the magnet accommodating part or the adhered semiconductor light-emittng elements are separated from the one surface of the magnet accommodating part.

公开(公告)号：US20220367423A1

公开(公告)日：2022-11-17

申请号：US17638163

申请日：2019-09-03

申请人： LG ELECTRONICS INC.

发明人： Dohwan YANG ,  Dohee KIM ,  Yongil SHIN ,  Bongchu SHIM

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/00

摘要： A device for collecting semiconductor light emitting diodes according to an embodiment of the present disclosure includes an electromagnet portion disposed in a fluid chamber into which semiconductor light emitting diodes including a magnetic material are put to form a magnetic field when power is applied, a power supply portion connected to the electromagnet portion and applying power to the electromagnet portion, and a driving portion moving the electromagnet portion in a width direction, in a longitudinal direction, and in a height direction of the fluid chamber, in which the electromagnet portion guides the semiconductor light emitting devices to a surface on which a magnetic field is formed when power is applied.

公开(公告)号：US20230299055A1

公开(公告)日：2023-09-21

申请号：US18020608

申请日：2020-08-10

申请人： LG ELECTRONICS INC.

发明人： Changseo PARK ,  Jinhyung LEE ,  Younho HEO ,  Yongil SHIN ,  Kisu KIM

IPC分类号： H01L25/075 ,  H01L33/36 ,  H01L21/304 ,  H01L33/08 ,  H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/36 ,  H01L21/3043 ,  H01L33/08 ,  H01L33/0095

摘要： A method for manufacturing a substrate for manufacturing a display device, according to the present invention, comprises the steps of: (a) forming, at predetermined intervals, assembly electrodes extending in one direction on a base part, and forming a dielectric layer so as to cover the assembly electrodes; (b) forming, on the dielectric layer, metal patterns so as to overlap the assembly electrodes; (c) forming partition parts on the dielectric layer so as to cover the metal patterns, and then forming assembly holes so as to overlap the metal patterns; and (d) removing the metal patterns exposed through the assembly holes, wherein, in step (d), a groove part is formed on the surface of each partition part, which forms the inner surface of each assembly hole, as the metal patterns are removed.

公开(公告)号：US20230268214A1

公开(公告)日：2023-08-24

申请号：US18023998

申请日：2020-09-22

申请人： LG ELECTRONICS INC.

发明人： Yongil SHIN ,  Jinhyung LEE ,  Dohee KIM ,  Dohwan YANG ,  Kisu KIM

IPC分类号： H01L21/68

CPC分类号： H01L21/68 ,  H01L33/0093

摘要： A method for manufacturing a display device according to the present invention is characterized by comprising the steps of: supplying semiconductor light-emitting elements in a first chamber containing a fluid; disposing a distribution device, in which a plurality of magnets are arranged, on one side of the first chamber; rotating the distribution device such that the semiconductor light-emitting elements form a continuous pattern along the arrangement direction of the plurality of magnets; and stopping the distribution device such that the semiconductor light-emitting elements are distributed to a plurality of dummies, wherein in the step of stopping the distribution device, the plurality of dummies are formed at positions corresponding to the plurality of magnets.

公开(公告)号：US20230138887A1

公开(公告)日：2023-05-04

申请号：US17793896

申请日：2020-02-03

申请人： LG ELECTRONICS INC.

发明人： Dohwan YANG ,  Dohee KIM ,  Yongil SHIN

IPC分类号： H01L25/075 ,  H01L33/00

摘要： According to a semiconductor light-emitting element collecting apparatus and a semiconductor light-emitting element collecting method using the same according to an embodiment of the present invention, in order to collect semiconductor light-emitting elements, a fluid accommodated in a housing unit is rotated such that semiconductor light-emitting elements are guided to sink to a bottom surface of the housing unit, and accordingly, the semiconductor light-emitting elements can be rapidly collected. In addition, a collecting operation can be performed without exerting the physical force to the semiconductor light-emitting elements, a collecting rate of the semiconductor light-emitting elements can be improved.

公开(公告)号：US20220278082A1

公开(公告)日：2022-09-01

申请号：US17632058

申请日：2019-09-03

申请人： LG ELECTRONICS INC.

发明人： Dohee KIM ,  Gunho KIM ,  Yongil SHIN ,  Bongchu SHIM ,  Hyunwoo CHO

IPC分类号： H01L25/075 ,  H01L23/00

摘要： The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.