公开(公告)号：US20240038930A1

公开(公告)日：2024-02-01

申请号：US18266081

申请日：2020-12-09

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Gunho KIM ,  Yoonchul KIM ,  Jisoo KO

IPC: H01L33/20 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L33/20 ,  H01L25/0753 ,  H01L33/0093

Abstract: A display device according to the present invention comprises: a wiring board including a plurality of pixel areas; and semiconductor light-emitting devices disposed in the pixel areas, wherein the pixel areas include semiconductor light-emitting devices having different shapes and emitting different colors, and wherein the wiring board has two or more pixel areas having different arrangements of the semiconductor light-emitting devices. The present invention may be used as an align key when manufacturing a display device by varying the arrangement of semiconductor light-emitting devices in some pixel areas.

公开(公告)号：US20230223383A1

公开(公告)日：2023-07-13

申请号：US17928240

申请日：2020-06-01

Applicant: LG ELECTRONICS INC.

Inventor： Jisoo KO ,  Kiseong JEON ,  Gunho KIM ,  Hyeyoung YANG

IPC: H01L25/075 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L33/0093

Abstract: A display device manufacturing substrate according to the present disclosure comprises: a base part; assembly electrodes which extend in one direction and which are arranged on the base part; a dielectric layer formed on the base part to cover the assembly electrodes; a partitioning part formed on the dielectric layer; and cells which are formed in a plurality of rows and columns by means of the partitioning part, and on which semiconductor light-emitting elements are loaded, wherein the assembly electrodes extend in either the row direction or the column direction to overlap cells in the extending direction, and the assembly electrodes comprise a first assembly electrode overlapping cells that form one row or column, and a second assembly electrode simultaneously overlapping cells that form different rows or columns which are adjacent.

公开(公告)号：US20220293823A1

公开(公告)日：2022-09-15

申请号：US17633520

申请日：2019-08-21

Applicant: LG ELECTRONICS INC.

Inventor： Wonjae CHANG ,  Jisoo KO ,  Hyeyoung YANG ,  Hyunwoo CHO

IPC: H01L33/38 ,  H01L33/62 ,  H01L27/15 ,  H01L33/00

Abstract: Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semiconductor light emitting devices can be quickly and accurately assembled on the substrate with a concern about color mixing. Here, at least one of the plurality of semiconductor light emitting devices, according to one embodiment of the present invention, comprises a bump part located in the lateral direction of a surface to be assembled. An assembly groove in which the semiconductor light emitting device including the bump part is assembled is provided with a protrusion part facing toward the inside of the assembly groove.

公开(公告)号：US20220254961A1

公开(公告)日：2022-08-11

申请号：US17630320

申请日：2019-08-21

Applicant: LG ELECTRONICS INC.

Inventor： Wonjae CHANG ,  Jisoo KO ,  Hyeyoung YANG

IPC: H01L33/38 ,  H01L33/62 ,  H01L33/00 ,  H01L23/00 ,  H01L25/075

Abstract: Provided in the present specification is a novel structured semiconductor light-emitting element capable of preventing an electrode forming failure due to an arrangement error occurring during assembly or transfer of semiconductor light-emitting elements on a substrate, when a display device is implemented using the semiconductor light-emitting elements, wherein at least one of a plurality of semiconductor light-emitting elements according to one embodiment of the present disclosure comprises: a first conductive type semiconductor layer; a second conductive type semiconductor layer located on the first conductive type semiconductor layer; an active layer arranged between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a second conductive type electrode located on the second conductive type semiconductor layer; and a first conductive type electrode located on at least a one-side stepped portion of the first conductive type semiconductor layer exposed by etching a portion of the second conductive type semiconductor layer and the active layer.

公开(公告)号：US20220367774A1

公开(公告)日：2022-11-17

申请号：US17761516

申请日：2019-09-18

Applicant: LG ELECTRONICS INC.

Inventor： Myoungsoo KIM ,  Sunghyun MOON ,  Jisoo KO ,  Jungsub KIM ,  Bongchu SHIM ,  Wonjae CHANG

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/00 ,  H01L33/22 ,  H01L33/44

Abstract: Discussed is a manufacturing method of a display device. The manufacturing method includes forming a semiconductor light emitting element comprising an assembly blocking layer formed on one surface of the semiconductor light emitting element; preparing an assembly substrate comprising an assembly recess and configured such that the semiconductor light emitting element is assembled in the assembly recess; putting the semiconductor light emitting element into a chamber filled with a fluid; locating the assembly substrate on an upper surface of the chamber, and assembling the semiconductor light emitting element in the assembly recess of the assembly substrate using a magnetic field and an electric field; and transferring the semiconductor light emitting element assembled in the assembly recess of the assembly substrate to a wiring substrate.

公开(公告)号：US20190157474A1

公开(公告)日：2019-05-23

申请号：US16252162

申请日：2019-01-18

Applicant: LG ELECTRONICS INC.

Inventor： Jeongbeom NAM ,  Seunghwan SHIM ,  Jisoo KO

IPC: H01L31/0224 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0203 ,  H01L31/0747 ,  H01L31/05

Abstract: A solar cell includes a conductive area including first and second conductive areas on one surface of a semiconductor substrate, a passivation film having opening and an electrode including a first electrode connected to the first conductive area and a second electrode connected to the second conductive area, the electrode including an adhesive layer on the semiconductor substrate or the conductive area, an electrode layer on the adhesive layer and including a metal, and a barrier layer disposed on the electrode layer and including a metal that is different from the metal of the electrode layer, the electrode layer having a thickness greater than a thickness of each of the adhesive layer and the barrier layer, a width of the electrode layer being larger than a width of the opening, and the barrier layer having a higher melting point than a melting point of the electrode layer.

公开(公告)号：US20220319892A1

公开(公告)日：2022-10-06

申请号：US17628776

申请日：2020-02-11

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo CHO ,  Bongchu SHIM ,  Hyeyoung YANG ,  Jisoo KO ,  Wonjae CHANG

IPC: H01L21/68 ,  H01L21/683

Abstract: The present invention provides an assembly substrate used in a method for manufacturing a display device which mounts semiconductor light emitting devices on a predetermined position of an assembly substrate by using an electric field and a magnetic field. Specifically, the assembly substrate is characterized by comprising: a base part; a plurality of assembly electrodes formed extending in one direction and disposed on the base part; a dielectric layer laminated on the base part so as to cover the assembly electrodes; a partition wall formed on the base part and including a plurality of grooves for guiding the semiconductor light emitting devices to a predetermined position; and a metal shielding layer formed on the base part, wherein each of the plurality of grooves penetrates the partition wall so as to form a seating surface on which the guided light emitting devices are seated, and the metal shielding layer overlaps with a part of the seating surface such that an electric field formed on a part of the seating surface is shielded.

公开(公告)号：US20180182905A1

公开(公告)日：2018-06-28

申请号：US15849060

申请日：2017-12-20

Applicant: LG Electronics Inc.

Inventor： Jeongbeom NAM ,  Joohyun KOH ,  Jisoo KO ,  Dohwan YANG

IPC: H01L31/0216 ,  H01L31/0224 ,  H01L31/18 ,  H01L31/0236

CPC classification number: H01L31/02167 ,  H01L31/022441 ,  H01L31/02363 ,  H01L31/0352 ,  H01L31/0516 ,  H01L31/0745 ,  H01L31/0747 ,  H01L31/1868 ,  Y02E10/50 ,  Y02P70/521

Abstract: Disclosed is a solar cell including a plurality of first electrodes electrically connected to a plurality of first conductive regions; and a plurality of second electrodes electrically connected to a plurality of second conductive regions. The plurality of first conductive regions and the plurality of second conductive regions are spaced apart from an edge of a semiconductor substrate by a first interval, the plurality of first conductive regions and the plurality of second conductive regions are spaced apart from each other in a second direction crossing a first direction by a second interval, and the second interval is the same as or less than the first interval.

公开(公告)号：US20170033242A1

公开(公告)日：2017-02-02

申请号：US15220172

申请日：2016-07-26

Applicant: LG ELECTRONICS INC.

Inventor： Jeongbeom NAM ,  Seunghwan SHIM ,  Jisoo KO

IPC: H01L31/0224 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/02

CPC classification number: H01L31/022425 ,  H01L31/02008 ,  H01L31/0203 ,  H01L31/022441 ,  H01L31/0516 ,  H01L31/0747 ,  H01L31/1804 ,  Y02E10/50

Abstract: Disclosed is a solar cell including a semiconductor substrate, a conductive area including first and second conductive areas disposed on one surface of the semiconductor substrate, and an electrode including a first electrode connected to the first conductive area and a second electrode connected to the second conductive area. The electrode includes an adhesive layer disposed on the semiconductor substrate or the conductive area, an electrode layer disposed on the adhesive layer and including a metal as a main component, and a barrier layer disposed on the electrode layer and including a metal that is different from the metal of the electrode layer as a main component. The electrode layer has a thickness greater than a thickness of each of the adhesive layer and the barrier layer, and the barrier layer has a higher melting point than a melting point of the electrode layer.

Abstract translation: 公开了一种包括半导体衬底的太阳能电池，包括设置在半导体衬底的一个表面上的第一和第二导电区域的导电区域，以及包括连接到第一导电区域的第一电极和连接到第二导电区域的第二电极的电极 区。 所述电极包括设置在所述半导体基板或所述导电区域上的粘合剂层，设置在所述粘合剂层上并且包括金属作为主要成分的电极层，以及设置在所述电极层上的包含不同于 电极层的金属为主要成分。 电极层的厚度大于粘合剂层和阻挡层的厚度，阻挡层的熔点高于电极层的熔点。

公开(公告)号：US20240379911A1

公开(公告)日：2024-11-14

申请号：US18687208

申请日：2021-09-06

Applicant: LG ELECTRONICS INC. ,  LG DISPLAY CO., LTD.

Inventor： Jisoo KO ,  Minwoo LEE ,  Seongmin MOON ,  Junho SUNG

IPC: H01L33/48 ,  H01L25/075 ,  H01L25/16 ,  H01L33/62

Abstract: The display device may include a substrate having a plurality of assembly areas and non-assembly areas, a first partition arranged on a plurality of assembly areas and having an assembly hole, a second partition disposed on the non-assembly areas and a semiconductor light emitting device in the assembly hole, wherein a thickness of the second partition is greater than the thickness of the first partition.